New dummy design and stiffener on warpage reduction in Ball...

Microelectronics Reliability 2010 Vol. 50; Iss. 2

New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board

Seunghyun Cho, Tae-Eun Chang, Joseph Y. Lee, Hyung-Pil Park, Youngbae Ko, GyunMyoung Park
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Volume:
50
Year:
2010
Language:
english
Pages:
9
DOI:
10.1016/j.microrel.2009.10.009
File:
PDF, 4.63 MB
english, 2010
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