Volume 22; Issue 4

IEEE Transactions on Advanced Packaging

Volume 22; Issue 4

1

A compact optical active connector: an optical interconnect module with an electrical connector interface

Sasaki, S., Tanaka, N., Ando, Y., Yamaguchi, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.33 MB

english, 1999

2

Design and test methodology for an analog-to-digital converter multichip module for experimental all-digital radar receiver operating at 2 gigasamples/s

Thompson, R.L., Amundsen, E.L.H., Schaefer, T.M., Riemer, P.J., Degerstrom, M.J., Gilbert, B.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 794 KB

english, 1999

3

A new flip-chip bonding technique using micromachined conductive polymer bumps

Oh, K.W., Ahn, C.H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 510 KB

english, 1999

4

Optoelectronic/VLSI

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 394 KB

english, 1999

5

High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components

van der Linden, J.E., De Dobbelaere, P.M., Van Daele, P.P., Diemeer, M.B.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 292 KB

english, 1999

6

Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps

Kwang-Lung Lin,, Yi-Cheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 1.03 MB

english, 1999

7

Pulse CO/sub 2/ laser drilling of green alumina ceramic

Imen, K., Allen, S.D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 260 KB

english, 1999

8

Die cracking and reliable die design for flip-chip assemblies

Michaelides, S., Sitaraman, S.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 447 KB

english, 1999

9

Probabilistic prediction of wiring demand and routing requirements for high density interconnect substrates

Diaz-Alvarez, E., Krusius, J.P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 195 KB

english, 1999

10

Packaging for a 40-channel parallel optical interconnection module with an over-25-Gbit/s throughput

Katsura, K., Usui, M., Sato, N., Ohki, A., Tanaka, N., Matsuura, N., Kagawa, T., Tateno, K., Hikita, M., Yoshimura, R., Ando, Y.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 673 KB

english, 1999

11

Reliability of laser-induced metallic vertical links

Wei Zhang,, Joo-Han Lee,, Yuan Chen,, Bernstein, J.B., Suehle, J.S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 300 KB

english, 1999

12

Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps

Kwang-Lung Lin,, Yi-Cheng Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 3.09 MB

english, 1999

13

Efficient computation of frequency-dependent parameters for on-chip interconnects via two-dimensional FDTD and time signal prediction technique

Zhengyu Yuan,, Zhengfan Li,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 216 KB

english, 1999

14

Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy

Kwang-Lung Lin,, Ya-Te Liu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 907 KB

english, 1999

15

Warpage studies of HDI test vehicles during various thermal profilings

Petriccione, G.J., Ume, I.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 2.26 MB

english, 1999