Microelectronic Engineering

1

Challenges for structural stability of ultra-low-k-based interconnects

F Iacopi, S.H Brongersma, B Vandevelde, M O'Toole, D Degryse, Y Travaly, K Maex

Journal:

Year:

2004

Language:

english

File:

PDF, 469 KB

english, 2004

2

Morphology, microstructure, and mechanical properties of a copper electrodeposit

D.T Read, Y.W Cheng, R Geiss

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 431 KB

english, 2004

3

Surface oxide evolution on Al–Si bond wires for high-power RF applications

W Qin, R Doyle, T Scharr, M Shah, M Kottke, G Chen, D Theodore

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 334 KB

english, 2004

4

Mechanical characterization of low-k dielectric materials using nanoindentation

R.J Nay, O.L Warren, D Yang, T.J Wyrobek

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 685 KB

english, 2004

5

Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect

R.I Barabash, G.E Ice, N Tamura, B.C Valek, J.C Bravman, R Spolenak, J.R Patel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 294 KB

english, 2004

6

Dielectrophoretic assembly and integration of nanowire devices with functional CMOS operating circuitry

S. Evoy, N. DiLello, V. Deshpande, A. Narayanan, H. Liu, M. Riegelman, B.R. Martin, B. Hailer, J.-C. Bradley, W. Weiss, T.S. Mayer, Y. Gogotsi, H.H. Bau, T.E. Mallouk, S. Raman

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 487 KB

english, 2004

7

Coulomb interaction energy in optical and quantum computing applications of self-assembled quantum dots

R. Bose, H.T. Johnson

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 308 KB

english, 2004

8

A cohesive zone model for low cycle fatigue life prediction of solder joints

Q.D Yang, D.J Shim, S.M Spearing

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 391 KB

english, 2004

9

EBSD measurement of strains in GaAs due to oxidation of buried AlGaAs layers

R.R Keller, A Roshko, R.H Geiss, K.A Bertness, T.P Quinn

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 355 KB

english, 2004

10

X-ray microdiffraction: local stress distributions in polycrystalline and epitaxial thin films

M.A Phillips, R Spolenak, N Tamura, W.L Brown, A.A MacDowell, R.S Celestre, H.A Padmore, B.W Batterman, E Arzt, J.R Patel

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 635 KB

english, 2004

11

FIB failure analysis of memory arrays

Alex A Volinsky, Larry Rice, Wentao Qin, N David Theodore

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 671 KB

english, 2004

12

Editorial board

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 15 KB

english, 2004

13

High strain behavior of composite thin film piezoelectric membranes

I. Demir, A.L. Olson, J.L. Skinner, C.D. Richards, R.F. Richards, D.F. Bahr

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 402 KB

english, 2004

15

Effect of organic additives on structure, resistivity, and room-temperature recrystallization of electrodeposited copper

V.A Vas'ko, I Tabakovic, S.C Riemer, M.T Kief

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 217 KB

english, 2004

16

Dynamics of nanoscale self-assembly of ternary epilayers

Wei Lu, Dongchoul Kim

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 375 KB

english, 2004

17