Volume 42; Issue 3

Microelectronics Reliability

Volume 42; Issue 3

1

A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels

Didier Cottet, Michael Scheffler, Gerhard Tröster

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 416 KB

english, 2002

2

Impact of component placement in solder joint reliability

T Alander, S Nurmi, P Heino, E Ristolainen

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 269 KB

english, 2002

3

MOS characteristics of NO-grown oxynitrides on n-type 6H-SiC

S Chakraborty, P.T Lai, P.C.K Kwok

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 125 KB

english, 2002

4

Board level reliability of a stacked CSP subjected to cyclic bending

J.D Wu, S.H Ho, C.Y Huang, C.C Liao, P.J Zheng, S.C Hung

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 779 KB

english, 2002

5

1/f noise as a reliability indicator for subsurface Zener diodes

Yiqi Zhuang, Lei Du

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 100 KB

english, 2002

6

Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies

C.F Luk, Y.C Chan, K.C Hung

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 783 KB

english, 2002

7

Investigation and modeling of stressed thermal oxides

Domenico Caputo, Fernanda Irrera

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 156 KB

english, 2002

8

Multichannel mixed-mode IC for digital readout of silicon strip detectors

P. Gryboś, W. Dąbrowski, P. Hottowy, R. Szczygieł, K. Świentek, P. Wiącek

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 222 KB

english, 2002

9

A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride–oxide dielectrics

Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 150 KB

english, 2002

10

Temperature-dependent noise characterization and modeling of on-wafer microwave transistors

A. Caddemi, N. Donato

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 322 KB

english, 2002

11

Bump formation for flip chip and CSP by solder paste printing

Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 574 KB

english, 2002

12

The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline silicon

Yongseok Ahn, Sanghyun Lee, Gwanhyeob Koh, Taeyoung Chung, Kinam Kim

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 293 KB

english, 2002

13

Prediction of long-term thermal behavior of an irradiated SRAM based on isochronal annealing measurements

F. Saigné, O. Quittard, L. Dusseau, F. Joffre, C. Oudéa, J. Fesquet, J. Gasiot

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 192 KB

english, 2002

14

A thermo-mechanical study on the electrical resistance of aluminum wire conductors

De-Shin Liu, Chin-Yu Ni

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 368 KB

english, 2002

15

Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs

Juin J. Liou, R. Shireen, A. Ortiz-Conde, F.J. Garcı́a Sánchez, A. Cerdeira, X. Gao, Xuecheng Zou, C.S. Ho

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 397 KB

english, 2002

16

On-line testable data path synthesis for minimizing testing time

A.A. Ismaeel, R. Bhatnagar, R. Mathew

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 294 KB

english, 2002

17

A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verification

Guenther Benstetter, Michael W Ruprecht, Douglas B Hunt

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 662 KB

english, 2002

18

The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

T.Y. Lin, W.S. Leong, K.H. Chua, R. Oh, Y. Miao, J.S. Pan, J.W. Chai

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 165 KB

english, 2002

19

Recent developments in silicon optoelectronic devices

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 343 KB

english, 2002

20

Calendar of forthcoming events

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 38 KB

english, 2002