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Volume 228
Main
Microelectronic Engineering
Volume 228
Microelectronic Engineering
Volume 228
1
Effect of deposition angle on fabrication of plasmonic gold nanocones and nanodiscs
LiÅ¡ka, JiÅÃ
,
Ligmajer, Filip
,
Pinho N., Pedro V.
,
KejÃk, Lukáš
,
Kvapil, Michal
,
DvoÅák, Petr
,
Horký, Michal
,
Leitner, Nikolaus S.
,
Reimhult, Erik
,
Šikola, Tomáš
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 4.08 MB
Your tags:
2020
2
The investigation of electrothermal response and reliability of flexible graphene micro-heaters
Wang, Chien-Ping
,
Hsiao, Ming-Hung
,
Lee, Guo-Hua
,
Chang, Tien-Li
,
Lee, Ya-Wei
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 2.07 MB
Your tags:
2020
3
Technology and optimization of hafnium oxynitride (HfOxNy) thin-films formed by pulsed-DC reactive magnetron sputtering for MIS devices
Puźniak, MirosÅaw
,
Gajewski, Wojtek
,
Żelechowski, Marcin
,
Jamroz, Jan
,
Gertych, Arkadiusz
,
Zdrojek, Mariusz
,
MroczyÅski, Robert
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 2.88 MB
Your tags:
2020
4
XPS study of a selective GaN etching process using self-limiting cyclic approach for power devices application
Le Roux, Frédéric
,
Possémé, Nicolas
,
Burtin, Pauline
,
Barnola, Sébastien
,
Torres, Alphonse
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 1.26 MB
Your tags:
2020
5
Fabrication method of micro RF coaxial transmitter on metal substrate combining positive and negative photoresist processes
Du, Liqun
,
Wang, Shuxuan
,
Zhang, Xi
,
Du, Chengquan
,
Zhao, Ming
,
Li, Yuanqi
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 1.22 MB
Your tags:
2020
6
Editorial Board
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 29 KB
Your tags:
2020
7
Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
Roshanghias, Ali
,
Rodrigues, Augusto Daniel
,
Holzmann, Dominik
Journal:
Microelectronic Engineering
Year:
2020
File:
PDF, 2.48 MB
Your tags:
2020
1
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