Sacrificial CVD film etch-back process for air-gap Cu...

Thin Solid Films 2007 Vol. 515; Iss. 12

Sacrificial CVD film etch-back process for air-gap Cu interconnects

Shoichi Uno, Kiyomi Katsuyama, Junji Noguchi, Kiyohiko Sato, Takayuki Oshima, Masanori Katsuyama, Kazusato Hara
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Volume:
515
Year:
2007
Language:
english
Pages:
6
DOI:
10.1016/j.tsf.2006.10.068
File:
PDF, 1.06 MB
english, 2007
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