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A hi-density C4/CBGA interconnect technology for a CMOS microprocessor : Gary B. Kromann, R. David Gerke and Wayne Wei-Xu Huang. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 166 (1996)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87733-5
File:
PDF, 144 KB
english, 1997