Reliability of lead-free solder in power module with...

Microelectronics Reliability 2009 Vol. 49; Iss. 6

Reliability of lead-free solder in power module with stochastic uncertainty

A. Micol, C. Martin, O. Dalverny, M. Mermet-Guyennet, M. Karama
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Volume:
49
Year:
2009
Language:
english
Pages:
11
DOI:
10.1016/j.microrel.2009.02.025
File:
PDF, 1.64 MB
english, 2009
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