Characterization method of thermomechanical parameters for...

Microelectronics Reliability 2002 Vol. 42; Iss. 7

Characterization method of thermomechanical parameters for microelectronic materials

O. Perat, J.M. Dorkel, E. Scheid, P. Temple Boyer, Y.S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi
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Volume:
42
Year:
2002
Language:
english
Pages:
6
DOI:
10.1016/s0026-2714(02)00060-4
File:
PDF, 247 KB
english, 2002
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