Volume 31; Issue 5

Microelectronics Reliability

Volume 31; Issue 5

1

A new algorithm for minimal disjoint sum of products

Su Chen, Daorong Xu, Shibai Tong

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 277 KB

english, 1991

2

Reliability analysis of a conveyor belt system, with only one server, subject to failures and idleness after repair

P.C. Tewari, I.P. Singh, M.K. Khare

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 214 KB

english, 1991

3

Profit analysis of a two-unit redundant system with provision for rest and correlated failures and repairs

L.R. Goel, Preeti Shrivastava

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 360 KB

english, 1991

4

A two-unit cold standby system with three modes and correlated failures and repairs

L.R. Goel, Preeti Shrivastava

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 348 KB

english, 1991

5

A single-server two-unit warm standby system with n failure modes, fault detection and inspection

L.R. Goel, R.K. Agnihotri, Rakesh Gupta

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 285 KB

english, 1991

6

A 1-out-of-N: G system with common-cause failures and critical human errors

Jai Singh, B. Dayal

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 164 KB

english, 1991

7

Behaviour analysis of a urea decomposition system in the fertilizer industry under general repair policy

Dinesh Kumar, P.C. Pandey, Jai Singh

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 217 KB

english, 1991

8

Process design for a crystallization system in the urea fertilizer industry

Dinesh Kumar, P.C. Pandey, Jai Singh

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 259 KB

english, 1991

9

Series queue with general bulk service, random breakdown and vacation

R. Nadarajan, D. Jayaraman

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 163 KB

english, 1991

10

Cost analysis of a multi-component parallel redundant complex system with overloading effect and waiting under critical human error

P.P. Gupta, Anju Singhal, S.P. Singh

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 233 KB

english, 1991

11

Reliability analysis of communication networks by decomposition

F. Beichelt, P. Tittmann

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 304 KB

english, 1991

12

A model for mechanisms in plastic-encapsulated microelectronic devices during temperature-humidity tests—II

Günter Matthäi

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 380 KB

english, 1991

13

Quantitative analysis of software quality during the “design and implementation” phase

Suneel M. Joshi, K.B. Misra

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 387 KB

english, 1991

14

Fuzzy measure of complex system outages

V. Ramachandran, V. Sankaranarayanan

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 194 KB

english, 1991

15

Optimal learning time for human operators

V.M. Cǎtuneanu, C. Moldovan, Fl. Popenţiu, D. Popovici

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 256 KB

english, 1991

16

Software reliability release policy with testing effort

V.M. Cǎtuneanu, C. Moldovan, Fl. Popenţiu, D. Popovici

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 236 KB

english, 1991

17

Optimization of software testing time with debugging improvement

V.M. Cǎtuneanu, A. Mihalache, Fl. Popenţiu, D. Popovici

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 163 KB

english, 1991

18

A model for productivity measurement in the electronics industry

Torky I. Sultan

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 253 KB

english, 1991

19

A consideration of reliability in economic distribution quantity for a warehouse

Celestine A. Ntuen, Mohammed Chikha

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 140 KB

english, 1991

20

Reliability analysis of warehouse containers under life test policies

Celestine A. Ntuen, Mohammed Chikha

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 220 KB

english, 1991

21

Minimax review schedules for degradable systems under a specified operational reliability

Celestine A. Ntuen

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 195 KB

english, 1991

22

Analysis of Stochastic Petri Net model with non-exponential distributions using a generalized Markov Renewal Process

Qun Jin, Yoshio Sugasawa, Koichiro Seya

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 367 KB

english, 1991

23

Weak limits of random quasi-ranges and random quasi-half-ranges

H.M. Barakat, E.M. Nigm

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 440 KB

english, 1991

24

Reliability evaluation of a phased mission system with time varying redundancy and failure probability

Kang W. Lee, Jung S. Hong

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 239 KB

english, 1991

25

Architectural factors influencing the reliability of fault-tolerant VLSI arrays

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 335 KB

english, 1991

26

Modelling the effects of neutron radiation on the Gummel-Poon parameters for bipolar NPN transistors

H.S. Hajghassem, J.R. Yeargan, W.D. Brown, J.G. Williams

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 508 KB

english, 1991

27

A method for computing steady-state reliability indexes of a network with limited repair

Alexander A. Gagin, Oleg V. Klimovsky

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 414 KB

english, 1991

28

The state-dependent queue: M/M/1/N with reneging and general balk functions

M.O. Abou-El-Ata

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 196 KB

english, 1991

29

A general age replacement model with minimal repair and general random repair cost

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 353 KB

english, 1991

30

Periodic replacement with minimal repair at failure and general random repair cost for a multi-unit system

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 304 KB

english, 1991

31

Society of reliability engineers bulletin

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 89 KB

english, 1991

32

Computer networks and systems: queueing theory and performance evaluation: Author: Thomas G. Robertazzi Series Editors: Mario Gerla, Aurel Lazar and Paul Kuehn Publishers: Springer-Verlag, 175 Fifth Avenue, New York, NY 10010, United States of America. Price: DM 98.00. (£ sterling £ 35.00). (ISBN 3-540-97393-1) Published 1990

Florin Popentiu

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 47 KB

english, 1991

33

Practical reliability engineering (Third Edition): Author: Patrick D. T. O'Connor Publishers: John Wiley & Sons Limited, Baffins Lane, Chichester, West Sussex, P019 1UD, England. Price: £ 16.95. (ISBN 0 471 92902 6) Published 1991

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 56 KB

english, 1991

34

Boolean functions with engineering applications and computer programs: Author: Winfrid G. Schneeweiss Publishers: Springer-Verlag GmbH & Co., Postfach 105280, Tiergartenstrasse 17, D-6900 Heidelberg 1, Federal Republic of Germany. Price: DM 128.00 (Hardcover) (ISBN 3-540-18892-4) (ISBN 0-387-18892-4) Published 1989

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 39 KB

english, 1991

35

Publications, notices, calls for papers, etc.

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 203 KB

english, 1991

36

Total quality management: an approach and a case study : Nael A. Alyet al. Computers ind. Engng19(1–4), 111 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 92 KB

english, 1991

37

A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy : Timothy L. Michalka, Ramesh C. Varshney and James D. Meindl. IEEE Trans. Semicond. Mfg.3(3), 116 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 92 KB

english, 1991

38

Mechanical engineering issues and electronic equipment reliability: incurred costs without compensating benefits : Charles T. Leonard. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 895 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 92 KB

english, 1991

39

A new high temperature multilayer capacitor with acrylate dielectrics : Angelo Yializis, Gary L. Powers and David G. Shaw. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 611 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 130 KB

english, 1991

40

Structural, optical and electronical properties of mixed dielectric films : R. Thielsch, W. Meiling and E. Goring. Vacuum41(4–6), 1147 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 130 KB

english, 1991

41

Thermally induced IC package cracking : David Suhl. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 940 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 130 KB

english, 1991

42

A comparison of copper and gold wire bonding on integrated circuit devices : Salim. L. Khouryet al. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 673 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 130 KB

english, 1991

43

Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder : Harold J. Frost and Robert T. Howard. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 727 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

44

3D CMOS devices in recrystallized silicon : R. Buchner, K. Haberger, S. Seitz, J. Weber, P. Seegebrecht and W. Van Der Wel. Microelectron. J.21(6), 13 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

45

Reliability of compound semiconductor microwave field-effect devices: failure mechanisms and test methods : G. Clerico Titinet, E. Pollino and D. E. Riva. Microelectron. J.21(6), 33 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

46

The association of component solderability testing with board level soldering performance : Mark A. Kwoka and Paul D. Mullenix. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 704 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

47

A new power cycling technique for accelerated reliability evaluation of plated through holes and interconnects in PCBs : Ramachandra Munikoti and Pulak Dhar. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 865 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

48

AC product defect level and yield loss : Jacob Savir. IEEE Trans. Semicond. mfg Technol.3(4), 195 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 133 KB

english, 1991

49

Strength and reliability of ceramic modules soldered to flexible cables : Nicholas T. Panousis, James F. Prosser, Alice T. Wang and Yew Nam Yong. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 661 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 260 KB

english, 1991

50

Relation between delamination and temperature cycling induced failures in plastic packaged devices : Karel Van Doorselaer and Kees De Zeeuw. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 879 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

51

Automated visual inspection of bare printed circuit boards : Paul M. Griffin, J. Rene Villalobos, Joseph W. Foster III and Sherri L. Messimer. Computers ind. Engng18(4), 505 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

52

Effects of polymer/metal interaction in thin-film multichip module applications : Gretchen M. Adema, Iwona Turlik, Lih-Tlyng Hwang, Glenn A. Rinne and Michele J. Berry. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 766 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

53

Healing of voids in the aluminum metallization of integrated circuit chips : Edward F. Cuddihy, Russel A. Lawton and Thomas R. Gavin. IEEE Trans. Reliab.39(5), 564 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

54

Investigations of failure mechanisms of TAB-bonded chips during thermal ageing : Elke Zakel and Herbert Reichl. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 856 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

55

Manufactures consider fixtureless in-circuit testers : M. Takahishi. JEE (Japan) 58 (November 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 129 KB

english, 1991

56

Field-induced instabilities in polyimide passivated lateral p-n-p transistors: Badih El-Karehet al. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 623 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 254 KB

english, 1991

57

Automatic testing of metallized ceramic-polyimide (MCP), substrates : Steven Defoster, Martin Mancini and Jerzy Zalesinski. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 822 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

58

MTBCF calculation for system with unequal periodic maintenance times : Malcolm. A. McGregor. Proc. A. Reliab. Maintainab. Symp., 15 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

59

An iterative Bayes procedure for reliability assessment : Richard R. Prairie and William J. Zimmer. Proc. A. Reliab. Maintainab. Symp., 10 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

60

Reliability analysis of redundant aircraft systems with possible latent failures : Tilak C. Sharma and Benyamin Zilberman. Proc. A. Reliab. Maintainab. Symp., 303 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

61

TEM analysis of failed bits and improvement of data retention properties in megabit-drams : Shigeo Onishi, Akitsu Ayukawa, Kenichi Tanaka and Keizo Sakiyama. 28th A. Proc. Reliab. Phys. Symp. (IEEE), 265 (March 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

62

Optimum simple step-stress accelerated life tests with censoring : D. S. Bai, M. S. Kim and S. H. Lee. IEEE Trans. Reliab.38(5), 528 (1989)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

63

Reliability prediction of electronic packages : Abhijit Dasgupta, Donald Barker and Michael Pecht. Proc. A. Reliab. Maintainab. Symp., 323 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 251 KB

english, 1991

64

Statistical precision and robustness of the AMSAA continuous reliability growth estimators : Tariq Ziad and Paul M. Ellner. Proc. A. Reliab. Maintainab. Symp., 210 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

65

A Bayesian methodology for assessing reliability during product development : S. Kaplan, G. D. M. Cunha, A. A. Dykes and D. Shaver. Proc. A. Reliab. Maintainab. Symp., 205 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

66

Undersea lightguide cable reliability analyses : Percy S. Wu. Proc. A. Reliab. Maintainab. Symp., 157 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

67

Developing criteria for determining corrective action thresholds during reliability verification testing (RVT) : David T. Tyler, Kalman J. Gyimesi and Robert L. Vienneau. Proc. A. Reliab. Maintainab. Symp., 76 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

68

Analysis of reliability block diagrams with multiple blocks per component : Robert F. Forche. Proc. A. Reliab. Maintainab. Symp., 145 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

69

Improving “MIL-HDBK-217 Type” models for mechanical reliability prediction : E. Harold Vannoy. Proc. A. Reliab. Maintainab. Symp., 341 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

70

Dynamic models for statistical inference from accelerated life tests : Thomas A. Mazzuchi and Refik Soyer. Proc. A. Reliab. Maintainab. Symp., 67 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

71

Practical models for determining standby redundancy levels : R. W. Sears. Proc. A. Reliab. Maintainab. Symp., 120 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

72

Modeling the effect of reliability on performance : Andrew L. Reibman. IEEE Trans. Reliab.39(3), 314 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

73

Reliability prediction model for gyroscopes : Aric Dumai and Avi Winkler. Proc. A. Reliab. Maintainab. Symp., 5 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

74

Measurement assurance in reliability assessment : M. B. Carey, G. N. Geissler, P. E. Montag and T. L. Yost. Proc. A. Reliab. Maintainab. Symp., 237 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

75

Vibration and shock testing for computers : Robert A. Frey, Gerald J. Ratchford and Bruce E. Wendling. Proc. A. Reliab. Maintainab. Symp., 315 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

76

Fast fault-tree evaluation for many sets of input data : Winfrid G. Schneeweiss. IEEE Trans. Reliab.39(3), 296 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

77

Optimal strategies for scheduling checkpoints and preventive maintenance : E. G. Coffman Jr and E. N. Gilbert. IEEE Trans. Reliab.39(1), 9 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

78

A new approach to the analysis of reliability block diagrams : William S. Gough, Jeff Riley and James M. Koren. Proc. A. Reliab. Maintainab. Symp., 456 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

79

Shortcomings in MIL-STD-1629A guidelines for criticality analysis : Ajay S. Agarwala. Proc. A. Reliab. Maintainab. Symp., 494 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

80

Demonstrating reliability and reliability growth with environmental stress screening data : Kam L. Wong. Proc. A. Reliab. Maintainab. Symp., 47 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

81

Optimal design of systems subject to two kinds of failure : Hoang Pham. Proc. A. Reliab. Maintainab. Symp., 149 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

82

Automated reliability life data analysis of missiles in storage and flight : Proc. A. Reliab. Maintainab. Symp., 490 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

83

Reliability enhancement of submodule redundancy : Shambhu J. Upadhyaya, Hoang Pham and Kewal K. Saluja. Proc. A. Reliab. Maintainab. Symp., 127 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

84

An integrated analytic approach for reliability improvement : Harold C. Fortna, Raymond Zavada and Teresa M. Warren. Proc. A. Reliab. Maintainab. Symp., 192 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 132 KB

english, 1991

85

Improving reliability and maintainability programs with configuration management—the next revolution : Rudolph G. Boznak. Proc. A. Reliab. Maintainab. Symp., 109 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 256 KB

english, 1991

86

Analysis of warranty cost based on reliability : Al Myrick. Proc. A. Reliab. Maintainab. Symp., 228 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

87

MTBF Warranty/Guarantee for multiple user avionics : Frank J. Moreno. Proc. A. Reliab. Maintainab. Symp., 113 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

88

Fault trees and sequence dependencies : Joanne Bechta Dugan, Salvatore J. Bavuso and Mark A. Boyd. Proc. A. Reliab. Maintainab. Symp., 286 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

89

Field failures of electronic systems : Lars Rimestad. Proc. A. Reliab. Maintainab. Symp., 528 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

90

Radio network modeling using criticality and conditional probability theory : P. A. Roman and B. W. Simms. Proc. A. Reliab. Maintainab. Symp., 140 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

91

Analysis of logistic supportability for complex systems : David E. Mortin. Proc. A. Reliab. Maintainab. Symp., 250 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 252 KB

english, 1991

92

Exact reliability formula for consecutive-k-out-of-n:F systems with homogeneous Markov dependence: Guangping Ge and Lishu Wang. IEEE Trans. Reliab.39(5), 600 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

93

A linear-time algorithm to compute the reliability of planar cube-free networks : Themistocles Politof and A. Satyanarayana. IEEE Trans. Reliab.39(5), 557 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

94

Reliability demonstration test and OC curves for attribute data : Toni Lin and Michael D. Holbrook. Computers ind. Engng20(1), 1 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

95

On the increase of system reliability by parallel redundancy : K. Shen and M. Xie. IEEE Trans. Reliab.39(5), 607 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

96

Petri Nets in dynamic process planning : K. Srihari and C. R. Emerson. Computers ind. Engng19(1–4), 447 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

97

Manufacturing system control with Petri nets in cellular manufacturing systems : Sheng-Hsien Teng and J. T. Black. Computers ind. Engng19(1–4), 150 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

98

A redundant metal-polyimide thin film interconnection process for wafer scale dimensions : Timothy L. Michalka, Wieslaw Lukaszek and Janes D. Meindl. IEEE Trans. Semicond. Mfg3(4), 158 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

99

Defect cluster analysis for wafer-scale integration : Paul R. Pukite and Claude L. Berman. IEEE Trans. Semicond. Mfg3(3), 128 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

100

Equilibrium distributions of finite-state Markov processes : IEEE Trans. Reliab.39(5), 592 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

101

Availability formulae for standby systems of similar units that are preventively maintained : Terje Aven. IEEE Trans. Reliab.39(5), 603 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

102

Reliability of voting in fault-tolerant software systems for small output-spaces : David F. McAllister, Chien-En Sun and Mladen A. Vouk. IEEE Trans. Reliab.39(5), 524 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

103

Comment on: reliability of modified designs—a Bayes analysis of an accelerated test of electronic assemblies : William A. Ganter. IEEE Trans. Reliab.39(5), 520 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

104

Robust minimum-distance estimation using the 3-parameter Weibull distribution : IEEE Trans. Reliab.39(5), 575 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

105

India's high-tec microelectronics revolution : Arvind Singhal and Everett M. Rogers. Telematics Informatics7(2), 151 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

106

The use environments of electronic assemblies and their impact on surface mount solder attachment reliability : Werner Engelmaier. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 903 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

107

Statistical equipment modeling for VLSI manufacturing: an application for LPCVD : Kuang-Kuo Lin and Costas J. Spanos. IEEE Trans. Semicond. Mfg3(4), 216 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 120 KB

english, 1991

108

Proptotype packages in aluminum nitride for high performance electronic systems : Kevin J. Lodgeet al. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 633 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 249 KB

english, 1991

109

Loop wiring cuts costs, enhances reliability : Tsutomu Sakurai and Yoshifumi hari. JEE (Japan)99 (August 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

110

New polymeric multilayer substrates and packaging : H. Ohdaira, K. Yoshida and K. Sasaoka. Circuit Wld17(2), 2 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

111

Applications of magnetic levitation based micro-automation in semiconductor manufacturing : Ilene J. Busch-Vishniac. IEEE Trans. Semicond. Mfg3(3), 109 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

112

A rule-based VLSI process flow validation system with macroscopic process simulation : Kiyohiko Funakoshi and Kazushi Mizuno. IEEE Trans. Semicond. Mfg3(4), 239 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

113

A new technique for testing TAB bonded LSIs in the Gigahertz frequency range : Taichi Kon, Shinichi Sasaki and Riyo Konno. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 682 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

114

Surface active buffered hydrogen fluoride having excellent wettability for ULSI processing : Hirohisa Kikuyama, Nobohiro Miki, Kiyonori Saka, Jun Takano, Chiro Kawanabe, Masayuki Miyashita and Tadarhiro Ohmi. IEEE Trans. Semicond. Mfg3(3), 99 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

115

Flip-chip soldering to bare copper circuits : Anthony P. Ingraham, Jack M. McCreary and Jack A. Varcoe. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 656 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 131 KB

english, 1991

116

Development of copper wire bonding application technology : Kenji Toyozawa, Kazuya Fujita, Syozo Minamide and Takamichi Maeda. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 667 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

117

Implementation of tungsten metallization in multilevel interconnection technologies : Paul E. Riley, Thomas E. Clark, Edward F. Gleason and Marion M. Garver. IEEE Trans. Semicond. Mfg3(4), 150 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

118

Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films : Lisa Maiocco, Donna Smyers, Paul R. Munroe and Ian Baker. IEEE Trans. Compon. Hybrids mfg Technol.13(3), 592 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

119

Self-aligned flip-chip assembly of photonic devices with electrical and optical connections : Michael J. Wale and Colin Edge. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 780 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

120

Large scale multilayer glass-ceramic substrate for supercomputer : Yuzo Shimadaet al. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 751 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

121

Computation of transients in Lossy VLSI packaging interconnections : J. C. Liao, Olgierd A. Palusinki and J. L. Prince. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 833 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

122

Optical components—the new challenge in packaging : Michael R. Matthews, Brian M. MacDonald and Keith R. Preston. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 798 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

123

The impact of packaging on the reliability of flip-chip solder bonded devices : Kevin J. Lodge and David J. Pedder. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 847 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

124

A review of thermal enhancement techniques for electronic systems : Leroy S. Fletcher. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 1012 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

125

Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets : Karl J. Puttlitz. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 647 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

126

New method of water cleaning for circuit substrate : Nao Takayama, Tomiji Sugiyama and Kazuhiko Takahashi. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 685 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

127

Improved and new surface analysis and depth profiling methods for the analysis of semiconductor technology problems : R. V. Criegern. Vacuum41(7–9), 1611 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 255 KB

english, 1991

128

SIMOX devices and circuits : C. E. Daniel Chen. Vacuum42(5/6), 383 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

129

PC chip sets reduce chip count : Chris Terry. EDN. 57 (1 October 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

130

Quality monitoring of continuous flow processes : John R. English, Murali Krishnamurthi and Tep Sastri. Computers ind. Engng20(2), 251 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

131

Development of a methodology for evaluating computer integrated manufacturing (CIM) implementation performance : Silvanus J. Udoka and John W. Nazemetz. Computers ind. Engng19(1–4), 145 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

132

Simulation of three-dimensional effects in VLSI devices : P. Ciampolini, A. Pierantoni, A. Forghieri and G. Bacarani. Microelectron. J.21(6), 5 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

133

Characterization of electromigration parameters in VLSI metallizations by 1tf noise measurements: Zeynep Celik-Butler, Wiyi Yang, Hoang H. Hoang and William R. Hunter, Solid-St. Electron.34(2), 185 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

134

The use of simulation in semiconductor technology development : D. C. Coleet al. Solid-St. Electron.33(6), 591 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

135

Revised theory of linearly-graded silicon junctions: an analytical approach : Andrei P. Silard and Miron J. Duta. Solid-St. Electron.34(2), 167 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

136

Electron-polariton interactions in submicron semiconductor structures : M. V. Burtyka, O. V. Flukhov and V. M. Yakovenko. Solid-St. Electron.33(11), 1339 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

137

Studies of some wide gap II–VI semiconductor based p-n junctions: S. Chaudhuri, A. Dhar and A. K. Pal. Vacuum41(4–6), 853 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

138

The epitaxial growth on CaF2 and BaF2 single-crystal films on a sapphire substrate : M. Barkai, E. Grunbaum and G. Deutscher. Vacuum41(4–6), 847 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

139

Enhanced reliability in Si MOSFETs with channel lengths under 0.2 micron : Lindor Henrickson, Zezhong Peng, Jeffrey Frey and Neil Goldsman. Solid-St. Electron.33(10), 1275 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

140

The chemically deposited layers as a diffusion source in microelectronics : Tyadeusz Budzynski and Piotr B. Grabiec. Electron Technol.22(1/4), 55 (Warsaw 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

141

Low pressure chemical vapour deposition of silicon and germanium on silicon using contamination-minimized processing : N. Mikoshiba, J. Murota and A. Korhase. Vacuum41(4–6), 1087 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

142

Study of avalanche multiplication in planar-terminated junctions : J. Askhtar and S. Ahmad. Solid-St. Electron.33(11), 1459 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 128 KB

english, 1991

143

Selective CVD of germanium on silicon and its applications : A. Kohlhase, M.-L. Cheng, S. Kobayashi, J. Murota and N. Mikoshiba. Vacuum42(4), 269 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 250 KB

english, 1991

144

Rie-induced damage in MOS structures : A. De Dioset al. Solid-St. Electron33(11), 1419 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 124 KB

english, 1991

145

Optical generation and radiative recombination parameters for energy models of carrier transport in direct gap semiconductors : C. C. McAndrew, E. L. Heasell and K. Singhal. Solid-St. Electron.33(11), 1367 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 124 KB

english, 1991

146

Influence of the surface electron processes on the kinetics of silicon etching by fluorine atoms : Yu E. Babanov, A. V. Prokaznikov and V. B. Svetovoy. Vacuum41(4–6), 902 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 124 KB

english, 1991

147

Silicon wafer preparation for low-temperature selective epitaxial growth : Carl Galewski, Jen-Chung Lou and William G. Oldham. IEEE Trans. Semicond. Mfg3(3), 93 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

148

ESCA and SEXAFS investigations of insulating materials for ULSI microelectronics : J. Finster, E-D. Klinkenberg, J. Heeg and W. Braun. Vacuum41(7–9), 1586 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

149

Growth and properties of GaSb, Ga1−xInxSb and Ga1−xAlxSb epilayers by MOCVD: Fuh Shyang Juang and Yun Kuin Su. Prog. Crystal Growth Charact.20, 285 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 124 KB

english, 1991

150

Hybrid IC technologies promote miniature equipment design : Ken-Ichi Hattori. JEE (Japan), 56 (December 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

151

High performance screen printable silicone as selective hybrid IC encapsulant : C. P. Wong. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 759 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

152

Hybrid technology creates ICs with dual strength : JEE (Japan), 50 (December 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

153

Hybrid ICs and SMT: competing or compatible technologies? : Akihiro Tanaka. JEE (Japan), 60 (December 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

154

Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management : Edward L. Rich III, Angela J. Martin, Theresa M. Lengel, John J. Stewart and Stephen A. Gallo. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 639 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

155

Creep of thin metallic films : F. R. Brotzen, C. T. Rosenmayer, C. G. Cofer and R. J. Gale. Vacuum41(4–6) 1287 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

156

Charges and defects in SiO2 films deposited by plasma-enhanced chemical vapor deposition at low temperatures : B. K. Ip, K. C. Kao and D. J. Thomson. Solid-St. Electron.34(2) 123 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 126 KB

english, 1991

157

Range of high energy phosphorus and medium energy boron ions implanted in polymers : D. Tsoukalas. Solid-St. Electron.33(6), 639 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 251 KB

english, 1991

158

Joint project produces anti-static film for electron beam lithography : JEE (Japan), 66 (November 1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

159

Optical and electrical investigation of ion bombarded GaAs : Ashok Vaseashtaet al. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 617 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

160

Atomic layer growth of GaAs by molecular beam epitaxy using desorption of excess Ga atoms : N. Sugiyama, T. Isu, T. Kamijoh, Y. Kajikawa and Y. Katayama. Vacuum41(4–6), 915 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 127 KB

english, 1991

161

Dry etching of III–V semiconductors: influence of substrate temperature on the anisotropy and induced damage : P. Van Daele, D. Lootens and P. Demeester. Vacuum41(4–6), 906 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

162

Dry processing in microelectronics: towards low pressure plasma technology : M. Pichot. Vacuum41(4–6), 895 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

163

Multi-quantum well modulator arrays fabricated by gas source MBE : G. J. Davies, E. G. Scott, M. H. Lyons and M. A. Z. Rejman-Greene. Vacuum41(4–6), 923 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

164

One-step surface implantation and reaction by laser irradiation of multistructures deposited on Si and Ge samples : V. Craciun, I. N. Mihailescu, I. Ursu, G. Leggieri, A. Luches, M. Martino and E. Radiotis. Vacuum41(4–6), 912 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

165

Mechanisms of defect formation and growth during thermal ramping and annealing in oxygen implanted silicon-on-insulator material : S. J. Krause, C. O. Jung, T. S. Ravi and D. E. Burke. Vacuum42(5/6), 349 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 215 KB

english, 1991

166

Silicon metallization by synchrotron-radiation-induced W(CO)6 surface reaction : R. Zanoni, M. N. Piancastelli, M. Marsi and G. Margaritondo. Solid-St. Commun.76(11), 1239 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 90 KB

english, 1991

167

Damage in silicon caused by magnetron ion etching and its recovery effect : Minoru Hirai, Hiroaki Iwakuro, Jun-Ichi Ohno and Tsukasa Kuroda. IEEE Trans. Compon. Hybrids mfg Technol.13(4), 629 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

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english, 1991

168

Defects in high-dose oxygen implanted silicon: a TEM study : A. De Veirman and J. Van Landuyt, J. Vanhellemont, H. E. Maes and K. Yallup. Vacuum42(5/6), 367 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 90 KB

english, 1991

169

A high energy ion scattering/channeling and low energy ion scattering apparatus for surface analysis : Fumiya Shoji, Kenjiro Oura and Teruo Hanawa. Vacuum42(3), 189 (1991)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 90 KB

english, 1991

170

Oxide implantation for threshold voltage control : Hans P. Zappe, Sheldon Aronowitz and Chenming HU. Solid-St. Electron.33(11), 1447 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 90 KB

english, 1991

171

4954772 Test method of an electrostatic breakdown of a semiconductor device and an apparatus therefor

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 84 KB

english, 1991

172

4955131 Method of building a variety of complex high performance IC devices

LouisEdmond Chall

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 84 KB

english, 1991

173

4956602 Wafer scale testing of redundant integrated circuit dies

WilliamJ Parrish

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 173 KB

english, 1991

174

4956604 Broad band contactor assembly for testing integrated circuit devices

Nicholas Cedrone

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 91 KB

english, 1991

175

4959507 Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof

Tadashi Tanaka, Kazuo Matsumura, Hirosh Komorita, Nobuyuki Mizunoya

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 91 KB

english, 1991

176

4960489 Method for self-aligned manufacture of contacts between interconnects contained in wiring levels arranged above one another in an integrated circuit

Guenther Roeska, Josef Winnerl, Franz Neppl

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 91 KB

english, 1991

177

4961050 Test fixture for microstrip assemblies

WarrenK Harwood, KeithE Jones, Daniel DeLessert

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 84 KB

english, 1991

178

4961052 Probing plate for wafer testing

Tetsuo Tada, Ryoich Takagi, Masanobu Kohara

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 84 KB

english, 1991

179

4961053 Circuit arrangement for testing integrated circuit components

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 84 KB

english, 1991

180

4961812 Etch-back apparatus for integrated circuit failure analysis

William Baerg, ValluriR Rao

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 172 KB

english, 1991

181

4962461 Method for the reproducable formation of material layers and/or the treatment of semiconductor materials layers

Meinhard Meyer, Oswald Stormer

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 88 KB

english, 1991

182

4963824 Diagnostics of a board containing a plurality of hybrid electronic components

EdwardP Hsieh, MauriceT McMahon, HenriD Schnurmann

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 88 KB

english, 1991

183

4963825 Method of screening eprom-related devices for endurance failure

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 96 KB

english, 1991

184

A relational database for semiconductor device parametric data : Jery Harvey and Eugene Dyatlovitsky. IEEE Trans. Semicond. Mfg3(3), 136 (1990)

Journal:

Microelectronics Reliability

Year:

1991

Language:

english

File:

PDF, 130 KB

english, 1991

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