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Volume 48; Issue 4
Main
Microelectronics Reliability
Volume 48; Issue 4
Microelectronics Reliability
Volume 48; Issue 4
1
Wim Claes, Willy Sansen, Robert Puers, ,Design of Wireless Autonomous Data-Logger ICs (2006) Springer,Dordrecht 1-4020-3208-0 pp. 199, Hardcover, plus XVI.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 63 KB
Your tags:
english, 2008
2
Dimitris Gizopoulos, Antonis Paschalis, Yervant Zorian, ,Embedded Processor-Based Self Test (2004) Kluwer Academic Publishers,Dordrecht 1-4020-2785-0 217 pp., Hardcover, plus XV.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 76 KB
Your tags:
english, 2008
3
The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging
C.K. Wong
,
J.H.L. Pang
,
J.W. Tew
,
B.K. Lok
,
H.J. Lu
,
F.L. Ng
,
Y.F. Sun
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.04 MB
Your tags:
english, 2008
4
Leaky modes of optical waveguides with varied refractive index for microchip optical interconnect applications – Asymptotic solutions
Jianxin Zhu
,
Zhihua Chen
,
Shuyuan Tang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 177 KB
Your tags:
english, 2008
5
Effect of surface finish material on printed circuit board for electrochemical migration
Bo-In Noh
,
Jong-Bum Lee
,
Seung-Boo Jung
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 913 KB
Your tags:
english, 2008
6
A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFET
M.Z. Dai
,
S.I. Kim
,
Andrew Yap
,
Shaohua Liu
,
Arthur Cheng
,
Leeward Yi
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 337 KB
Your tags:
english, 2008
7
Effects of length scaling on electromigration in dual-damascene copper interconnects
M.H. Lin
,
M.T. Lin
,
Tahui Wang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1014 KB
Your tags:
english, 2008
8
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies
O. Nousiainen
,
L. Lehtiniemi
,
T. Kangasvieri
,
R. Rautioaho
,
J. Vähäkangas
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.31 MB
Your tags:
english, 2008
9
Effects of the metal gate on the stress-induced traps in Ta2O5/SiO2 stacks
E. Atanassova
,
A. Paskaleva
,
N. Novkovski
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 274 KB
Your tags:
english, 2008
10
Degradation of n-channel a-Si:H/nc-Si:H bilayer thin-film transistors under DC electrical stress
N. Arpatzanis
,
A.T. Hatzopoulos
,
D.H. Tassis
,
C.A. Dimitriadis
,
F. Templier
,
M. Oudwan
,
G. Kamarinos
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 271 KB
Your tags:
english, 2008
11
Thermal impedance measurements under non-equilibrium conditions. How to extend its validity
F.N. Masana
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 154 KB
Your tags:
english, 2008
12
Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects
ZhenYu Wu
,
YinTang Yang
,
ChangChun Chai
,
YueJin Li
,
JiaYou Wang
,
Jing Liu
,
Bin Liu
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 697 KB
Your tags:
english, 2008
13
Investigation of hot carrier degradation in asymmetric nDeMOS transistors
Qingxue Wang
,
Lanxia Sun
,
Andrew Yap
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 151 KB
Your tags:
english, 2008
14
Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength
Jun He
,
Yongjin Guo
,
Zhongqin Lin
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 660 KB
Your tags:
english, 2008
15
Deposition of aerosol (“hygroscopic dust”) on electronics – Mechanism and risk
Michal Tencer
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 257 KB
Your tags:
english, 2008
16
Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings
Young Woo Lee
,
Ki Ju Lee
,
Y. Norman Zhou
,
Jae Pil Jung
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 2.22 MB
Your tags:
english, 2008
17
Effect of doping concentration on avalanche multiplication and excess noise factor in submicron APD
A.H. You
,
P.L. Cheang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 292 KB
Your tags:
english, 2008
18
Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectric
C.X. Li
,
X. Zou
,
P.T. Lai
,
J.P. Xu
,
C.L. Chan
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 681 KB
Your tags:
english, 2008
19
Amr M. Fahim, ,Clock Generators for SoC Processors: Circuit and Architectures (2005) Kluwer Academic Publishers,Boston 1-4020-8079-4 244 pp., Hardcover, plus XVIII.
Mile Stojcev
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 67 KB
Your tags:
english, 2008
20
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Xiaowu Zhang
,
Vaidyanathan Kripesh
,
T.C. Chai
,
Teck Chun Tan
,
D. Pinjala
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.64 MB
Your tags:
english, 2008
21
Numerical and experimental analysis of EMI effects on circuits with MESFET devices
Han-Chang Tsai
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 252 KB
Your tags:
english, 2008
22
A study of the linearity between Ion and log Ioff of modern MOS transistors and its application to stress engineering
W.S. Lau
,
Peizhen Yang
,
C.W. Eng
,
V. Ho
,
C.H. Loh
,
S.Y. Siah
,
D. Vigar
,
L. Chan
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.02 MB
Your tags:
english, 2008
23
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs
J.S. Hwang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 574 KB
Your tags:
english, 2008
24
Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components
Y.S. Chen
,
C.S. Wang
,
Y.J. Yang
Journal:
Microelectronics Reliability
Year:
2008
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2008
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