Volume 98

Microelectronics Reliability

Volume 98

1

Junction temperature control of UV-C LEDs based on a thermoelectric cooler device

Fredes, P., Raff, U., Gramsch, E., Pascal, J., Cuenca, J.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.46 MB

english, 2019

2

Contrast of latch-up induced by pulsed gamma rays in CMOS circuits after neutron irradiation and TID accumulation

Li, Ruibin, He, Chaohui, Chen, Wei, Liu, Yan, Li, Junlin, Guo, Xiaoqiang, Yang, Shanchao

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.45 MB

english, 2019

3

Two dimensional Green's function solution of threshold for junction less field effect transistors at low drain voltage

Hosseini, Seyed Akram, Eskandarian, Abdollah, Ghadimi, Abbas

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.00 MB

english, 2019

4

Corrosion on automobile printed circuit broad

Tseng, Tsan-Hsien, Wu, Albert T.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.14 MB

english, 2019

5

Statistical simulation of self-heating induced variability and reliability with application to Nanosheet-FETs based SRAM

Chen, Wangyong, Cai, Linlin, Wang, Kunliang, Zhang, Xing, Liu, Xiaoyan, Du, Gang

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 4.09 MB

english, 2019

6

A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices

Schriefer, Thomas, Hofmann, Maximilian

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.52 MB

english, 2019

7

Investigation on multi-temperature short-term stress and creep relaxation of Sn-Ag-Cu-In solder alloys under the effect of rotating magnetic field

Ibrahiem, A.A., El-Daly, A.A.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 4.86 MB

english, 2019

8

Residual stress and warpage of AMB ceramic substrate studied by finite element simulations

Zhang, Shanshan, Yang, Huisheng, Gao, Kewei, Yan, Luchun, Pang, Xiaolu, Volinsky, Alex A.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.05 MB

english, 2019

9

Two dimensional Green's function solution of threshold for junction less field effect transistors at low drain voltage

Hosseini, Seyed Akram, Eskandarian, Abdollah, Ghadimi, Abbas

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 3.00 MB

2019

10

Corrosion on automobile printed circuit broad

Tseng, Tsan-Hsien, Wu, Albert T.

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 1.14 MB

2019

11

Wireless sEMG-based identification in a virtual reality environment

Li, Xiaoou, Zhou, Zhiyong, Liu, Wanyang, Ji, Mengjie

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 2.15 MB

2019

12

Instantaneous Mean-Time-To-Failure (MTTF) estimation for checkpoint interval computation at run time

Bandan, Mohamad Imran bin, Bhattacharjee, Subhasis, Jali, Suriati Khartini, Pradhan, Dhiraj K.

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 929 KB

2019

13

Analysis of bipolar amplification due to heavy-ion irradiation in 45 nm FDSOI MOSFET with thin BOX and ground plane

K.R., Pasupathy, B., Bindu

Journal:

Microelectronics Reliability

Year:

2019

File:

PDF, 3.03 MB

2019

14

An oxygen vacancy mediated Ag reduction and nucleation mechanism in SiO2 RRAM devices

Patel, K., Cottom, J., Bosman, M., Kenyon, A.J., Shluger, A.L.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.87 MB

english, 2019

15

The strong effect on MEMS switch reliability of film deposition conditions and electrode geometry

Oh, Changho, Stovall, Charles B., Dhaouadi, Wassim, Carpick, Robert W., de Boer, Maarten P.

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 3.50 MB

english, 2019

16

Bending reliability of flexible transparent electrode of gravure offset printed invisible silver-grid laminated with conductive polymer

Ohsawa, Masato, Hashimoto, Natsuki

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.64 MB

english, 2019

17

E-field induced keep-out zone determination method of through-silicon vias for 3-D ICs

Kim, Kibeom, Choi, Junsung, Woo, Seongho, Cho, Jaeyong, Ahn, Seungyoung

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 779 KB

english, 2019

18

Thermal fracture parameter analysis of MEMS multilayer structures based on the generalized thermoelastic theory

Long, Zhang, Xiaomin, Zhang, Jiyun, Song, Hengwei, Zheng

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.04 MB

english, 2019

19

Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders

Lin, Qiaoli, Ye, Changsheng, Sui, Ran, Ci, Wenjuan

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 1.86 MB

english, 2019