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Volume 48; Issue 11-12
Main
Microelectronics Reliability
Volume 48; Issue 11-12
Microelectronics Reliability
Volume 48; Issue 11-12
1
Model for life prediction of fatigue–creep interaction
R. Valentín
,
Donald Barker
,
Michael Osterman
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 576 KB
Your tags:
english, 2008
2
A low power MEMS gas sensor based on nanocrystalline ZnO thin films for sensing methane
P. Bhattacharyya
,
P.K. Basu
,
B. Mondal
,
H. Saha
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 850 KB
Your tags:
english, 2008
3
Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint
Jeong-Won Yoon
,
Bo-In Noh
,
Young-Ho Lee
,
Hyo-Soo Lee
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.09 MB
Your tags:
english, 2008
4
Finite element model verification for packaged printed circuit board by experimental modal analysis
Ying-Chih Lee
,
Bor-Tsuen Wang
,
Yi-Shao Lai
,
Chang-Lin Yeh
,
Rong-Sheng Chen
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.61 MB
Your tags:
english, 2008
5
Consideration of temperature and current stress testing on flip chip solder interconnects
Alfred Yeo
,
Bernd Ebersberger
,
Charles Lee
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.63 MB
Your tags:
english, 2008
6
A novel approach to characterization of progressive breakdown in high-k/metal gate stacks
R. Pagano
,
S. Lombardo
,
F. Palumbo
,
P. Kirsch
,
S.A. Krishnan
,
C. Young
,
R. Choi
,
G. Bersuker
,
J.H. Stathis
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 804 KB
Your tags:
english, 2008
7
An automated approach for locating multiple faulty LUTs in an FPGA
T. Nandha Kumar
,
Chia Wai Chong
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 589 KB
Your tags:
english, 2008
8
Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer
Chia-Wei Hsu
,
Yean-Kuen Fang
,
Wen-Kuan Yeh
,
Chien-Ting Lin
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 589 KB
Your tags:
english, 2008
9
Effect of the pre-gate oxide cleaning temperature on the reliability of GOI and devices performances in deep submicron CMOS technology
Y.T. Chiang
,
Y.K. Fang
,
Y.J. Huang
,
T.H. Chou
,
S.Y. Yeh
,
C.S. Lin
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 629 KB
Your tags:
english, 2008
10
The degradation mechanisms in high voltage pLEDMOS transistor with thick gate oxide
Hong Wu
,
Weifeng Sun
,
Yangbo Yi
,
Haisong Li
,
Longxing Shi
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 234 KB
Your tags:
english, 2008
11
A fast mechanical test technique for life time estimation of micro-joints
G. Khatibi
,
W. Wroczewski
,
B. Weiss
,
T. Licht
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.02 MB
Your tags:
english, 2008
12
Improved sensing characteristics of MISiC Schottky-diode hydrogen sensor by using HfO2 as gate insulator
W.M. Tang
,
C.H. Leung
,
P.T. Lai
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 228 KB
Your tags:
english, 2008
13
Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method
Jeong-Won Yoon
,
Hyun-Suk Chun
,
Bo-In Noh
,
Ja-Myeong Koo
,
Jong-Woong Kim
,
Hoo-Jeong Lee
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.76 MB
Your tags:
english, 2008
14
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
Jong-Woong Kim
,
Jin-Kyu Jang
,
Sang-Ok Ha
,
Sang-Su Ha
,
Dae-Gon Kim
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 905 KB
Your tags:
english, 2008
15
Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
Banani Sen
,
B.L. Yang
,
Hei Wong
,
C.W. Kok
,
P.K. Chu
,
A. Huang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 677 KB
Your tags:
english, 2008
16
Diffusion barrier performance of Zr–N/Zr bilayered film in Cu/Si contact system
Ying Wang
,
Fei Cao
,
Ming-hui Ding
,
Yun-tao Liu
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 412 KB
Your tags:
english, 2008
17
Investigation of charge trapping/de-trapping induced operation lifetime degradation in triple SuperFlash® memory cell
Zigui Cao
,
Bo Zhang
,
Xiong Zhang
,
Elton Lee
,
Weiran Kong
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 598 KB
Your tags:
english, 2008
18
Electrical characteristics of MOSFETs with La2O3/Y2O3 gate stack
Parhat Ahmet
,
Kentaro Nakagawa
,
Kuniyuki Kakushima
,
Hiroshi Nohira
,
Kazuo Tsutsui
,
Nobuyuki Sugii
,
Takeo Hattori
,
Hiroshi Iwai
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 324 KB
Your tags:
english, 2008
19
Influence of underfill materials on the reliability of coreless flip chip package
Chun-Chih Chuang
,
Tsung-Fu Yang
,
Jin-Ye Juang
,
Yin-Po Hung
,
Chau-Jie Zhan
,
Yu-Min Lin
,
Ching-Tsung Lin
,
Pei-Chen Chang
,
Tao-Chih Chang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 903 KB
Your tags:
english, 2008
20
Calendar
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 54 KB
Your tags:
english, 2008
21
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes
Arindam Goswami
,
Bongtae Han
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 568 KB
Your tags:
english, 2008
22
Improved upper contacts PMMA on P3HT PTFTS using photolithographic processes
I. Mejia
,
M. Estrada
,
M. Avila
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 370 KB
Your tags:
english, 2008
23
A review of board level solder joints for mobile applications
E.H. Wong
,
S.K.W. Seah
,
V.P.W. Shim
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.19 MB
Your tags:
english, 2008
24
Self-testing of fully differential multistage circuits using common-mode excitation
Wojciech Toczek
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 391 KB
Your tags:
english, 2008
25
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 41 KB
Your tags:
english, 2008
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