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Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
V. Born, M. Beck, O. Bosholm, D. Dalleau, S. Glenz, I. Haverkamp, G. Kurz, F. Lange, A. VestVolume:
49
Year:
2009
Language:
english
Pages:
5
DOI:
10.1016/j.microrel.2008.10.017
File:
PDF, 377 KB
english, 2009