Effect of voids on the reliability of BGA/CSP solder joints

Microelectronics Reliability 2003 Vol. 43; Iss. 12

Effect of voids on the reliability of BGA/CSP solder joints

Mohammad Yunus, K. Srihari, J.M. Pitarresi, Anthony Primavera
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Volume:
43
Year:
2003
Language:
english
Pages:
10
DOI:
10.1016/s0026-2714(03)00124-0
File:
PDF, 752 KB
english, 2003
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