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Volume 37; Issue 3
Main
Microelectronics Reliability
Volume 37; Issue 3
Microelectronics Reliability
Volume 37; Issue 3
1
Long-run availability of a repairable parallel system
E.J. Vanderperre
,
S.S. Makhanov
,
Sunthorn Suchatvejapoom
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 208 KB
Your tags:
english, 1997
2
Die attach failures related to wafer back metal processing—an AES study
M.K. Radhakrishnan
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 179 KB
Your tags:
english, 1997
3
A new formula and an algorithm for reliability analysis of networks
Lian-Chang Zhao
,
Fan-Jia Kong
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 523 KB
Your tags:
english, 1997
4
Comparisons of block diagram and Markov method system reliability and mean time to failure results for constant and non-constant unit failure rates
B.S. Dhillon
,
N. Yang
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 266 KB
Your tags:
english, 1997
5
A maintenance model for two-unit redundant system
Yeh Lam
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 481 KB
Your tags:
english, 1997
6
Some characteristics of a man-machine system operating subject to different weather conditions
G.S. Mokaddis
,
M.L. Tawfek
,
S.A.M. Elhssia
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 230 KB
Your tags:
english, 1997
7
A design of experiment analysis of serial EEPROM endurance
D. Wilkie
,
R. Drwinga
,
E. Eichman
,
N. Kunnari
,
B. Negley
,
D. Richardson
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 367 KB
Your tags:
english, 1997
8
Optimal replacement of an item subject to cumulative damage under periodic inspections
Myung B. Kong
,
Kyung S. Park
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 390 KB
Your tags:
english, 1997
9
Cast: An electrical stress test to monitor single bit failures in flash-EEPROM structures
P. Cappelletti
,
R. Bez
,
D. Cantarelli
,
D. Nahmad
,
L. Ravazzi
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 495 KB
Your tags:
english, 1997
10
Enumeration of minimal cuts of modified networks
J.M. Nahman
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 170 KB
Your tags:
english, 1997
11
The methods of reduction in network reliability computing
Wenyi Wang
,
Hongfen Zhang
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 293 KB
Your tags:
english, 1997
12
Advanced hand calculations for fault tree analysis and synthesis
Winfrid G. Schneeweiss
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 716 KB
Your tags:
english, 1997
13
Fuzzy multi-objective optimization decision-making of reliability of series system
H.-Z. Huang
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 218 KB
Your tags:
english, 1997
14
Reliability prediction of imperfect switching systems subject to multiple stresses
J.N. Pan
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 434 KB
Your tags:
english, 1997
15
The symmetric M/G/k loss system with heterogeneous servers
D. Fakinos
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
Your tags:
english, 1997
16
An inspection model with generally distributed restoration and repair times
James Fung
,
Viliam Makis
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 570 KB
Your tags:
english, 1997
17
Process capability analysis for non-normal relay test data
J.N. Pan
,
S.L. Wu
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 551 KB
Your tags:
english, 1997
18
A symbolic reliability of multiple path required system with three states
In-Kyeong Choi
,
Jai-Sang Koh
,
So-Yeon Lee
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 430 KB
Your tags:
english, 1997
19
A combined fuzzy-logic and physics-of-failure approach to reliability prediction : Marius Bazu. IEEE Transactions on Reliability, 44 (2), 237 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 88 KB
Your tags:
english, 1997
20
Reliability and quality in design : William A. Golomski. IEEE Transactions on Reliability, 44 (2), 216 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 88 KB
Your tags:
english, 1997
21
A changing paradigm in quality : Hilario L. Oh. IEEE Transactions on Reliability, 44 (2) 265 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 88 KB
Your tags:
english, 1997
22
Tutorial: corrosion of metallic materials : Martin Tullmin and Pierre R. Roberge. IEEE Transactions on Reliability, 44 (2) 271 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 199 KB
Your tags:
english, 1997
23
Electrical characteristics of various contact contaminations : Christian N. Neufeld and Werner F. Rieder. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 369 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
24
Effective erosion rates for selected contact materials in low-voltage contactors : M. Bruce Schulman, Paul G. Slade and John A. Bindas. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 329 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
25
Modelling intermediate tests for fault-tolerant multichip module systems : Sungsoo Kim and Fabrizio Lombardi. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18 (3), 448 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 225 KB
Your tags:
english, 1997
26
Reliability of electrically conducting knife-edge bearings of switches : Thomas J. Schopf and Werner F. Rieder. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 390 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
27
A test chip design for detecting thin-film cracking in integrated circuits : Stephen A. Gee, Martin R. Johnson and Kuan L. Chen. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 478 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
28
Microstructure of conductive anodic filaments formed during accelerated testing of printed wiring boards : W. J. Ready, S. R. Stock, G. B. Freeman, L. L. Dollar and L. J. Turbini. Circuit World, 21 (4), 5 (1955).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
29
Moisture sensitivity and reliability of plastic thermally enhanced QFP packages : Laurene Yip. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 485 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
30
A correlation study between different types of CDM testers and ‘real’ manufacturing in-line leakage failure : Michael D. Chaine, Chen Teck Liong and Ho Fock San. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2) 295 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 115 KB
Your tags:
english, 1997
31
Solder joint reliability of large plastic ball grid array assemblies under bending, twisting, and vibration conditions : J. Lau, K. Gratalo, E. Schneider, T. Marcotte and T. Baker. Circuit World, 22 (1), 27 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 115 KB
Your tags:
english, 1997
32
Stochastic modelling of aggregates and products of variable failure rates : N. Singh. IEEE Transactions on Reliability, 44 (2), 279 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 115 KB
Your tags:
english, 1997
33
Unreplicated experimental designs in reliability-growth programmes : Claudio Benski and Emmanuel Cabau. IEEE Transactions on Reliability, 44 (2), 199 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 115 KB
Your tags:
english, 1997
34
A device life cycle analysis of the WSI associative string processor : Christopher Peacock, Hamid Bolouri and R. Mike Lea. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18 (3), 406 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
35
Optimal design of flexible and reliable process systems : Thomas V. Thomaidis and Efstratios M. Pistikopoulos. IEEE Transactions on Reliability, 44 (2), 243 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
36
Defect and fault tolerant interconnection strategies for WASP devices : Mohammed B. A. Hussaini, Hamid Bolouri and R. Mike Lea. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 416 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
37
Using statistically designed experiments to improve reliability and to achieve robust reliability : Michael Hamada. IEEE Transactions on Reliability, 44 (2), 206 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 225 KB
Your tags:
english, 1997
38
Joint reliability-importance of components : Michael J. Armstrong. IEEE Transactions on Reliability, 44 (3), 408 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
39
Quality engineering (Taguchi Methods) for the development of electronic circuit technology : Genichi Taguchi (translated by Shih-Chung Tsai). IEEE Transactions on Reliability, 44 (2), 225 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
40
Cosmic ray induced failures in high power semiconductor devices : H. R. Zeller. Solid-State Electronics, 38 (12), 2041 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
41
Best linear unbiased estimator of the Rayleigh scale parameter based on fairly large censored samples : A. Adatia. IEEE Transactions on Reliability, 44 (2), 302 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
Your tags:
english, 1997
42
Analysis of screening data by using Weibull distribution : Kazuhiro Tsurumaru and Hirokazu Yukawa. Proceedings (Condensed Version) 24th Symposium on Reliability and Maintainability, JUSE, Tokyo, Japan, 41 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
Your tags:
english, 1997
43
A study of technical terms of failure and fuzzy set theory : Tadashi Muratoa and Shinji Hatano. Proceedings (Condensed Version) 24th Symposium on Reliability and Maintainability, JUSE, Tokyo, Japan, 57 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
Your tags:
english, 1997
44
Compound Poisson approximation in reliability theory : Andrew D. Barbour, Ourania Chryssaphinou and Malgorzata Roos. IEEE Transactions on Reliability, 44 (3), 398 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
Your tags:
english, 1997
45
A methodology and design tools to support system-level VLSI design : Kayhan Kucukcakar and Alice C. Parker. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3 (3), 355 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
Your tags:
english, 1997
46
Differential BiCMOS logic circuits: fault characterization and design-for-testability : S. Hessabi, M. Y. Osman and M. I. Elmasry. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3 (3), 437 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 222 KB
Your tags:
english, 1997
47
Quick inspection of power plane short fault on multilayer substrate : Fang-Lin Chao and Ruey-Beei Wu. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 466 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
Your tags:
english, 1997
48
Popcorning: a failure mechanism in plastic-encapsulated microcircuits : Anthony A. Gallo and Ramesh Munamarty. IEEE Transactions on Reliability, 44 (3), 362 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
Your tags:
english, 1997
49
Thermal fatigue behaviour of J-lead solder joints : Charles G. Schmidt, Jeffrey W. Simons, Christine H. Kanazawa and David C. Erlich. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 611 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 227 KB
Your tags:
english, 1997
50
Unavailability analysis of periodically tested standby components : J. K. Vaurio. IEEE Transactions on Reliability, 44 (3), 512 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
51
Intelligent materials in future electronics : Kiyoshi Tahahashi and Shinji Nozaki. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 245 (June 1955).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 226 KB
Your tags:
english, 1997
52
Low-cost flip-chip bonding on FR-4 boards : J. Kloeser, E. Zakel and H. Reichl. Circuit World, 22 (1), 18 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
53
296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect : Praveen Jain. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 463 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
54
Ultra-clean processing for ULSI : Tadahiro Ohmi. Microelectronics Journal, 26, 595 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
55
Designing-in of quality through axiomatic design : Nam P. Suh. IEEE Transactions on Reliability, 44 (2), 256 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 224 KB
Your tags:
english, 1997
56
Design of 0.35-mm pitch QFP lead and its assembly technology : Makoto Totani et al. IEEE Transactions on Components, Packing and Manufacturing Technology, Part B, 18 (3), 456 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
Your tags:
english, 1997
57
A shear-based optimization of adhesive thickness for die bonding : Karl E. Hokanson and Avram Bar-Cohen. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 578 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
Your tags:
english, 1997
58
A study of polyimide adhesion to epoxy resin in PFP using multivariate analysis of XPS spectra : Kohgichi Takeuchi, Naganori Tsutsui and Nobuhito Miura. Proceedings of the 24th Symposium on Reliability and Maintainability, Japan, 75 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
Your tags:
english, 1997
59
Advanced low-cost bare-DIE packaging technology for liquid crystal displays : Jackson C. Hwang. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18 (3), 458 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 117 KB
Your tags:
english, 1997
60
Low-temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost sealed chip-on-board (SCOB) assemblies : Ronald M. Kubacki. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 471 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 117 KB
Your tags:
english, 1997
61
Low-cost multichip modules : Michael Dobers, Martin Seyffert, Frank D. Hauschild and Claus-Peter Czaya. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 462 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 117 KB
Your tags:
english, 1997
62
Development of 0.45-mm thick ultra-thin small outline package : Susumo Omi et al. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B, 18 (3), 471 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 227 KB
Your tags:
english, 1997
63
Gas-assisted evaporative cooling of high density electronic modules : Avram Bar-Cohen, Greg Sherwood, Marc Hodes and Gary Solbreken. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 502 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
Your tags:
english, 1997
64
A VLSI priority packet queue with inheritance and overwrite : Dan Picker and Ronald D. Fellman. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3 (2), 245 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
65
A wafer level testability approach based on an improved scan insertion technique : Christiana Bolchini et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 438 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
66
Evaluation methods of ion migration by dew condensation cycle test : Yuuichi Oaki, Tanaka Hirokazu, Yamamoto Shigeharu and Obata Osamu. Proceedings or the 24th Symposium on Reliability and Maintainability, Japan, 7 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 224 KB
Your tags:
english, 1997
67
Failure mode analysis of AlGaAs/GaAs HBTs using electrostatic discharge method : Yorio Ota, Manabu Yanagihara and Morio Nakamura. Solid-State Electronics, 38 (12), 2005 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
Your tags:
english, 1997
68
An empirical model for early resistance changes due to electromigration : J. Niehof, H. C. de Graaff, A. J. Mouthaan and J. F. Verwey. Solid-State Electronics, 38 (10), 1817 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
Your tags:
english, 1997
69
Surface related degradation of InP-based HEMTs during thermal stress : Y. Ashizawa, C. Nozaki, T. Noda, A. Sasaki and S. Fujita. Solid-State Electronics, 38 (9), 1627 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
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english, 1997
70
Electrical characterisation of integrated circuit metal line thickness : Santos Mayo and Harry A. Schafft. Solid-State Electronics, 38 (12), 1993 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 217 KB
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english, 1997
71
Microcrystalline silicon thin films prepared by RF reactive magnetron sputter deposition : M. F. Cerqueria, M. Andritschky, L. Rebouta, J. A. Ferreira and M. F. Da Silva. Vacuum, 46 (12), 1385 (December 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
Your tags:
english, 1997
72
Some fundamental aspects of UV laser direct imaging : J. H. Choi. Circuit World, 21 (4), 18 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
Your tags:
english, 1997
73
A new gate current measurement technique for the characterization of hot-carrier induced degradation in MOSFETs : S. E. Leang, W. K. Chim and D. S. H. Chan. Solid-State Electronics, 38 (10), 1791 (1955).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
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english, 1997
74
Solder paste for fine line printing in hybrid microelectronics : Dubravka Rocak, Vinko Stopar and Janeta Fajfar Plut. Microelectronics Journal, 26, 441 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
Your tags:
english, 1997
75
Selective reactive ion etching on PECVD silicon nitride over amorphous silicon in CF4/H2 and nitrogen containing CF4/H2 plasma gas mixtures : M. Jagadesh Kumar and Savvas G. Chamberlain. Electronics, 39 (1), 33 (1996).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 163 KB
Your tags:
english, 1997
76
Ionized dopant concentrations in silicon—an analytical approach : H. Norde. Solid-State Electronics, 38 (12), 2059 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 58 KB
Your tags:
english, 1997
77
Deep-level trapping in ion-implanted InP JFETs : W. Kruppa and J. B. Boos. Solid-State Electronics, 38 (10), 1735 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 58 KB
Your tags:
english, 1997
78
A study on a method of testing ion migration : Yuko Kanai et al. Proceedings (Condensed Version) 24th Symposium on Reliability and Maintainability, JUSE, Tokyo, Japan, Z (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 58 KB
Your tags:
english, 1997
79
A test for the BMRL-t0 class
Seung Min Lee
,
Dong Ho Park
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 219 KB
Your tags:
english, 1997
80
The effect of minimal repairs on economic lot-sizing
J.S. Dagpunar
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 225 KB
Your tags:
english, 1997
81
A simple technique for obtaining the MTBF of complex systems through numerical integration of the reliability function
R.J. Burns
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 326 KB
Your tags:
english, 1997
82
Preservation of some partial orderings under non-homogeneous poisson shock model and laplace transform
Cheng Kan
,
Wang Wen Yi
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 279 KB
Your tags:
english, 1997
83
Goal-seeking problem in discrete event systems simulation
H. Arsham
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 413 KB
Your tags:
english, 1997
84
Introduction to multichip modules
Zoran Stamenković
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 58 KB
Your tags:
english, 1997
85
Failure mechanisms in AlGaAs/GaAs HEMTs : K. A. Christianson, C. Moglestue and W. T. Anderson. Solid-State Electronics, 38, 1623 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
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86
Reliability of printed wiring boards by thermal shock test : Tanaka Hjirokazu, Yuuichi Aoki and Yamamoto Shigeharu. Proceedings of the 24th Symposium on Reliability and Maintainability, Japan, 79 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
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87
Logic synthesis for reliability: an early start to controlling electromigration and hot-carrier effects : Jaushik Roy and Sharat Prasad. IEEE Transactions on Reliability, 44 (2), 251 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 115 KB
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88
Reliability analysis of accelerated life-test data from a repairable system : Maurizio Guida and Massimiliano Giorgio. IEEE Transactions on Reliability, 44 (2), 337 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 225 KB
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89
A system approach to reliability and life-cycle cost of process safety-systems : Lars Bodsberg and Per Hokstad. IEEE Transactions on Reliability, 44 (2), 179 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
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90
Reliability of a linear connected-(r, s)-out-of-(m, n): F lattice system : H. Yamamoto and M. Miyakawa. IEEE Transactions on Reliability, 44 (2), 333 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
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91
Reliability-estimation and stopping-rules for software testing, based on repeated appearance of bugs : Mark C. K. Yang and Anne Chao. IEEE Transactions on Reliability, 44 (2), 315 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
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92
Multiple fault diagnosis in combinational circuits : Enrico Macii and Tara Wolf. Computers Elect. Engng, 21 (5), 351 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 108 KB
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english, 1997
93
Nondestructive detection of defects in miniaturized multilayer ceramic capacitors using digital speckle correlation techniques : Y. C. Chan et al. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 677 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
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english, 1997
94
Bathtub failure rate and upside-down bathtub mean residual life : Jie Mi. IEEE Transactions on Reliability, 44 (3), 388 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
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english, 1997
95
Electrochemical processes resulting in migrated short failures in microcircuits : Gabor Harsanyi. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 602 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 116 KB
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96
Genetic algorithms in optimization of system reliability : Laura Painton and James Campbell. IEEE Transactions on Reliability, 44 (2), 172 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
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english, 1997
97
Statistical tools for the rapid development and evaluation of high-reliability products : William Q. Meeker and Michael Hamada. IEEE Transactions on Reliability, 44 (2), 187 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
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english, 1997
98
Chip scale package: ‘a lightly dressed LSI chip’ : Masatoshi Yasunaga et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18 (3), 451 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
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english, 1997
99
Studies on design of moisture proof packing for IC packages : Hidetoshi Kusano and Kenji Sasaki. Proceedings (Condensed Version) 24th Symposium on Reliability and Maintainability, JUSE, Tokyo, Japan, 69 (6–8 July 1994).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
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english, 1997
100
Approaches to electronic miniaturization : H. M. B. Bird. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 274 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 117 KB
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english, 1997
101
Influence of process parameter variations on the signal distribution behaviour of wafer scale integration devices : Thomas Gneiting and Ian P. Jalowiecki. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 424 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
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english, 1997
102
Thermal-mechanical enhanced high-performance silicone gels and elastomeric encapsulants in microelectronic packaging : C. P. Wong. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (2), 270 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 113 KB
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english, 1997
103
Behaviour of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering : Sheng Liu and Yuhai Mei. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18 (3), 634 (September 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 225 KB
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english, 1997
104
Test vehicle for a wafer-scale field programmable gate array : Benoit Dufort and Glenn H. Chapman. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18 (3), 431 (August 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
Your tags:
english, 1997
105
Efficient network folding techniques for routing permutations in VLSI : Hussein M. Alnuweiri and Sadiq M. Sait. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 3 (2), 254 (June 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 114 KB
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english, 1997
106
Bulk micromachining of Si by lithography and reactive ion etching (LIRIE) : I. W. Rangelow, P. Hudek and F. Shi. Vacuum, 46 (12), 1361 (December 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 112 KB
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english, 1997
107
The dependence of etch rate of photo-CVD silicon nitride films on NH4F content in buffered HF : V. K. Rathi, Manju Gupta and O. P. Agnihotri. Microelectronics Journal, 26, 563 (1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
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english, 1997
108
A method for determining the fast neutral portion of ion beams : M. Nedialkov, V. Zinenko and D. Karpuzov. Vacuum, 46 (12), 1455 (December 1995).
Journal:
Microelectronics Reliability
Year:
1997
Language:
english
File:
PDF, 107 KB
Your tags:
english, 1997
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