Solder interconnect reliability under drop impact loading...

Microelectronics Reliability 2009 Vol. 49; Iss. 8

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

J.J.M. Zaal, H.P. Hochstenbach, W.D. van Driel, G.Q. Zhang
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Volume:
49
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.microrel.2009.03.008
File:
PDF, 1.14 MB
english, 2009
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