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New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules : Shinji Koike, Fusao Shimokawa, Tohru Matsurra and Hideyuki Takahara. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part B, 19 (1), 124 (1996)
Volume:
37
Year:
1997
Language:
english
DOI:
10.1016/s0026-2714(97)87756-6
File:
PDF, 144 KB
english, 1997