Volume 139

Microelectronic Engineering

Volume 139

1

Fabrication of plasmonic nanopillar arrays based on nanoforming

Li, Zhenxing, Dao, Thang Duy, Nagao, Tadaaki, Terano, Motoki, Yoshino, Masahiko

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.66 MB

english, 2015

2

Controllable trajectory of inertial focusing in microfluidics

Yang, Dianshen, Zou, Heng, Zhong, Weiliang, Xu, Tao

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.36 MB

english, 2015

3

Light output enhancement of GaN-based light-emitting diodes by maskless surface roughening

Yang, Yibin, Ren, Yuan, Chen, Yangxiang, Liu, Minggang, Chen, Weijie, Han, Xiaobiao, Lin, Xiuqi, Liao, Qiang, Zang, Wenjie, Luo, Hui, Lin, Jiali, Wu, Zhisheng, Liu, Yang, Zhang, Baijun

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.13 MB

english, 2015

4

One-pot synthesis of Mn3O4-decorated GaN nanowires for drastic changes in magnetic and gas-sensing properties

Kim, Hyoun Woo, Kwon, Yong Jung, Na, Han Gil, Cho, Hong Yeon, Lee, Chongmu, Jung, Jong Hoon

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 3.58 MB

english, 2015

5

Homogeneous NiSi1−xGex layer formation on strained SiGe with ultrathin Ni layers

Liu, Linjie, Knoll, Lars, Wirths, Stephan, Xu, Dawei, Mussler, Gregor, Breuer, Uwe, Holländer, Bernhard, Di, Zengfeng, Zhang, Miao, Mantl, Siegfried, Zhao, Qing-Tai

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 2.03 MB

english, 2015

6

A single-side microcavity–diaphragm–channel one-step formation method for low-cost and high-yield volume production of micro flow sensors

Song, Fang, Wang, Jiachou

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.73 MB

english, 2015

7

Plasmonic ‘top-hat’ nano-star arrays by electron beam lithography

Zhu, Shaoli, Cheng, Han-Hao, Blakey, Idriss, Stokes, Nicholas, Ostrikov, Kostya (Ken), Cortie, Michael

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 3.49 MB

english, 2015

8

Effects of stress on resistive switching property of the NiO RRAM device

Ma, Guokun, Tang, Xiaoli, Zhang, Huaiwu, Zhong, Zhiyong, Li, Jie, Su, Hua

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 578 KB

english, 2015

9

EWOD using nonaqueous liquids

Ahmadi, Maziar, Bermejo, Sandra, Castañer, Luis

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 1.10 MB

english, 2015

10

Optimization of through silicon via for three-dimensional integration

Du, Li, Shi, Tielin, Chen, Pengfei, Su, Lei, Shen, Junjie, Shao, Jie, Liao, Guanglan

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 2.62 MB

english, 2015

11

Through silicon via profile metrology of Bosch etching process based on spectroscopic reflectometry

Fursenko, O., Bauer, J., Marschmeyer, S., Stoll, H.-P.

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 838 KB

english, 2015

12

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 29 KB

english, 2015

13

Micropiercing of titanium foil by a roll press method

Fukuyama, Ryo, Taniguchi, Jun, Yoshikawa, Kenichi, Yagishita, Hiroyuki

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 2.13 MB

english, 2015

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