Volume 49; Issue 6

Microelectronics Reliability

Volume 49; Issue 6
1

Stability of solid electrolyte based thick-film CO2 sensors

C. Belda, M. Fritsch, C. Feller, D. Westphal, G. Jung
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 745 KB
english, 2009
5

Die-attachment solutions for SiC power devices

R. Kisiel, Z. Szczepański
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 140 KB
english, 2009
6

Microvaristors in thick-film and LTCC circuits

Edward Miś, Andrzej Dziedzic, Witold Mielcarek
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 684 KB
english, 2009
9

Tin whisker growth on bulk Sn–Pb eutectic doping with Nd

Meng Liu, Ai-Ping Xian
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 654 KB
english, 2009
10

Inside front cover - Editorial board

Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 41 KB
english, 2009
11

Calendar

Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 47 KB
english, 2009
12

Miniaturised multi-MEMS sensor development

Mathieu Hautefeuille, Brendan O’Flynn, Frank Peters, Conor O’Mahony
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 657 KB
english, 2009
14

Board level investigation of BGA solder joint deformation strength

B. Sinkovics, O. Krammer
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 1.07 MB
english, 2009
18

IMAPS–CPMT Poland 2008 – Guest Editorial

Andrzej Dziedzic
Journal:
Microelectronics Reliability
Year:
2009
Language:
english
File:
PDF, 98 KB
english, 2009