Volume 42; Issue 12

Microelectronics Reliability

Volume 42; Issue 12

1

Atomic-layer-deposited silicon-nitride/SiO2 stack––a highly potential gate dielectrics for advanced CMOS technology

Anri Nakajima, Quazi D.M Khosru, Takashi Yoshimoto, Shin Yokoyama

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 742 KB

english, 2002

2

On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors

V.O Balitska, B Butkievich, O.I Shpotyuk, M.M Vakiv

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 127 KB

english, 2002

3

Encapsulation of naked dies for bulk silicon etching with TMAH

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 383 KB

english, 2002

4

Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantation

B.L Yang, N.W Cheung, S Denholm, J Shao, H Wong, P.T Lai, Y.C Cheng

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 287 KB

english, 2002

5

Anisotropic conductive film flip chip joining using thin chips

Erja Jokinen, Eero Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 212 KB

english, 2002

6

Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 112 KB

english, 2002

7

Solder joint reliability of a polymer reinforced wafer level package

Deok-Hoon Kim, Peter Elenius, Michael Johnson, Scott Barrett

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 795 KB

english, 2002

8

Testing process capability for one-sided specification limit with application to the voltage level translator

P.C. Lin, W.L. Pearn

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 131 KB

english, 2002

9

Procedure for design optimization of a T-cap flip chip package

Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 467 KB

english, 2002

10

Open contact analysis of single bit failure in 0.18 μm technology

Zhigang Song, Jiyan Dai, Shailesh Redkar

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 265 KB

english, 2002

11

Failure criteria of flip chip joints during accelerated testing

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 247 KB

english, 2002

12

Reliability studies and design improvement of mirror image CSP assembly

Dongji Xie, Sammy Yi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 474 KB

english, 2002

13

Integrated process capability analysis with an application in backlight module

M.L. Huang, K.S. Chen, Y.H. Hung

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 200 KB

english, 2002

14

Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay

Sunit Rane, Vijaya Puri

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 168 KB

english, 2002

15

An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements

Shoucai Yuan, Changchun Zhu

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 167 KB

english, 2002

16

Aging of the over-voltage protection elements caused by over-voltages

Predrag Osmokrovic, Boris Loncar, Srboljub Stankovic, Aleksandra Vasic

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 230 KB

english, 2002

17

An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulation

K.Y. Lim, X. Zhou

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 200 KB

english, 2002

18

Analysis of burn-in time using the general law of reliability

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 220 KB

english, 2002

19

International IEEE conference on the business of electronic product reliability and liability

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 49 KB

english, 2002

20

The optimization design of bump interconnections in flip chip packages from the electrical standpoint

De-Shin Liu, Chin-Yu Ni

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 317 KB

english, 2002

21

Effect of substrate flexibility on solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 543 KB

english, 2002

22

Author Index to Volume 42

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 48 KB

2002

23

Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects

Y.W Chiu, Y.C Chan, S.M Lui

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 271 KB

english, 2002

24

On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors

Dimitrios N Kouvatsos

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 574 KB

english, 2002

25

On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET’s

Boualem Djezzar

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 449 KB

english, 2002

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