Volume 4; Issue 2

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Journal of Low Power Electronics and Applications
Volume 4; Issue 2

Journal of Low Power Electronics and Applications

Volume 4; Issue 2

1

Analysis of Threshold Voltage Flexibility in Ultrathin-BOX SOI FinFETs

Endo, Kazuhiko, Migita, Shinji, Ishikawa, Yuki, Matsukawa, Takashi, O'uchi, Shin-ichi, Tsukada, Junji, Mizubayashi, Wataru, Morita, Yukinori, Ota, Hiroyuki, Yamauchi, Hitomi, Masahara, Meishoku

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 859 KB

english, 2014

2

Ultralow-Power SOTB CMOS Technology Operating Down to 0.4 V

Sugii, Nobuyuki, Yamamoto, Yoshiki, Makiyama, Hideki, Yamashita, Tomohiro, Oda, Hidekazu, Kamohara, Shiro, Yamaguchi, Yasuo, Ishibashi, Koichiro, Mizutani, Tomoko, Hiramoto, Toshiro

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 441 KB

english, 2014

3

A Practical Framework to Study Low-Power Scheduling Algorithms on Real-Time and Embedded Systems

Lin, Jian, Cheng, Albert, Song, Wei

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 2.92 MB

english, 2014

4

An Ultra-Low Energy Subthreshold SRAM Bitcell for Energy Constrained Biomedical Applications

Banerjee, Arijit, Calhoun, Benton

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 1.17 MB

english, 2014

5

MOS Current Mode Logic Near Threshold Circuits

Shapiro, Alexander, Friedman, Eby

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 469 KB

english, 2014

6

Comparative Study of Charge Trapping Type SOI-FinFET Flash Memories with Different Blocking Layer Materials

Liu, Yongxun, Nabatame, Toshihide, Matsukawa, Takashi, Endo, Kazuhiko, O'uchi, Shinichi, Tsukada, Junichi, Yamauchi, Hiromi, Ishikawa, Yuki, Mizubayashi, Wataru, Morita, Yukinori, Migita, Shinji, Ota,

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 1.32 MB

english, 2014

7

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology

Batra, Pooja, Skordas, Spyridon, LaTulipe, Douglas, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal, Golz, John, Lin, Wei, Vo, Tuan, Priyadarshini,

Journal:

Journal of Low Power Electronics and Applications

Year:

2014

Language:

english

File:

PDF, 1.09 MB

english, 2014