Uhrmann, M.F.: search on Z-Library

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51

103 URINARY EXCRETION OF PROSTAGLANDIN E FOLLOWING THE ADMINISTRATION OF FUROSEMIDE AND INDOMETHACIN TO SICK LOW BIRTHUEIGHT INFANTS

Friedman, Zvi, Demers, Laurence M, Uhrmann, Susan B, Marks, Keith H, Maisels, M Jeffrey

Journal:

Pediatric Research

Year:

1978

Language:

english

File:

PDF, 156 KB

english, 1978

52

Cost-Effectiveness of Inflectra® Vs. Remicade® for Ankylosing Spondylitis in Germany

Gissel, C, Lange, U, Uhrmann, MF

Journal:

Value in Health

Year:

2017

Language:

english

File:

PDF, 60 KB

english, 2017

53

SAE Technical Paper Series [SAE International SAE World Congress & Exhibition - (APR. 20, 2009)] SAE Technical Paper Series - Bead to Bead Tire Measurements

Scholz, O., Jobst, A., Uhrmann, F., Kostka, G., Haßler, U.

Year:

2009

Language:

english

File:

PDF, 687 KB

english, 2009

54

SAE Technical Paper Series [SAE International SAE 2010 World Congress & Exhibition - (APR. 13, 2010)] SAE Technical Paper Series - Color Contour Surface Scanning Using Multiple Sheet-of-Light Cameras

Scholz, Oliver, Seifert, Sebastian, Uhrmann, Franz

Year:

2010

Language:

english

File:

PDF, 908 KB

english, 2010

55

The Norwegian Occupational Balance Questionnaire (OBQ11-N) – development and pilot study

Uhrmann, Lisa, Hovengen, Ida, Wagman, Petra, Håkansson, Carita, Bonsaksen, Tore

Journal:

Scandinavian Journal of Occupational Therapy

Year:

2018

Language:

english

File:

PDF, 994 KB

english, 2018

56

PMS7 - LOSS OF QALYS ASSOCIATED WITH BIOSIMILAR DISCONTINUATION DUE TO NOCEBO EFFECT

Uhrmann, M.F., Gissel, C.

Journal:

Value in Health

Year:

2018

Language:

english

File:

PDF, 380 KB

english, 2018

57

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Combined Thick Resist Processing and Topography Patterning for Advanced Metal Plating

Eibelhuber, M., Rimbock, J., Zenger, T., Uhrmann, T., Matthias, T.

Year:

2018

Language:

english

File:

PDF, 689 KB

english, 2018

58

[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Advanced Black Resist Processing and Optimized Lithographic Patterning for Novel Photonic Devices

Matuskova, B., Taguchi, H., Weinhart, M., Holly, R., Brunnbauer, M., Rimbock, J., Zenger, T., Eibelhuber, M., Uhrmann, T., Taguchi, Y.

Year:

2019

File:

PDF, 685 KB

2019

59

[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Ultra-thin polymer spray coating for advanced adhesive bonding applications

Matuskova, B., Gasiorowski, J., Rimbock, J., Zenger, T., Eibelhuber, M., Uhrmann, T.

Year:

2019

File:

PDF, 803 KB

2019

60

Cost Effectiveness of Voretigene Neparvovec for RPE65-Mediated Inherited Retinal Degeneration in Germany

Uhrmann, Matthias Fritz, Lorenz, Birgit, Gissel, Christian

Journal:

Translational Vision Science & Technology

Year:

2020

File:

PDF, 778 KB

2020