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Volume 47; Issue 2-3
Main
Microelectronics Reliability
Volume 47; Issue 2-3
Microelectronics Reliability
Volume 47; Issue 2-3
1
Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel
J. Tardy
,
M. Erouel
,
A.L. Deman
,
A. Gagnaire
,
V. Teodorescu
,
M.G. Blanchin
,
B. Canut
,
A. Barau
,
M. Zaharescu
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 363 KB
Your tags:
english, 2007
2
Thermal simulation of UV laser ablation of polyimide
Péter Gordon
,
Bálint Balogh
,
Bálint Sinkovics
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 374 KB
Your tags:
english, 2007
3
Isotropic conductive adhesives: Future trends, possibilities and risks
James E. Morris
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 97 KB
Your tags:
english, 2007
4
Inkjettable conductive adhesive for use in microelectronics and microsystems technology
Jana Kolbe
,
Andreas Arp
,
Francesco Calderone
,
Edouard Marc Meyer
,
Wilhelm Meyer
,
Helmut Schaefer
,
Manuela Stuve
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 440 KB
Your tags:
english, 2007
5
Numerical approach to characterization of thermally conductive adhesives
Tomasz Fałat
,
Artur Wymysłowski
,
Jana Kolbe
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 989 KB
Your tags:
english, 2007
6
Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices
Z. Khatir
,
S. Lefebvre
,
F. Saint-Eve
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.03 MB
Your tags:
english, 2007
7
Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs
Hamid R. Zarandi
,
Seyed Ghassem Miremadi
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 232 KB
Your tags:
english, 2007
8
Dynamic responses and solder joint reliability under board level drop test
Jing-en Luan
,
Tong Yan Tee
,
Eric Pek
,
Chwee Teck Lim
,
Zhaowei Zhong
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.15 MB
Your tags:
english, 2007
9
Investigations of the influence of dicing techniques on the strength properties of thin silicon
Stephan Schoenfelder
,
Matthias Ebert
,
Christof Landesberger
,
Karlheinz Bock
,
Jörg Bagdahn
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 914 KB
Your tags:
english, 2007
10
Analysis of Cu/low-k bond pad delamination by using a novel failure index
M.A.J. van Gils
,
O. van der Sluis
,
G.Q. Zhang
,
J.H.J. Janssen
,
R.M.J. Voncken
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 845 KB
Your tags:
english, 2007
11
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology
Chang-Chun Lee
,
Chien-Chen Lee
,
Hsiao-Tung Ku
,
Shu-Ming Chang
,
Kuo-Ning Chiang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.41 MB
Your tags:
english, 2007
12
Advanced structural similarity rules for the BGA package family
W.D. van Driel
,
A. Mavinkurve
,
M.A.J. van Gils
,
G.Q. Zhang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.58 MB
Your tags:
english, 2007
13
Creep of thermally aged SnAgCu-solder joints
S. Wiese
,
K.-J. Wolter
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.50 MB
Your tags:
english, 2007
14
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Mike Roellig
,
Rainer Dudek
,
Steffen Wiese
,
Bjoern Boehme
,
Berhard Wunderle
,
Klaus-Juergen Wolter
,
Bernd Michel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.15 MB
Your tags:
english, 2007
15
FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress–voiding
S. Orain
,
J.-C. Barbé
,
X. Federspiel
,
P. Legallo
,
H. Jaouen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2007
16
Reliability of SnPb and Pb-free flip–chips under different test conditions
M. Spraul
,
W. Nüchter
,
A. Möller
,
B. Wunderle
,
B. Michel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 573 KB
Your tags:
english, 2007
17
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems
Artur Wymysłowski
,
Bart Vandevelde
,
Dag Andersson
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 79 KB
Your tags:
english, 2007
18
Novel shear tools for viscoelastic characterization of packaging polymers
C. van’t Hof
,
K.M.B. Jansen
,
G. Wisse
,
L.J. Ernst
,
D.G. Yang
,
G.Q. Zhang
,
H.J.L. Bressers
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 301 KB
Your tags:
english, 2007
19
Numerical modeling of warpage induced in QFN array molding process
D.G. Yang
,
K.M.B. Jansen
,
L.J. Ernst
,
G.Q. Zhang
,
W.D. van Driel
,
H.J.L. Bressers
,
J.H.J. Janssen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.24 MB
Your tags:
english, 2007
20
Problems of PCB microvias filling by conductive paste
Ryszard Kisiel
,
Jan Felba
,
Janusz Borecki
,
Andrzej Moscicki
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 586 KB
Your tags:
english, 2007
21
Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides
W.W. Abadeer
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 936 KB
Your tags:
english, 2007
22
Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2–2.3 nm) oxides
C. Petit
,
D. Zander
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 522 KB
Your tags:
english, 2007
23
Reliability assessment of the metallized film capacitors from degradation data
Jianyin Zhao
,
Fang Liu
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 293 KB
Your tags:
english, 2007
24
A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs
T.K. Chiang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 215 KB
Your tags:
english, 2007
25
Influence of substrate thickness on thermal impedance of microelectronic structures
B. Vermeersch
,
G. De Mey
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 581 KB
Your tags:
english, 2007
26
Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000 °C and temperature for minimum low-K interfacial oxide for high-K dielectric on Si
W.S. Lau
,
P.W. Qian
,
Taejoon Han
,
Nathan P. Sandler
,
S.T. Che
,
S.E. Ang
,
C.H. Tung
,
T.T. Sheng
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 178 KB
Your tags:
english, 2007
27
A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies
F. Cacho
,
S. Orain
,
G. Cailletaud
,
H. Jaouen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 532 KB
Your tags:
english, 2007
28
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Nele Van Steenberge
,
Paresh Limaye
,
Geert Willems
,
Bart Vandevelde
,
Inge Schildermans
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2007
29
Carbon/polyesterimide thick-film resistive composites – Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties
Andrzej Dziedzic
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 399 KB
Your tags:
english, 2007
30
Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards
Marika P. Immonen
,
Mikko Karppinen
,
Jorma K. Kivilahti
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.00 MB
Your tags:
english, 2007
31
Polytronic 2005
Andrzej Dziedzic
,
Jan Felba
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 70 KB
Your tags:
english, 2007
32
Low-distortion 4th order programmable Butterworth filter
M. Teresa Sanz
,
Santiago Celma
,
Belén Calvo
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 275 KB
Your tags:
english, 2007
33
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections
J.W.C. de Vries
,
M.Y. Jansen
,
W.D. van Driel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 407 KB
Your tags:
english, 2007
34
Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy
You-Lin Wu
,
Shi-Tin Lin
,
Tsung-Min Chang
,
Juin J. Liou
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 114 KB
Your tags:
english, 2007
35
Performance trends of Si-based RF transistors
F. Schwierz
,
C. Schippel
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 186 KB
Your tags:
english, 2007
36
A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer
X. Zou
,
J.P. Xu
,
C.X. Li
,
P.T. Lai
,
W.B. Chen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 177 KB
Your tags:
english, 2007
37
Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability
A. Wymysłowski
,
W.D. van Driel
,
J. van de Peer
,
N. Tzannetakis
,
G.Q. Zhang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.14 MB
Your tags:
english, 2007
38
Application of simulation-based decision making in product development of an RF module
Mats Lindgren
,
Ilja Belov
,
Magnus Törnvall
,
Peter Leisner
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 259 KB
Your tags:
english, 2007
39
Virtual qualification of moisture induced failures of advanced packages
M.A.J. van Gils
,
W.D. van Driel
,
G.Q. Zhang
,
H.J.L. Bressers
,
R.B.R. van Silfhout
,
X.J. Fan
,
J.H.J. Janssen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 876 KB
Your tags:
english, 2007
40
Dynamic void formation in a DD-copper-structure with different metallization geometry
Kirsten Weide-Zaage
,
David Dalleau
,
Yves Danto
,
Helene Fremont
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.72 MB
Your tags:
english, 2007
41
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints
C. Andersson
,
D.R. Andersson
,
P.E. Tegehall
,
J. Liu
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.39 MB
Your tags:
english, 2007
42
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
D.G. Yang
,
K.M.B. Jansen
,
L.J. Ernst
,
G.Q. Zhang
,
H.J.L. Bressers
,
J.H.J. Janssen
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 279 KB
Your tags:
english, 2007
43
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques
V. Gonda
,
K.M.B. Jansen
,
L.J. Ernst
,
J. den Toonder
,
G.Q. Zhang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 273 KB
Your tags:
english, 2007
44
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages
Bart Vandevelde
,
Mario Gonzalez
,
Paresh Limaye
,
Petar Ratchev
,
Eric Beyne
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 1.03 MB
Your tags:
english, 2007
45
Correlation between chemistry of polymer building blocks and microelectronics reliability
H.J.L. Bressers
,
W.D. van Driel
,
K.M.B. Jansen
,
L.J. Ernst
,
G.Q. Zhang
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 161 KB
Your tags:
english, 2007
46
Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction
Kazufumi Watanabe
,
Akinobu Teramoto
,
Rihito Kuroda
,
Shigetoshi Sugawa
,
Tadahiro Ohmi
Journal:
Microelectronics Reliability
Year:
2007
Language:
english
File:
PDF, 347 KB
Your tags:
english, 2007
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