Volume 29; Issue 4

Microelectronics Reliability

Volume 29; Issue 4

1

Calendar of international conferences, symposia, lectures and meetings of interest

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 184 KB

english, 1989

2

Publications, notices, calls for papers, etc.

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 651 KB

english, 1989

3

Society of reliability engineers newsletter

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

4

Memo to all Indian authors

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 25 KB

english, 1989

5

Comment on “study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices”: T. Wadaet al., Microelectron. Reliab.28, 813–820 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 46 KB

english, 1989

6

Overall reliability evaluation of hierarchical computer networks with dynamic behaviour

J.M. Kontoleon, D. Mandaltsis

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 349 KB

english, 1989

7

Stochastic analysis of a two-unit priority cold standby redundant system with administrative delay in repair

J.P. Singh Joorel

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 193 KB

english, 1989

8

Stochastic analysis of a 2-unit standby system with two failure modes and slow switch

L.R. Goel, S.C. Sharma

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 275 KB

english, 1989

9

Correlation between fabrication processes and thermal distribution in medium power MESFETs

C. Canali, F. Chiussi, G. Donzelli, F. Magistrali, M. Merletti, E. Zanoni

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 1.32 MB

english, 1989

10

First uptime and downtime joint distribution of a duplication system with random switching time

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 185 KB

english, 1989

11

Simple enumeration of minimal tiesets of undirected graph

S. Hasanuddin Ahmad

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 148 KB

english, 1989

12

On a two-dissimilar-unit standby system with three modes and administrative delay in repair

G.S. Mokaddis, S.S. Elias, S.W. Labib

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 253 KB

english, 1989

13

Life characteristics of systems with dependent failures

A. Bhattacharya, A.K. Bhattacharji

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 286 KB

english, 1989

14

Optimum ordering policies with random lead times and salvage cost

R. Subramanian, V. Sridharan

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 285 KB

english, 1989

15

Stochastic behaviour of a man-machine system operating under changing environment subject to a Markov process with two states

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 191 KB

english, 1989

16

Reliability modelling and analysis of multiprocessor systems

E.V. Prasad, A.K. Sarje

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 242 KB

english, 1989

17

Dependence of breakdown voltage on molar concentration of 1,1,1, trichloroethane (TCA) in thermal SiO2

R.K. Bhan, P.K. Basu, K.C. Chhabra

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 379 KB

english, 1989

18

The stability of polycrystalline silicon thin film resistors measured using excess noise

B.K. Jones, E.S.C. Mzunzu

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 162 KB

english, 1989

19

Reliability analysis of repairable and non-repairable systems with common-cause failures

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

20

Reliability analysis of a k-out-of-n:G vehicle fleet

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 151 KB

english, 1989

21

A k-out-of-n:G redundant vehicle transit system

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

22

Testing against a change in the NBUE property

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 468 KB

english, 1989

23

The power of certain NBU tests

Jack Green, Ram C. Tiwari

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 337 KB

english, 1989

24

A conditional probability treatment of strict consecutive-k-out-of-n:F systems

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 208 KB

english, 1989

25

Reliability of two dependent paralleled devices with application to the electromigration failure phenomenon

Anna-Karin M. Wanchoo, Ernest M. Scheuer, Paul N. Bowerman

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 516 KB

english, 1989

26

Field acceleration factor for dielectric breakdown of MOS devices

R.M. Patrikar, R. Lal

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 195 KB

english, 1989

27

On Bayes estimation for mixtures of two Weibull distributions under type I censoring

Keh-Wei Chen, Alex S. Papadopoulos, Patrick Tamer

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 333 KB

english, 1989

28

Inverted gamma as a life distribution

C.T. Lin, B.S. Duran, T.O. Lewis

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 311 KB

english, 1989

29

Stochastic analysis of a parallel system with common-cause failures and critical human errors

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 324 KB

english, 1989

30

CSCC for the mean and standard deviation of non-normally distributed life test data

H.R. Singh, Gauri Shankar

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 195 KB

english, 1989

31

High vacuum production in the microelectronics industry: Author: Pierre Duval Publishers: Elsevier Science Publishers, Sara Burgerhartstraat 25, P.O. Box 211, 1000 AE Amsterdam, The Netherlands. Elsevier Science Publishing Co., Inc., P.O. Box 1663, Grand Central Station, New York, NY 10163, United States of America. Price: US$ 86.75. Dfl. 165.00. (ISBN 0-444-42878-X). Published 1988

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 30 KB

english, 1989

32

Audio IC circuits manual: Author: R.M. Marston. Publishers: Heinemann Newnes, Heinemann Professional Publishing Ltd., Halley Court, Jordan Hill, Oxford OX2 8EJ. Price: £ 10.95. (ISBN 0-434-91210-7). Published 1989

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 53 KB

english, 1989

33

Functional testing of LSI/VLSI chips—a survey : P. K. Lala and N. Berenjian. J. Instn Electron. Radio Engrs57(6), 255 (November/December 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 103 KB

english, 1989

34

Optimum single-sample inspection plans for products sold under free and rebate warranty : Chang Hoon Lie and Young Ho Chun. IEEE Trans. Reliab.R-36, 634 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 103 KB

english, 1989

35

Reliability and quality data in court : Richard M. Jacobs. Proc. a. Reliab. Maintainab. Symp., 234 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 103 KB

english, 1989

36

Off the bathtub onto the roller-coaster curve : Kam L. Wong and Dean L. Lindstrom. Proc. a. Reliab. Maintainab. Symp., 356 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 103 KB

english, 1989

37

Fault diagnosis assistant : Edward T. Purcell. IEEE Circuits Devices Mag., 47 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 227 KB

english, 1989

38

Quality across the boards : Barry Popplewell. IEE Rev., 67 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

39

Design automation standards development : Ronald Waxman. IEEE Trans. Reliab.R-36, 507 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

40

Testing high speed VLSI ICs : Peter H. Singer. Semiconductor int., 50 (December 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

41

Life estimation for IC plastic packages under temperature cycling based on fracture mechanics : Asao Nishimura, Akihiro Tatemichi, Hideo Miura and Tatsuji Sakamoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 637 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

42

Electrical and microstructural investigation of polysilicon emitter contacts for high-performance bipolar VLSI : J. M. C. Stork, E. Ganin, J. D. Cressler, G. L. Patton and G. A. Sai-Halasz. IBM J. Res. Dev.31, 617 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

43

Modelling of the MOS integrated circuit yield associated with random defects of dielectric layers : Krzysztof Kucharski and Wieslaw Marciniak. Electron Technol.19(3/4), 47 (1986)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

44

Estimating integrated-circuit failure rates from field performance : Frank S. Beltrano. Proc. a. Reliab. Maintainab. Symp., 327 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

45

Accelerated thermal fatigue cycling of surface mounted PWB assemblies in Telecom equipment : L.-G. Liljestrand and L.-O. Andersson. Circuit Wld14(3), 69 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 126 KB

english, 1989

46

Durability of floppy disks : Shinji Sugimoto. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 45 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 258 KB

english, 1989

47

Defect structure of (Ba, Pb)TiO3 positive temperature coefficient ceramics and its influence on electrical properties : Yuan Meng, Xu-Li Zhang, Fang-Qiao Zhou and Xing-Jiao Li. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 511 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 135 KB

english, 1989

48

Reliability assurance on purchased electronic components : Nobutoyo Tsutsumi and Hiroaki Yasuda. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 15 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 135 KB

english, 1989

49

The mechanisms that provide corrosion protection for silicone gel encapsulated chips : Kanji Otsuka, Yoshihisa Takeo, Hisashi Ishida, Takeo Yamada, Shigel Kuroda and Hiroshi Tachi. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 666 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 135 KB

english, 1989

50

Failure-time distribution of electronic components : William J. Kerscher. Proc. a. Reliab. Maintainab. Symp., 373 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 135 KB

english, 1989

51

Creep and stress relaxation in solder joints of surface-mounted chip carriers : Peter M. Hall. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 556 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 135 KB

english, 1989

52

The effects of heat sinking on THB testing of ICs : Yasuhiro Mizogami, Kusuya Iwasaki and Keiichi Ohtani. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 35 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 259 KB

english, 1989

53

An overview of IC failure analysis : D. R. Jones and M. Woodward. New Electron., 45 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

54

Horizontal die cracking as a yield and reliability problem in integrated circuit devices : Yehya M. Kasem and Leo G. Feinstein. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 654 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

55

Reliability modeling and evaluation for networks under multiple and fluctuating operational conditions : John Yuan, Chin-Hu Lin, Say Jau Chang and Shen-Hua Lai. IEEE Trans. Reliab.R-36, 557 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

56

Failure probability of strict consecutive-k-out-of-n:F systems: IEEE Trans. Reliab.R-36, 551 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

57

Reliability of systems with consecutive minimal cutsets : J. George Shanthikumar. IEEE Trans. Reliab.R-36, 546 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

58

A method for evaluating all the minimal cuts of a graph : G. B. Jasmon and K. W. Foong. IEEE Trans. Reliab.R-36, 539 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

59

Bayesian inference on parameter of exponential distribution and its characteristics : Michio Horigome. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 27 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

60

Sensitivity study of the cumulant method for evaluating reliability measures of two interconnected systems : Q. Ahsan and K. F. Schenk. IEEE Trans. Reliab.R-36, 429 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 256 KB

english, 1989

61

On the evaluation of the reliability of k-out-of-n systems: Thomas Risse. IEEE Trans. Reliab.R-36, 433 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

62

Dependability evaluation of integrated hardware/software systems : George E. Stark. IEEE Trans. Reliab.R-36, 440 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

63

On estimating component reliability for systems with random redundancy levels : R. A. Boyles and F. J. Samaniego. IEEE Trans. Reliab.R-36, 403 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

64

Reliability of redundant systems with unreliable switches : Eugene Veklerov. IEEE Trans. Reliab.R-36, 470 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

65

Reliability analysis for a real non-coherent system : Qin Zhang and Qizhi Mei. IEEE Trans. Reliab.R-36, 436 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

66

A preliminary test estimator of reliability in a life-testing model : Paul Chiou. IEEE Trans. Reliab.R-36, 408 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

67

Fault-tolerant ICs: the reliability of TMR yield-enhanced ICs : Tim Haifley and Atul Bhatt. IEEE Trans. Reliab.R-36, 224 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

68

A consideration on spare allocation for a multi-echelon repair system : Atsushi Aizawa, Masafumi Sasaki and Shigeru Yanagi. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 57 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

69

A comparison of several component-testing plans for a parallel system : Jaiher Yan and Mainak Mazumdar. IEEE Trans. Reliab.R-36, 419 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 132 KB

english, 1989

70

Some optimal designs for grouped data in reliability demonstration tests : Duan Wei and Jinn-Jomp Bau. IEEE Trans. Reliab.R-36, 600 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 267 KB

english, 1989

71

A minimizing algorithm for sum of disjoint products : Mitchell O. Locks. IEEE Trans. Reliab.R-36, 445 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

72

A new nonparametric growth model : David G. Robinson and Duane Dietrich. IEEE Trans. Reliab.R-36, 411 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

73

System reliability using binomial failure rate : Kyung C. Chae. Proc. a. Reliab. Maintainab. Symp., 136 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

74

Optimum policies for a system with imperfect maintenance : Toshio Nakagawa and Kazumi Yasui. IEEE Trans. Reliab.R-36, 631 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

75

Fitting and optimal grouping on gamma reliability data : Duan Wei and C. K. Shau. IEEE Trans. Reliab.R-36, 595 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

76

Diagnosability and distinguishability analysis and its applications : Yoshiteru Ishida, Hidekatsu Tokumaru and Norihiko Adachi. IEEE Trans. Reliab.R-36, 531 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

77

A comparison of the prediction of future order statistics for the 2-parameter gamma distribution : Uditha Balasooriya. IEEE Trans. Reliab.R-36, 591 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

78

An age-wear dependant model of failure : Gosef Ginlmayr. IEEE Trans. Reliab.R-36, 581 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

79

A Bayes reliability growth model for a development testing program : Nasser S. Fard and Duane L. Dietrich. IEEE Trans. Reliab.R-36, 568 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 269 KB

english, 1989

80

Mean time to achieve a failure-free requirement under provisions of spare and repair : Nader Ebrahimi. IEEE Trans. Reliab.R-36, 565 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

81

A new heuristic algorithm for constrained redundancy-optimization in complex systems : Shi Dinghua. IEEE Trans. Reliab.R-36, 621 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

82

Reliability optimization with the Lagrange multiplier and branch-and-bound technique : Way Kuo, Hsin-Hui Lin, Zhongkai Xu and Weixing Zhang. IEEE Trans. Reliab.R-36, 624 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

83

Common-cause failures in repairable systems : Balbir S. Dhillon and Subramanyam N. Rayapati. Proc. a. Reliab. Maintainab. Symp., 283 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

84

Estimation of probability in strength-stress relationship and its use in structural reliability : Stefan Rinco and Nora Ni Chuiv. IEEE Trans. Reliab.R-36, 617 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

85

MIL-STD-718C fixed time test: effect of redundancy : Malcolm A. McGregor. Proc. a. Reliab. Maintainab. Symp., 297 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

86

The United States Air Force R&M 2000 process : John R. Hull, Thomas S. Lanier and Anthony M. Smith. Proc. a. Reliab. Maintainab. Symp., 93 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

87

An inside view of Air Force ground electronic equipment maintenance : Gretchen A. Bivens, Frank M. Kranz and Gino L. Liberati. Proc. a. Reliab. Maintainab. Symp., 262 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 134 KB

english, 1989

88

Practical Markov modeling for reliability analysis : John F. Kitchin. Proc. a Reliab. Maintainab. Symp., 290 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 260 KB

english, 1989

89

Using internal testing program in testing the telephone subset integrated circuit : Andrzej Grzegorczyk, Marek Ostanek, Piotr Ruszkarski, Edward Stolarski and Jaremi Witewski. Electron. Technol.19 (3/4), 29 (1986)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

90

Sequential test for the ratio of two constant failure rates : Dolun Oksoy. IEEE Trans. Reliab.R-36, 605 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

91

First-generation electronic R&M CAE : Donald D. Hall. IEEE Trans. Reliab.R-36, 495 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

92

Electronic warfare coordination module (EWCM): integrating design, R&M, and logistic support analysis : R. E. Biedenbender and D. B. Klingensmith. Proc. a. Reliab. Maintainab. Symp., 405 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

93

A satellite failure database system : Rathin Neogy and Chi-Ping Siu. Proc. a. Reliab. Maintainab. Symp., 422 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

94

An analysis of hardware and software availability exemplified on the IBM 3725 communication controller : IBM J. Res. Dev.32, 268 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

95

Simple Bayes test of equality of exponential means : M. M. Shoukri. IEEE Trans. Reliab.R-36, 613 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

96

High density packaging. Connecting the third dimension : Malcolm Bennett. New Electron., 26 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

97

World class contamination control practices : James Burnett. Semiconductor int., 160 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

98

Currents trends in VLSI materials. Part 2: dielectrics : J. Kiefer Elliot. Semiconductor int., 150 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

99

SMT: today and tomorrow : Susumu Suzuki. J. Electron. Engng Japan, 40 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

100

Miniaturization of electronics and its limits : R. W. Keyes. IBM J. Res. Dev.32, 24 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

101

Choosing between parametric test instruments and systems : Terry Nagy. Semiconductor int., 168 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

102

Considerations for the design of an SRAM with SOI technology : Theodore W. Houston and the Texas Instrument's SOI Team. IEEE Circuits Devices Mag., 8 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

103

Purposes of three-dimensional circuits : Akira Terao and Fernand van de Wiele. IEEE Circuits Devices Mag., 31 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

104

Cooperative spirit guides European chipmakers : Ann Chestnut. Semiconductor int., 114 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

105

Process simulation of submicron technologies : Richard B. Fair and John E. Rose. Semiconductor int., 72 (December 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

106

The beauty of ‘almost standard’ VLSI : Bill Knapp and Kenyon Mei. IEEE Spectrum, 35 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

107

VLSI and AI are getting closer : Guy Rabbat. IEEE Circuits Devices Mag., 15 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

108

Today's plasma etch chemistries : Peter H. Singer. Semiconductor int., 68 (March 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

109

CMOS contacts and interconnects : Dale M. Brown. Semiconductor int., (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

110

Current trends in VLSI materials. Part 1: conductor systems : J. Kiefer Elliott. Semiconductor int., 46 (March 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

111

Mechanical stress reliability factors for packaging GaAs MMIC and LSIC components : Ronald P. Vidano, Dave W. Paananen, Tom H. Miers, Julie M. Krause-Singh, K. Richard Agricola and Ray L. Hauser. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 612 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 263 KB

english, 1989

112

Résines pour microlithographie: A. Eranian and J. C. Dubois. Revue Technique Thomson-CSF19, 95 (1987). (In French.)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

113

Monitoring and diagnosis of plasma etch processes : Steven B. Dolins, Aditya Srivastava and Bruce E. Flinchbaugh. IEEE Trans. Semiconductor Mfg1, 23 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

114

Microfluorescence analysis of photoresists and contaminants in LSI processing : S. Koyata, C. Niwano and T. Hattori. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 17 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

115

Class 10 robots in PECVD processing : T. H. Tom Wu and Rich A. Carone. Semiconductor int., 106 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

116

The electrical effect of single-chip CMOS packages : Eric M. Foster. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 593 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

117

Design and performance of a system for VLSI packaging: thermal modeling and characterization : Zbigniew J. Staszak, John L. Prince, Bradly J. Cooke and David A. Shope. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 628 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

118

New directions in CMOS processing : Peter H. Singer. Semiconductor int., 60 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 140 KB

english, 1989

119

New profile of ultra low stress resin encapsulants for large chip semiconductor devices : Yoshinobu Nakamura, Shinjirou Uenishi, Teruo Kunishi, Kazuyuki Miki, Haruo Tabata, Kazuyuki Kuwada, Hideto Suzuki and Tsunetaka Matsumoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 502 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 274 KB

english, 1989

120

Rheology of silver-filled glass die attach adhesive for high-speed automatic processing : Guy C. Bell Jr, Christine M. Rosell and Sara T. Joslin. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 507 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

121

Examining competitive submicron lithography : Darryl W. Peters. Semiconductor int., 96 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

122

VLSI packaging and assembly : Jeffrey S. Braden. Semiconductor int., 58 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

123

Investigation of the reliability of copper ball bonds to aluminium electrodes : Jin Onuki, Masahiro Koizumi and Isao Araki. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 550 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

124

VLSI chip interconnection technology using stacked solder bumps : Norio Matsui, Shinichi Sasaki and Takaaki Ohsaki. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 566 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

125

In-process wafer test and measurement : Jim Dey. Semiconductor int., 52 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 136 KB

english, 1989

126

Multichip packaging design for VLSI-based systems : Charles J. Bartlett, John M. Segelken and Nicholas A. Teneketges. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 647 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 265 KB

english, 1989

127

Applying photoresist for optimal coatings : Kathy Skidmore. Semiconductor int., 54 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

128

Wafer processing and materials : Robert J. Kopp. Semiconductor int., 44 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

129

Mask-making equipment/process drives IBM's IM chips : Katherine C. Norris. Semiconductor int., 101 (October 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

130

Polyimides in microelectronics : Pietr Burggraaf. Semiconductor int., 58 (March 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

131

Etching of phosphorous doped polysilicon films : Andrew A. Chambers, Simon V. Davies and Mostyn Lovett. Semiconductor int., 66 (January 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

132

Fast turn around for ASIC photomasks : Peter H. Singer. Semiconductor int., 70 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

133

CMOS active and field device fabrication : Louis C. Parrillo. Semiconductor int., (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

134

Comparative studies of vibrational reliability of electron-conductive adhesive and soldered microjoints : Andrew H. Rawicz. IEEE Trans. Reliab.R-36, 528 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

135

Closely packed microstrip lines as very high-speed chip-to-chip interconnects : Oh-Kyong Kwon and Fabian W. Pease. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 314 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

136

A liftoff process using edge detection (LOPED) : Pei-Lin Pai and William G. Oldham. IEEE Trans. Semiconductor Mfg1, 3 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

137

Yield model for in-line integrated circuit production control : S. Simitrijev, N. Stojadinovic and Z. Stamenkovic. Solid-St. Electron.31, 975 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

138

Photomask and reticle blanks : Pieter Burggraaf. Semiconductor int., 38 (December 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

139

Closed-loop job release control for VLSI circuit manufacturing : C. Roger Glassey and Mauricio G. C. Resende. IEEE Trans. Semiconductor Mfg1, 36 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 128 KB

english, 1989

140

A structured methodology for IC photolithography synthesis in semiconductor manufacturing : Michael F. Klein. IEEE Trans. Semiconductor Mfg1, 28 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 248 KB

english, 1989

141

Signal degradation through module pins in VLSI packaging : Ching-Chao Huang and Leon L. Wu. IBM J. Res. Dev.31, 489 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

142

Silicon dioxide removal in anhydrous HF gas : C. Rinn Cleavelin and Gary T. Duranko. Semiconductor int., 93 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

143

Very sensitive detection for LSI's hot spot using liquid crystal : Masara Sanada. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 53 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

144

Helium leak detection in vacuum systems and IC packages : Peter H. Singer. Semiconductor int., 51 (October 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

145

A novel technique for detecting lithographic defects : Anthony M. McCarthy, Wes Lukaszek, Chong-Cheung Fu, David H. Dameron and James D. Meindl. IEEE Trans. Semiconductor Mfg1, 10 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

146

Comparison of two wafer inspection methods for particle monitoring in semiconductor manufacturing : Leon L. Pesotchinsky and Zinov Fichtenholz. IEEE Trans. Semiconductor Mfg1, 16 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

147

Trends in channel-less gate arrays : Masura Hitosugi. J. Electron. Engng, 28 (October 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

148

New integral representations of circuit models and elements for the circuit technique for semiconductor device analysis : C. T. Sah. Solid-St. Electron.30, 1277 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

149

Materials testing to avoid static problems with microelectronics : J. N. Chubb. New Electron., 49 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

150

Triple diffused transistor for digital IC applications : Bogdan M. Wilamowski, Miroslaw Korzeniowski, Andrzej Sobkowiak, Barbara Welniak. Wladyslaw Wielich and Zbigniew Wierzbicki. Electron Technol.19 (3/4), 91 (1986)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

151

Reliable high speed bipolar ICs for long distance transmission : J. Brierre, J.-C. Cadene, J.-Y. Fourrier, J.-M. Thilliez and D. Tribet. Electl Commun.61, 396 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 121 KB

english, 1989

152

Gate array playing a main role in ASIC : Kunio Komatsu. J. Electron. Engng Japan, 52 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 244 KB

english, 1989

153

Curve tracers advance MOSFET technology : Ken Dierberger. Semiconductor int., 88 (February 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

154

One-chip microcomputer creates new features in the consumer electronic industry : Kojiro Kurashima. J. Electron. Engng Japan, 44 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

155

R&D of three dimensional circuit device getting to the final stage : Kazuyuki Sugawara. J. Electron. Engng Japan, 32 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

156

Bi-CMOS: combination circuit offers economy and power : Yozo Tanihara. J. Electron. Engng Japan, 28 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

157

Gallium arsenide ICs promising as fast ICs in the high-frequency range : Masahiro Hagio. J. Electron. Engng Japan, 36 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

158

Bidirectional blocking junctions in SOI : Bernard A. Maciver, Kailash C. Jain and Stephen J. Valeri. IEEE Circuits Devices Mag., 27 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

159

Removal processes for damage and contamination after CF4/40%H2 reactive ion etching of silicon : Awatar Singh. Microelectron. J.18(5), 13 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

160

A new boron implantation model suitable for analytical modeling of threshold voltage of MOSFETS : A. Das Gupta and S. K. Lahiri. Solid-St. Electron.30, 1283 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

161

Laser annealing of GaAs implanted with low doses of selenium ions : J. A. Akintunde. Solid-St. Electron.30, 1251 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 123 KB

english, 1989

162

Total-dose effects of gamma-ray irradiation on CMOS/SIMOX devices : Terukazu Ohno, Katsutoshi Izumi, Masakazu Shimaya and Noboru Shiono. IEEE Circuits Devices Mag., 21 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 247 KB

english, 1989

163

Multiple-threshold-voltage CMOS/SOS by focused ion beams : J. Y. Lee, W. M. Clark and M. W. Utlaut. Solid-St. Electron.31, 155 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

164

Determination of doping profiles for low boron ion implantations in silicon : R. Kinder and H. Frank. Solid-St. Electron.31, 265 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

165

Reactive and chemically assisted ion beam etching of Si and SiO2: M. A. Carter and G. F. Goldspink. Vacuum38, 5 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

166

Buried injector logic, a vertical IIL using deep ion implantation : A. J. Mouthaan. Solid-St. Electron.30, 1243 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

167

Generation currents from interface states in selectively implanted MOS structures : G.A. Hawkins. Solid-St. Electron.31, 181 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

168

Silicon nitride film as GaAs annealing encapsulant : A. Kiermasz, A. McQuarrie and J. Bhardwaj. Semiconductor int., 107 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

169

Low temperature annealing of He+ implanted optical wave-guides in LiNbO3: C. N. Ahmad and B. L. Weiss. Vacuum38, 123 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

170

Special series on irradiation enhanced adhesion. Ion beam bombardment effects during film deposition : S. M. Rossnagel and J. J. Cuomo. Vacuum38, 73 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 127 KB

english, 1989

171

Large-scale hybrid integrated circuitry: a case study : Hugh J. Curnan and Peter Bokalo. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 519 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 262 KB

english, 1989

172

Delamination and fracture of thin films : Erik Klokholm. IBM J. Res. Dev.31, 585 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

173

Some properties of thin-film SOI MOSFETs : Jean-Pierre Colinge. IEEE Circuits Devices Mag., 16 (November 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

174

Investigation of thick film technology for microwave applications : M. J. Stennes, K. D. Stephan, H. Campbell, C. P. Smith and R. M. Zilberstein. Microelectron. J.18(5), 29 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

175

A simple inexpensive method for thickness measurement of thin films : E. Sader. Vacuum38, 97 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

176

A comparison of the reliability of copper and palladium-silver thick-film crossovers : Robert R. Sutherland and Ian D. E. Videlo. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 676 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

177

Nitrogen-fireable resistors; emerging technology for thick-film hybrids : Paul C. Donohue, Jacob Hormadaly, Christopher R. S. Needes, Samuel J. Horowitz and Joachim F. Knaak. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 537 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

178

The kinetics of thin film resistor stabilisation : I. A. Goldberg, I. E. Klein and M. Hershkovich. Microelectron. J.19(1), 34 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 261 KB

english, 1989

179

Reliability, thermal and thermochemical characteristics of polymer-on-metal multilayer boards : F. Gray and M. Elkins. Circuit Wld14(3), 12 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

180

Percolation network for thick resistive films : A. Kusy and E. Listkiewicz. Solid-St. Electron.31, 821 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

181

Transport equations for highly doped devices and hetero-structures : Alan H. Marshak. Solid-St. Electron.30, 1089 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

182

Pressure dependence of donor levels in GaP: electronic Raman scattering experiments : G. Galtier and G. Martinez. Solid St. Commun.65, 193 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

183

Modelling of minority-carrier transport in heavily doped silicon emitters : Jesus A. Del Alamo and Richard M. Swanson. Solid-St. Electron.30, 1127 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

184

SEM and EMPA analysis of impurities related to GaAs substrates and MBE grown GaAs layers : N. J. Kadhim and D. Mukherjee. Vacuum38, 11 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

185

Surface vibrational study of acetylene adsorption on cleaved silicon : M. N. Piancastelli, M. K. Kelly, G. Margaritondo, D. J. Frankel and G. J. Lapeyre. Solid St. Commun.65, 1295 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 125 KB

english, 1989

186

Application of Kikuchi maps for the indexing of electron diffraction patterns from silicon : Jerzy Katċki. Electron Technol.19(3/4), 61 (1986)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 260 KB

english, 1989

187

Electronic structure of strained Sin/Gen(001) superlattices: S. Ciraci, O. Gulseren and S. Ellialtioglu. Solid St. Commun.65, 1285 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

188

Electrical properties of SiSiO2 structures treated in helium plasma : J. Kassabov, E. Atanassova, D. Dimittrov and E. Goranova. Microelectron. J.18(5), 5 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

189

Optical characterization of heavily doped silicon : Joachim Wagner. Solid-St. Electron.30, 1117 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

190

N-type SIPOS and poly-silicon emitters: Y. H. Kwark and R. M. Swanson. Solid-St. Electron.30, 1121 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

191

Silicon heterojunction bipolar transistors with amorphous and microcrystalline emitters : J. Symons, M. Ghannam, A. Neugroschel, J. Nijs and R. Mertens. Solid-St. Electron.30, 1143 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

192

Neuron-like transient phenomena in silicon p-i-n structures: D. D. Coon and A. G. U. Perera. Solid-St. Electron.31, 851 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

193

Measurement of generation lifetime in thin silicon layers : T. E. Hof, T. J. Morthorst and K. P. Roenker. Solid-St. Electron.31, 937 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 137 KB

english, 1989

194

Heavy doping effects in silicon : Roger J. van Overstraeten and Robert P. Mertens. Solid-St. Electron.30, 1077 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 268 KB

english, 1989

195

CMOS hot carrier protection with LDD : Min-Liang Chen. Semiconductor int., 78 (April 1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

196

A mechanism for two-electron capture at deep level defects in semiconductors : N. T. Bagraev and V. A. Mashkov. Solid St. Commun.65, 1111 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

197

Effect of electron-electron collisions on properties of hot electrons : M. Combescot. Solid St. Commun.65, 1221 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

198

The role of the interfacial layer in bipolar (poly-Si)-emitter transistors : B. Benna, T. F. Meister and H. Schaber. Solid-St. Electron.30, 1153 (1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

199

High-field drift velocity of electrons in silicon inversion layers : A. Modelli and S. Manzini. Solid-St. Electron.31, 99 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

200

hFE shift on the reverse bias test for emitter-base junction : Tatsuya Tominago and Tetsuaki Wada. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 37 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

201

Thickness and doping dependence of the optical gap in amorphous hydrogenated silicon films : V. Chacorn and D. Haneman. Solid St. Commun.65, 609 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

202

Argon plasma treatment effects on SiSiO2 structures : J. Kassabov, E. Atanossova, D. Dimitrov and E. Goranova. Solid-St. Electron.31, 147 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

203

Thermal degradation of hydrogenated amorphous silicon (a-Si:H) solar cells used in consumer appliances: Yoshio Miyai and Sadae Sakamoto. Proceedings of the 17th Symposium on Reliability and Maintainability, Union of Japanese Scientists and Engineers, 55 (2–4 June 1987)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 133 KB

english, 1989

204

Electrical size effects of thin C54-TiSi2 films grown on silicon substrates : Jeng-Rern Yang and Juh Tzeng Lue. Solid St. Commun.65, 1613 (1988)

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 150 KB

english, 1989

205

Evidence for thermal defect creation in amorphous silicon : A. Werner and M. Kunst. Solid St. Commun.65, 1501 (1988)

Journal:

Microelectronics Reliability

Year:

1989

File:

PDF, 20 KB

1989

206

4758785 Pressure control apparatus for use in an integrated circuit testing station

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 81 KB

english, 1989

207

4760335 Large scale integrated circuit test system

FrankA Lindberg

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 81 KB

english, 1989

208

4760575 IC card having fault checking function

Hirosh Watanabe

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 81 KB

english, 1989

209

4761767 High reliability integrated circuit memory

Richard Ferrant

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 89 KB

english, 1989

210

4763066 Automatic test equipment for integrated circuits

PaulK.K. Yeung, AlanD. Howard, James Hoo, JamesL. Pennock

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 89 KB

english, 1989

211

4764926 Integrated circuits

WilliamL Knight, Mark Paraskeva, DavidF Burrows

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 89 KB

english, 1989

212

4766371 Test board for semiconductor packages

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 89 KB

english, 1989

213

4766372 Electron beam tester

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 89 KB

english, 1989

214

4769744 Semiconductor chip packages having solder layers of enhanced durability

ConstantineA Neugebauer, RichardO Carlson

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 86 KB

english, 1989

215

4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 86 KB

english, 1989

216

4772846 Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 86 KB

english, 1989

217

4766670 Full panel electronic packaging structure and method of making same

CharlesE Gazdik, DonaldG McBride, DonaldP Seraphim, Patrick Toole

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 70 KB

english, 1989

218

4768073 Testing integrated circuits

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 70 KB

english, 1989

219

4768193 Semiconductor memory device having error correction function and incorporating redundancy configuration

Yoshihiro Takemae

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 70 KB

english, 1989

220

4768195 Chip tester

DonaldW Stoner, Lawrence Canino

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 93 KB

english, 1989

221

4774461 System for inspecting exposure pattern data of semiconductor integrated circuit device

Shogo Matsui, Kunihiko Shiozawa, Kenichi Kobayashi

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 93 KB

english, 1989

222

4776695 High accuracy film thickness measurement system

Hung van Pham, Wayne Borglum, Cheste Mallory

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 93 KB

english, 1989

223

4777355 IC card and system for checking the functionality thereof

Kenichi Takahira

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 169 KB

english, 1989

224

4777434 Microelectronic burn-in system

Vernon Miller, LincolnE Roberts

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 77 KB

english, 1989

225

4779046 Electron beam integrated circuit tester

Jean-Miche Rouberoi, deBeauregardFrancois Costa

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 77 KB

english, 1989

226

4780851 Semiconductor memory device having improved redundant structure

Journal:

Microelectronics Reliability

Year:

1989

Language:

english

File:

PDF, 77 KB

english, 1989