Volume 15; Issue 1

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Microsystem Technologies
Volume 15; Issue 1

Microsystem Technologies

Volume 15; Issue 1

1

Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections

Zhiheng Huang, Paul P. Conway, Rongshan Qin

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 338 KB

english, 2009

2

Physics of failure for interconnect structures: an essay

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 1.00 MB

english, 2009

3

Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performance

M. Shamshirsaz, M. Maroufi, M. B. Asgari, M. Gheisarieha

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 262 KB

english, 2009

4

Simulations of nanoscale thermal conduction

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 379 KB

english, 2009

5

A simple method for testing the electromigration resistance of solders

M. Saka, T. Kohara, T. Hasegawa, M. Yamashita

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 610 KB

english, 2009

6

Failure of electronic devices due to condensation

C. Schimpf, K. Feldmann, C. Matzner, A. Steinke

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 224 KB

english, 2009

7

Strength of hierarchical materials

Alberto Carpinteri, Pietro Cornetti, Nicola Pugno, Alberto Sapora

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 359 KB

english, 2009

8

Poly-si extensions and etching residues as a reliability risk

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 402 KB

english, 2009

9

TSV constraints related to temperature excursion, pressure during molding, materials used and handling loads

Tomasz Fałat, Kazimierz Friedel, Norman Marenco, Stephan Warnat

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 516 KB

english, 2009

10

Focused ion beam core hole drilling for stress detection in thin-films

H. Gerdes, H. H. Gatzen

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 216 KB

english, 2009

11

Assessment of testing methodologies for thin-film vacuum MEMS packages

Qian Li, Hans Goosen, Fred van Keulen, Joost van Beek, Guoqi Zhang

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 429 KB

english, 2009

12

Macroscopic invisible cables

Nicola M. Pugno

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 301 KB

english, 2009

13

Reliability testing of nano-particle system packaging

James E. Morris

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 298 KB

english, 2009

14

A silicon test chip for the thermomechanical analysis of MEMS packagings

Soeren Majcherek, Thomas Leneke, Soeren Hirsch

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 576 KB

english, 2009

15

Distributed BIT diagnostic network Microsystems for miniature mobile robot

Yu Xiuli, Lou Wenzhong, Liu Xiaosong, Ma Baozheng, Wang Yongqiang

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 266 KB

english, 2009

16

Study on fault diagnostic strategy of intelligent magnetic detection microsystems

Yongqiang Wang, Wenzhong Lou, Ningjun Fan, Jianwei Hao, Dayin Zhang

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 333 KB

english, 2009

17

Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boards

J. Lee, C. S. Cho, J. E. Morris

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 342 KB

english, 2009

18

Changes in the microstructure of materials and their impact on reliability: experiments and modeling

Andreas Brandmair, Thomas Böhme, Wolfgang H. Müller

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 1.03 MB

english, 2009

19

How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments

W. H. Müller, H. Worrack, J. Sterthaus, J. Villain, J. Wilden, A. Juritza

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 644 KB

english, 2009

20

Interlayer cooling potential in vertically integrated packages

T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 1.54 MB

english, 2009

21

Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramics

Shouwen Yu, Li Yu

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 423 KB

english, 2009

22

Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnections

M. Dreßler, K-F. Becker, B. Wunderle, J. Auersperg, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 458 KB

english, 2009

23

Design limitations related to conductive anodic filament formation in a micro-world

Antonio Caputo, Laura J. Turbini, Doug D. Perovic

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 290 KB

english, 2009

24

MST Special Issue on the conference MicroNanoReliability 2007

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 66 KB

english, 2009

25

Exploring the applicability of gradient elasticity to certain micro/nano reliability problems

Elias C. Aifantis

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 352 KB

english, 2009

26

Nonsingular dislocation and crack fields: implications to small volumes

J. Kioseoglou, I. Konstantopoulos, G. Ribarik, G. P. Dimitrakopulos, E. C. Aifantis

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 365 KB

english, 2009

27

Failure modeling of ACA-glued flip-chip on flex assemblies

B. Wunderle, C. Kallmayer, H. Walter, T. Braun, A. Gollhardt, B. Michel, H. Reichl

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 1.12 MB

english, 2009