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51

Electromigration Reliability of Advanced High-density Fan-out Packaging with Fine-pitch 2lm/2lm L/S Cu Redistribution Line

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.61 MB

2020

52

Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung

Journal:

Materials Chemistry and Physics

Year:

2020

File:

PDF, 7.87 MB

2020

53

Interdiffusion of the aluminized and Pt-aluminized coatings on MAR-M247 superalloy

Kwang-Lung Lin, Chung-Mei Hwang

Journal:

Surface and Coatings Technology

Year:

1992

Language:

english

File:

PDF, 6.08 MB

english, 1992

54

Electrochemical corrosion behaviour of lead-free Sn–8.5 Zn–X Ag–0.1 Al–0.5 Ga solder in 3.5% NaCl solution

Udit Surya Mohanty, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

2005

Language:

english

File:

PDF, 551 KB

english, 2005

55

Effects of aging treatment on mechanical properties and microstructure of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga Solder

Teng-Chun Hsuan, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 1.51 MB

english, 2007

56

Coprecipitated zirconia-alumina powders

Lin Kwang-Lung, Lin Tai-Horng

Journal:

Materials Science and Engineering: A

Year:

1989

Language:

english

File:

PDF, 556 KB

english, 1989

57

Characteristics and comparison of metastability of alkoxy-derived tetragonal ZrO2 powders, gels and films

Huey-Chang Wang, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

1991

Language:

english

File:

PDF, 1.09 MB

english, 1991

58

Preparation and characterization of alkoxy-derived metastable cubic ZrO2 powders

Huey-Chang Wang, Kwang-Lung Lin

Journal:

Materials Science and Engineering: A

Year:

1991

Language:

english

File:

PDF, 590 KB

english, 1991

59

Influence of Cu substrate surface oxides and heating rates during reflow on melting point of Sn–3.5Ag solder

Jagjiwan Mittal, Yu Wei Lin, Kwang Lung Lin

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 1.23 MB

english, 2010

60

The atomic-scale studies of the behavior of the crystal dissolution in a molten metal

Chang-Ho Yu, Kwang-Lung Lin

Journal:

Chemical Physics Letters

Year:

2006

Language:

english

File:

PDF, 253 KB

english, 2006

61

The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni–Cu–P deposit on Al

Jen-Che Hsu, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

2005

Language:

english

File:

PDF, 1.32 MB

english, 2005

62

Internal stress and adhesion of amorphous Ni–Cu–P alloy on aluminum

Chun-Jen Chen, Kwang-Lung Lin

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 1.61 MB

english, 2000

63

The interdiffusion and the feasibility of Al/Mo/Ni/(PbSn) as a solder bump system

Kwang-Lung Lin, Shin-Kuo Chen

Journal:

Thin Solid Films

Year:

1997

Language:

english

File:

PDF, 458 KB

english, 1997

64

Microstructure evolution of electroless Ni–P and Ni–Cu–P deposits on Cu in the presence of additives

Kwang-Lung Lin, Yu-Lan Chang, Chiao-Chan Huang, Fang-I Li, Jen-Che Hsu

Journal:

Applied Surface Science

Year:

2001

Language:

english

File:

PDF, 233 KB

english, 2001

65

The performance and degradation behaviours of the TiAln/interlayer coatings on drills

Kwang-Lung Lin, Wen-Hsiuan Chao, Cheng-Dau Wu

Journal:

Surface and Coatings Technology

Year:

1997

Language:

english

File:

PDF, 823 KB

english, 1997

66

Analysis of C60 derivatives by fast-atom bombardment mass spectrometry as γ-cyclodextrin inclusion complexes

Chiun-Gung Juo, Lung-Lin Shiu, Clifton Kwang-Fu Shen, Tien-Yau Luh, Guor-Rong Her

Journal:

Rapid Communications in Mass Spectrometry

Year:

1995

Language:

english

File:

PDF, 398 KB

english, 1995

67

The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

Kwang-Lung Lin, Jieh-Ting Chang

Journal:

Journal of Materials Science

Year:

1995

Language:

english

File:

PDF, 1.94 MB

english, 1995

68

Hydrolysis of zirconium alkoxide under an uncontrolled atmosphere

Kwang -Lung Lin, Huey -Chang Wang

Journal:

Journal of Materials Science

Year:

1988

Language:

english

File:

PDF, 1.08 MB

english, 1988

69

Dispersion of alkoxide-hydrolysed zirconia powders in aqueous suspensions

Kwang-Lung Lin, Huey-Chang Wang

Journal:

Journal of Materials Science Letters

Year:

1989

Language:

english

File:

PDF, 254 KB

english, 1989

70

Characterization and metastability of alkoxy-derived tetragonal zirconia powder

Huey-Chang Wang, Kwang-Lung Lin

Journal:

Journal of Materials Science

Year:

1991

Language:

english

File:

PDF, 1.13 MB

english, 1991

71

Dissolution behavior of Cu and Ag substrates in molten solders

Po-Yi Yeh, Jenn-Ming Song, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 1.05 MB

english, 2006

72

Metal Concentrations in Sediments of the Tamsui River, Flows Through Central Metropolitan Taipei

Dong-Shang Lai, Jye-Bin Lin, Wen-Shan Liu, Lung-Kwang Pan, Kuang-Hua Chu, Chien-Yi Chen, Ding-Bang Lin

Journal:

Bulletin of Environmental Contamination and Toxicology

Year:

2010

Language:

english

File:

PDF, 277 KB

english, 2010

73

Propylthiouracil, independent of its antithyroid effect, promotes vascular smooth muscle cells differentiation via PTEN induction

Wei-Jan Chen, Jong-Hwei S. Pang, Kwang-Huei Lin, Dany-Young Lee, Lung-An Hsu, Chi-Tai Kuo

Journal:

Basic Research in Cardiology

Year:

2010

Language:

english

File:

PDF, 608 KB

english, 2010

74

Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

Po-Cheng Shih, Kwang-Lung Lin

Journal:

Journal of Materials Science

Year:

2007

Language:

english

File:

PDF, 949 KB

english, 2007

75

The reactions between electroless Ni-Cu-P Deposit and 63Sn-37Pb flip chip solder bumps during reflow

Chun-Jen Chen, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2000

Language:

english

File:

PDF, 2.65 MB

english, 2000

76

Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact

Kwang-Lung Lin, Hui-Min Hsu

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 3.73 MB

english, 2001

77

The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

Shou Chang Cheng, Kwang Lung Lin

Journal:

Journal of Electronic Materials

Year:

2002

Language:

english

File:

PDF, 624 KB

english, 2002

78

The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag

Kang-I. Chen, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2002

Language:

english

File:

PDF, 1.55 MB

english, 2002

79

The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga

Kang-I Chen, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 448 KB

english, 2003

80

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chiang-Ming Chuang, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 198 KB

english, 2003

81

Foreword

James P. Lucas, Srini Chada, Sung K. Kang, C. Robert Kao, Kwang-Lung Lin, Jud Ready, Jin Yu

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 27 KB

english, 2003

82

Microstructure and thermal behavior of Sn-Zn-Ag solders

Kwang-Lung Lin, Chia-Ling Shih

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 179 KB

english, 2003

83

Wetting interaction between Sn-Zn-Ag solders and Cu

Kwang-Lung Lin, Chia-Ling Shih

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 792 KB

english, 2003

84

Foreword

Srinivas Chada, Laura J. Turbini, Sung K. Kang, Kwang-Lung Lin, Michael R. Notis, Jin Yu

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 22 KB

english, 2004

85

The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Chiang-Ming Chuang, Hui-Tzu Hung, Pei-Chi Liu, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 686 KB

english, 2004

86

Mechanical strength of Sn-3.5Ag-based solders and related bondings

Chiang-Ming Chuang, Po-Cheng Shih, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.62 MB

english, 2004

87

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn-Ming Song, Pei-Chi Liu, Chia-Ling Shih, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 404 KB

english, 2005

88

Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates

Chia-Wei Huang, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 485 KB

english, 2006

89

Foreword

Nik Chawla, Srinivas Chada, Sung K. Kang, C. Robert Kao, Kwang -Lung Lin, Jim Lucas, Laura Turbini

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 25 KB

english, 2006

90

The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Current Stressing

Shih-Ming Kuo, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 333 KB

english, 2007

91

Electromigration-Induced Void Formation at the Cu5Zn8/Solder Interface in a Cu/Sn-9Zn/Cu Sandwich

Shih-Ming Kuo, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 550 KB

english, 2008

92

Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate

Jagjiwan Mittal, Shih-Ming Kuo, Yu-Wei Lin, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 640 KB

english, 2009

93

Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate

Kwang-Lung Lin, Yu-Chien Wang

Journal:

Journal of Electronic Materials

Year:

1998

Language:

english

File:

PDF, 1.37 MB

english, 1998

94

The microstructures of the Sn-Zn-Al solder alloys

Kwang-Lung Lin, Li-Hsiang Wen, Tzy-Pin Liu

Journal:

Journal of Electronic Materials

Year:

1998

Language:

english

File:

PDF, 4.16 MB

english, 1998

95

The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips

Kwang-Lung Lin, Shiuh-Yuan Chang

Journal:

Thin Solid Films

Year:

1996

Language:

english

File:

PDF, 311 KB

english, 1996

96

Contact angle of 63Sn–37Pb and Pb-free solder on Cu plating

Chien-Tai Lin, Kwang-Lung Lin

Journal:

Applied Surface Science

Year:

2003

Language:

english

File:

PDF, 261 KB

english, 2003

97

High-Temperature Oxidation of a Sn-Zn-Al Solder

Kwang-Lung Lin, Tzy-Ping Liu

Journal:

Oxidation of Metals

Year:

1998

Language:

english

File:

PDF, 220 KB

english, 1998

98

Biotic communities of freshwater marshes and mangroves in relation to saltwater incursions: implications for wetland regulation

Hsing-Juh Lin, Kwang-Tsao Shao, Wen-Liang Chiou, Can-Jen W Maa, Hwey-Lian Hsieh, Wen-Lung Wu, Lucia L. Severinghaus, Yu-Tzu Wang

Journal:

Biodiversity and Conservation

Year:

2003

Language:

english

File:

PDF, 795 KB

english, 2003

99

Quantitative Evaluation of Trace Elements in Sediments of the Tamsui River via Instrumental Neutron Activation Analysis

Chih-Chia Chang, Shiuan-Chih Chen, Chin-Feng Tsai, Jye-Bin Lin, Yih-Hsin Chang, Chien-Yi Chen, Lung-Kwang Pan, Ding-Bang Lin

Journal:

Journal of the Chinese Chemical Society

Year:

2011

Language:

english

File:

PDF, 659 KB

english, 2011

100

The deposition behavior of electroless nickel on alumina substrate

Lin Kwang-Lung, Long Charng-Shyang

Journal:

Materials Chemistry and Physics

Year:

1993

Language:

english

File:

PDF, 604 KB

english, 1993

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