Volume 43; Issue 6

Microelectronics Reliability

Volume 43; Issue 6

1

Wafer level packaging having bump-on-polymer structure

John J.H. Reche, Deok-Hoon Kim

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 655 KB

english, 2003

2

The radiation sensitivity mapping of ICs using an IR pulsed laser system

B. Alpat, R. Battiston, M. Bizzarri, D. Caraffini, E. Fiori, A. Papi, M. Petasecca, A. Pontetti

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 224 KB

english, 2003

3

Hot electron induced degradation of undoped AlGaN/GaN HFETs

Hyungtak Kim, Alexei Vertiatchikh, Richard M. Thompson, Vinayak Tilak, Thomas R. Prunty, James R. Shealy, Lester F. Eastman

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 180 KB

english, 2003

4

Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE

F. Brunner, A. Braun, P. Kurpas, J. Schneider, J. Würfl, M. Weyers

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 187 KB

english, 2003

5

Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC process

William J. Rowe, Bruce M. Paine, Adele E. Schmitz, Robert H. Walden, Michael J. Delaney

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 178 KB

english, 2003

6

The effects of ternary alloys on thermal resistances of HBTs, HEMTs, and laser diodes

Bruce M. Paine, Ami P. Shah, Thomas Rust III

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 116 KB

english, 2003

7

Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares

Charles S. Whitman

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 121 KB

english, 2003

8

Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls

Po-Jen Zheng, J.Z. Lee, K.H. Liu, J.D. Wu, S.C. Hung

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 286 KB

english, 2003

9

Direct gold and copper wires bonding on copper

Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath III, Eric Beyne

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 697 KB

english, 2003

10

Improvement of integrated circuit testing reliability by using the defect based approach

Dominik Kasprowicz, Witold A. Pleskacz

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 244 KB

english, 2003

11

High-voltage pulse stressing of thick-film resistors and noise

I. Stanimirović, M.M. Jevtić, Z. Stanimirović

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 220 KB

english, 2003

12

Novel high performance CMOS current conveyor

Belén Calvo, Santiago Celma, Pedro A. Martı́nez, M. Teresa Sanz

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 194 KB

english, 2003

13

Room temperature plasma oxidation mechanism to obtain ultrathin silicon oxide and titanium oxide layers

J.C. Tinoco, M. Estrada, G. Romero

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 252 KB

english, 2003

14

Calendar of forthcoming events

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 38 KB

english, 2003

15

Editorial

Wallace T. Anderson, Roberto Menozzi

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 32 KB

english, 2003

16

High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for high-speed RF switch applications

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 562 KB

english, 2003

17

Thin dielectric reliability assessment for DRAM technology with deep trench storage node

R.-P. Vollertsen

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 392 KB

english, 2003

18

Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations

Takeshi Yanagisawa, Takeshi Kojima

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 109 KB

english, 2003

19

Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability

D.S. Liu, Y.C. Chao, C.H. Lin, G.S. Shen, H.S. Liu

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 453 KB

english, 2003

20

Manufacturing capability control for multiple power-distribution switch processes based on modified Cpk MPPAC

W.L. Pearn, Ming-Hung Shu

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 208 KB

english, 2003