A hi-density C4/CBGA interconnect technology for a CMOS microprocessor : Gary B. Kromann, R. David Gerke and Wayne Wei-Xu Huang. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 166 (1996)

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.