Volume 49; Issue 7

Microelectronics Reliability

Volume 49; Issue 7

1

Defects in Microelectronic Materials and Devices, Daniel M. Fleetwood, Sokrates T. Pantelides, Ronald D. Schrimpf (Eds.). Taylor and Francis Group LLC, Boca Raton, FL, USA

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 105 KB

english, 2009

2

Feasibility study of non-conductive film (NCF) for plasma display panel (PDP) application

Jin-Sang Hwang, Ju-Yeol Kim, Seok-Chan Kang, Dong-Sung Seo, Younghwan Kwon

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1002 KB

english, 2009

3

Dynamic performance of graded channel DG FD SOI n-MOSFETs for minimizing the gate misalignment effect

Rupendra Kumar Sharma, Ritesh Gupta, Mridula Gupta, R.S. Gupta

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 2.46 MB

english, 2009

4

Reliability analysis of temperature step-stress tests on III–V high concentrator solar cells

José Ramón González, Manuel Vázquez, Neftalí Núñez, Carlos Algora, Ignacio Rey-Stolle, Beatriz Galiana

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 837 KB

english, 2009

5

Sensitivity analysis of simplified Printed Circuit Board finite element models

Robin Alastair Amy, G.S. Aglietti, Guy Richardson

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 971 KB

english, 2009

6

Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system

S.W. King, J.A. Gradner

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 223 KB

english, 2009

7

A surface potential and quasi-Fermi potential based drain current model for pocket-implanted MOS transistors in subthreshold regime

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.05 MB

english, 2009

8

Drop impact reliability of edge-bonded lead-free chip scale packages

Andrew Farris, Jianbiao Pan, Albert Liddicoat, Michael Krist, Nicholas Vickers, Brian J. Toleno, Dan Maslyk, Dongkai Shangguan, Jasbir Bath, Dennis Willie, David A. Geiger

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 2.41 MB

english, 2009

9

Indirect fitting procedure to separate the effects of mobility degradation and source-and-drain resistance in MOSFET parameter extraction

Adelmo Ortiz-Conde, Francisco J. García-Sánchez, Juan Muci, Denise C. Lugo Muñoz, Álvaro D. Latorre Rey, Ching-Sung Ho, Juin J. Liou

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 367 KB

english, 2009

10

Vibration reliability test and finite element analysis for flip chip solder joints

F.X. Che, John H.L. Pang

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 702 KB

english, 2009

11

A new two-dimensional subthreshold behavior model for the short-channel asymmetrical dual-material double-gate (ADMDG) MOSFET’s

Te-Kuang Chiang

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 724 KB

english, 2009

12

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 41 KB

english, 2009

13

Calendar

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 44 KB

english, 2009

14

Prototyping of a reliable 3D flexible IC cube package by laser micromachining

Richárd Berényi

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 822 KB

english, 2009

15

Measuring stress next to Au ball bond during high temperature aging

M. Mayer, J.T. Moon, J. Persic

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 2.97 MB

english, 2009

16

Multi-functional systolic array with reconfigurable micro-power processing elements

E.I. Milovanović, T.R. Nikolić, M.K. Stojčev, I.Ž. Milovanović

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 530 KB

english, 2009

17

The influence of electron-beam irradiation on electrical characteristics of metal–insulator–semiconductor capacitors based on a high-k dielectric stack of HfTiSiO(N) and HfTiO(N) layers

P. Thangadurai, W.D. Kaplan, V. Mikhelashvili, G. Eisenstein

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 584 KB

english, 2009

18

The characterization of electrically conductive silver ink patterns on flexible substrates

S. Merilampi, T. Laine-Ma, P. Ruuskanen

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.03 MB

english, 2009

19

Fabrication of micro-moiré gratings on a strain sensor structure for deformation analysis with micro-moiré technique

Huimin Xie, Satoshi Kishimoto, Yanjie Li, Qingjun Liu, Yapu Zhao

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.62 MB

english, 2009

20

Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints

Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 3.21 MB

english, 2009

21

A method to eliminate the event accumulation problem from a memory affected by multiple bit upsets

Juan Antonio Maestro, Pedro Reviriego

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 647 KB

english, 2009

22

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Asit Kumar Gain, Y.C. Chan, Ahmed Sharif, N.B. Wong, Winco K.C. Yung

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 957 KB

english, 2009

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