Volume 28; Issue 3

Microelectronics Journal

Volume 28; Issue 3
1

Thermal investigations of ICs and microstructures

Year:
1997
Language:
english
File:
PDF, 232 KB
english, 1997
3

A method for tightly coupled thermal-electrical simulation

Year:
1997
Language:
english
File:
PDF, 443 KB
english, 1997
4

Electro-thermal simulation: a realization by simultaneous iteration

Year:
1997
Language:
english
File:
PDF, 1.25 MB
english, 1997
5

A new evaluation method of thermal transient measurement results

Year:
1997
Language:
english
File:
PDF, 1.10 MB
english, 1997
8

Thermal investigation of monolithic structures

Year:
1997
Language:
english
File:
PDF, 684 KB
english, 1997
10

Author index

Year:
1997
File:
PDF, 34 KB
1997
16

Taxis by satellite

Year:
1997
Language:
english
File:
PDF, 79 KB
english, 1997
17

New backside technology breaks inspectability barrier for high speed devices

Year:
1997
Language:
english
File:
PDF, 156 KB
english, 1997
18

Philips new fab MOS4YOU

Year:
1997
Language:
english
File:
PDF, 170 KB
english, 1997
20

SRDC acquires Metaphase Technology Inc.

Year:
1997
Language:
english
File:
PDF, 93 KB
english, 1997
21

Cypress introduces the first deep synchronous FIFO to industry standard pinouts

Year:
1997
Language:
english
File:
PDF, 72 KB
english, 1997
22

Two new contracts for Cognex

Year:
1997
Language:
english
File:
PDF, 154 KB
english, 1997
24

IBM Paris chooses Edwards for 16MB line

Year:
1997
Language:
english
File:
PDF, 85 KB
english, 1997
25

Beating vibration problems in a clean room environment

Year:
1997
Language:
english
File:
PDF, 85 KB
english, 1997
26

Daimler-Benz heterostructural bipolar transistors

Year:
1997
Language:
english
File:
PDF, 53 KB
english, 1997
27

New applications of advanced thin film measurement by Spectroscopic Ellipsometry

Year:
1997
Language:
english
File:
PDF, 248 KB
english, 1997
28

Philips continues to pioneer USB technology with the launch of the USB hub IC

Year:
1997
Language:
english
File:
PDF, 116 KB
english, 1997
30

Data visualization software helps engineers and scientists be more productive

Year:
1997
Language:
english
File:
PDF, 144 KB
english, 1997
31

The SLAN - A new microwave plasma source

Year:
1997
Language:
english
File:
PDF, 348 KB
english, 1997
32

Deep Si etch with ICP cryo-RIE

Year:
1997
Language:
english
File:
PDF, 54 KB
english, 1997
33

Thermal simulation of semiconductor ICs: general and practical approach

Year:
1997
Language:
english
File:
PDF, 402 KB
english, 1997
34

Validation of numerical models of ceramic pin grid array packages

Year:
1997
Language:
english
File:
PDF, 614 KB
english, 1997
40

Semiconductor sensors: S.M. Sze (ed.), John Wiley & Sons, New York, 1994

Year:
1997
Language:
english
File:
PDF, 87 KB
english, 1997
41

Editorial: KGD, MCMs and parasitics

Year:
1997
Language:
english
File:
PDF, 94 KB
english, 1997