Volume 50; Issue 2

Microelectronics Reliability

Volume 50; Issue 2
2

Parameter selection for health monitoring of electronic products

Sachin Kumar, Eli Dolev, Michael Pecht
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 790 KB
english, 2010
3

Electromigration behavior in Cu/Sn–8Zn–3Bi/Cu solder joint

Lijuan Liu, Wei Zhou, Hongbo Zhang, Baoling Li, Ping Wu
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 715 KB
english, 2010
6

Design of a fully CMOS compatible 3-μm size color pixel

G. Langfelder
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 540 KB
english, 2010
9

Improved method for determining the shear strength of chip component solder joints

O. Krammer, B. Sinkovics
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 1.12 MB
english, 2010
10

Address generators for linear systolic array

M.K. Stojčev, I.Ž. Milovanović, E.I. Milovanović, T.R. Nikolić
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 1.35 MB
english, 2010
11

Accelerated testing for failures of tantalum capacitors

J. Virkki, T. Seppälä, L. Frisk, P. Heino
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 307 KB
english, 2010
16

Inside front cover - Editorial board

Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 41 KB
english, 2010
17

Calendar

Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 45 KB
english, 2010
21

Assessment of ultra-thin Si wafer thickness in 3D wafer stacking

Eun-Kyung Kim
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 480 KB
english, 2010
22

Simulation and modelling of VDMOSFET self protection under TLP-stress

Martin Sauter, Joost Willemen
Journal:
Microelectronics Reliability
Year:
2010
Language:
english
File:
PDF, 866 KB
english, 2010