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A grain structure based statistical simulation of electromigration damage in chip level interconnect lines
T.M. Korhonen, D.D. Brown, M.A. KorhonenVolume:
40
Year:
2000
Language:
english
Pages:
8
DOI:
10.1016/s0026-2714(00)00193-1
File:
PDF, 233 KB
english, 2000