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Volume 98
Main
Microelectronics Reliability
Volume 98
Microelectronics Reliability
Volume 98
1
Junction temperature control of UV-C LEDs based on a thermoelectric cooler device
Fredes, P.
,
Raff, U.
,
Gramsch, E.
,
Pascal, J.
,
Cuenca, J.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.46 MB
Your tags:
english, 2019
2
Contrast of latch-up induced by pulsed gamma rays in CMOS circuits after neutron irradiation and TID accumulation
Li, Ruibin
,
He, Chaohui
,
Chen, Wei
,
Liu, Yan
,
Li, Junlin
,
Guo, Xiaoqiang
,
Yang, Shanchao
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.45 MB
Your tags:
english, 2019
3
Two dimensional Green's function solution of threshold for junction less field effect transistors at low drain voltage
Hosseini, Seyed Akram
,
Eskandarian, Abdollah
,
Ghadimi, Abbas
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.00 MB
Your tags:
english, 2019
4
Corrosion on automobile printed circuit broad
Tseng, Tsan-Hsien
,
Wu, Albert T.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.14 MB
Your tags:
english, 2019
5
Statistical simulation of self-heating induced variability and reliability with application to Nanosheet-FETs based SRAM
Chen, Wangyong
,
Cai, Linlin
,
Wang, Kunliang
,
Zhang, Xing
,
Liu, Xiaoyan
,
Du, Gang
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 4.09 MB
Your tags:
english, 2019
6
A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices
Schriefer, Thomas
,
Hofmann, Maximilian
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.52 MB
Your tags:
english, 2019
7
Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field
Ibrahiem, A.A.
,
El-Daly, A.A.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 4.86 MB
Your tags:
english, 2019
8
Residual stress and warpage of AMB ceramic substrate studied by finite element simulations
Zhang, Shanshan
,
Yang, Huisheng
,
Gao, Kewei
,
Yan, Luchun
,
Pang, Xiaolu
,
Volinsky, Alex A.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.05 MB
Your tags:
english, 2019
9
Two dimensional Green's function solution of threshold for junction less field effect transistors at low drain voltage
Hosseini, Seyed Akram
,
Eskandarian, Abdollah
,
Ghadimi, Abbas
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 3.00 MB
Your tags:
2019
10
Corrosion on automobile printed circuit broad
Tseng, Tsan-Hsien
,
Wu, Albert T.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 1.14 MB
Your tags:
2019
11
Wireless sEMG-based identification in a virtual reality environment
Li, Xiaoou
,
Zhou, Zhiyong
,
Liu, Wanyang
,
Ji, Mengjie
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 2.15 MB
Your tags:
2019
12
Instantaneous Mean-Time-To-Failure (MTTF) estimation for checkpoint interval computation at run time
Bandan, Mohamad Imran bin
,
Bhattacharjee, Subhasis
,
Jali, Suriati Khartini
,
Pradhan, Dhiraj K.
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 929 KB
Your tags:
2019
13
Analysis of bipolar amplification due to heavy-ion irradiation in 45 nm FDSOI MOSFET with thin BOX and ground plane
K.R., Pasupathy
,
B., Bindu
Journal:
Microelectronics Reliability
Year:
2019
File:
PDF, 3.03 MB
Your tags:
2019
14
An oxygen vacancy mediated Ag reduction and nucleation mechanism in SiO2 RRAM devices
Patel, K.
,
Cottom, J.
,
Bosman, M.
,
Kenyon, A.J.
,
Shluger, A.L.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.87 MB
Your tags:
english, 2019
15
The strong effect on MEMS switch reliability of film deposition conditions and electrode geometry
Oh, Changho
,
Stovall, Charles B.
,
Dhaouadi, Wassim
,
Carpick, Robert W.
,
de Boer, Maarten P.
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 3.50 MB
Your tags:
english, 2019
16
Bending reliability of flexible transparent electrode of gravure offset printed invisible silver-grid laminated with conductive polymer
Ohsawa, Masato
,
Hashimoto, Natsuki
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.64 MB
Your tags:
english, 2019
17
E-field induced keep-out zone determination method of through-silicon vias for 3-D ICs
Kim, Kibeom
,
Choi, Junsung
,
Woo, Seongho
,
Cho, Jaeyong
,
Ahn, Seungyoung
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 779 KB
Your tags:
english, 2019
18
Thermal fracture parameter analysis of MEMS multilayer structures based on the generalized thermoelastic theory
Long, Zhang
,
Xiaomin, Zhang
,
Jiyun, Song
,
Hengwei, Zheng
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.04 MB
Your tags:
english, 2019
19
Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders
Lin, Qiaoli
,
Ye, Changsheng
,
Sui, Ran
,
Ci, Wenjuan
Journal:
Microelectronics Reliability
Year:
2019
Language:
english
File:
PDF, 1.86 MB
Your tags:
english, 2019
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