Low-cost preparation method for exposing IC surfaces in...

Microelectronics Reliability 2008 / 8 Vol. 48; Iss. 8-9

Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting

Martens, S., Krueger, B., Mack, W., Voelklein, F., Wilde, J.
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Volume:
48
Language:
english
Pages:
4
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2008.06.033
Date:
August, 2008
File:
PDF, 1.08 MB
english, 2008
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