A brief review of selected aspects of the materials science...

Microelectronics Reliability 2010 Vol. 50; Iss. 1

A brief review of selected aspects of the materials science of ball bonding

C.D. Breach, F.W. Wulff
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Volume:
50
Year:
2010
Language:
english
Pages:
20
DOI:
10.1016/j.microrel.2009.08.003
File:
PDF, 3.38 MB
english, 2010
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