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Damage to substrates during SiO2 etching: opportunities of subsequent removal by optimized cleaning procedures : H. H. Richter, A. Wolff, K. Blum, K. Hoeppner, D. Kruger and R. Sorge. Vacuum, 47 (5), 437 (1996)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87737-2
File:
PDF, 144 KB
english, 1997