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Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates
Asit Kumar Gain, Y.C. Chan, Winco K.C. YungVolume:
51
Year:
2011
Language:
english
Pages:
10
DOI:
10.1016/j.microrel.2011.01.006
File:
PDF, 2.82 MB
english, 2011