Umed: search on Z-Library

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1

Evaluation of Teaching and Learning

Theo A. Ume, B. G. Nworgu

Journal:

New Directions for Teaching and Learning

Year:

1997

Language:

english

File:

PDF, 56 KB

english, 1997

2

Fixed point theorems for Kannan-type maps

Journal:

Fixed Point Theory and Applications

Year:

2015

Language:

english

File:

PDF, 1.13 MB

english, 2015

3

Use of Theoretical Frameworks as a Pragmatic Guide for Mixed Methods Studies: A Methodological Necessity?

Evans, B. C., Coon, D. W., Ume, E.

Journal:

Journal of Mixed Methods Research

Year:

2011

Language:

english

File:

PDF, 460 KB

english, 2011

4

Ecology of Time: Calendar of the Human Body in the Pamir Mountains

Bulbulshoev, Umed, Kassam, Karim-Aly, Ruelle, Morgan

Journal:

Journal of Persianate Studies

Year:

2011

Language:

english

File:

PDF, 6.37 MB

english, 2011

5

Adaptive gamification in e-learning based on students’ learning styles

Hassan, Muhammad Awais, Habiba, Ume, Majeed, Fiaz, Shoaib, Muhammad

Journal:

Interactive Learning Environments

Year:

2019

Language:

english

File:

PDF, 2.69 MB

english, 2019

6

Child labour in Pakistan: consequences on children's health

Ashfaq, Asia, Ali, Rabia, Habiba, Ume, Ashfaq, Maryam

Journal:

International Journal of Human Rights and Constitutional Studies

Year:

2017

Language:

english

File:

PDF, 207 KB

english, 2017

7

Impact of self-service technology (SST) service quality on customer loyalty and behavioral intention: The mediating role of customer satisfaction

Shahid Iqbal, Muhammad, Ul Hassan, Masood, Habibah, Ume, TiuWright, Len

Journal:

Cogent Business & Management

Year:

2018

Language:

english

File:

PDF, 975 KB

english, 2018

8

Banks versus Markets: Do They Compete, Complement or Co-evolve in the Nigerian Financial System? An ARDL Approach

Arize, Augustine, Ume, Kalu Ebere, Nkwor, Nelson N.

Journal:

Research in International Business and Finance

Year:

2017

Language:

english

File:

PDF, 846 KB

english, 2017

9

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Liu, Sheng, Ume, I. Charles

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 543 KB

english, 2003

10

Electrical systems for pulsed electric field applications in the food industry: An engineering perspective

Arshad, Rai Naveed, Abdul-Malek, Zulkurnain, Munir, Abdullah, Buntat, Zolkafle, Ahmad, Mohd Hafizi, Jusoh, Yanti M.M., El-Din Bekhit, Alaa, Roobab, Ume, Manzoor, Muhammad Faisal, Aadil, Rana Muhammad

Journal:

Trends in Food Science & Technology

Year:

2020

File:

PDF, 1.15 MB

2020

11

Measurement of Dynamic Warpage During Thermal Cycling of Dielectric Coated SS Substrates for Large Area MCM-D Packaging

Dang, Anh X. H., Ume, I. Charles, Bhattacharya, Swapan K.

Journal:

Journal of Electronic Packaging

Year:

2000

Language:

english

File:

PDF, 1.67 MB

english, 2000

12

Nitrous oxide emission from an irrigated cotton field under semiarid subtropical conditions

Tariq Mahmood, Rehmat Ali, Javed Iqbal, Ume Robab

Journal:

Biology and Fertility of Soils

Year:

2008

Language:

english

File:

PDF, 280 KB

english, 2008

13

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Fu, Chia-Yu, McDowell, David L., Ume, I. Charles

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 530 KB

english, 2002

14

A novel NF-κB inhibitor DHMEQ selectively targets constitutive NF-κB activity and induces apoptosis of multiple myeloma cells in vitro and in vivo

Mariko Watanabe, Md. Zahidunnabi Dewan, Takamitu Okamura, Masataka Sasaki, Kinji Itoh, Masaaki Higashihara, Hideaki Mizoguchi, Mitsuo Honda, Testutaro Sata, Toshiki Watanabe, Naoki Yamamoto, Kazuo Ume

Journal:

International Journal of Cancer

Year:

2005

Language:

english

File:

PDF, 453 KB

english, 2005

15

ARABIC TRANSLATION OF GALEN'S ON THE AFFECTED PARTS AND THE GREEK TEXTUAL TRADITION

Ç¦umÊ¿A, Nashwa, Hamed, Iman M., Pormann, Peter E.

Journal:

The Classical Quarterly

Year:

2020

File:

PDF, 205 KB

2020

16

Input-output impact analysis in current or constant prices: does it matter?

Erik Dietzenbacher, Umed Temurshoev

Journal:

Journal of Economic Structures

Year:

2012

Language:

english

File:

PDF, 292 KB

english, 2012

17

A comparison of PWB warpage due to simulated infrared and wave soldering processes

Polsky, Y., Sutherlin, W., Ume, I.C.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2000

Language:

english

File:

PDF, 367 KB

english, 2000

18

Controlling constriction sizes of granular filters

Kenney, T. C., Chahal, R., Chiu, E., Ofoegbu, G. I., Omange, G. N., Ume, C. A.

Journal:

Canadian Geotechnical Journal

Year:

1985

Language:

english

File:

PDF, 1003 KB

english, 1985

19

The impact of cognitive functioning on mortality and the development of functional disability in older adults with diabetes: the second longitudinal study on aging

Lisa C McGuire, Earl S Ford, Umed A Ajani

Journal:

Year:

2006

Language:

english

File:

PDF, 535 KB

english, 2006

20

Kinematics of the Pamir and Hindu Kush regions from GPS geodesy

Ischuk, Anatoli, Bendick, Rebecca, Rybin, Anatoly, Molnar, Peter, Khan, Shah Faisal, Kuzikov, Sergey, Mohadjer, Solmaz, Saydullaev, Umed, Ilyasova, Zhyra, Schelochkov, Gennady, Zubovich, Alexander V.

Journal:

Journal of Geophysical Research Solid Earth

Year:

2013

Language:

english

File:

PDF, 846 KB

english, 2013

21

Feasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages

Mebane, Aaron M., Reddy, Vishnu V. B., Ume, Ifeanyi Charles, Akinade, Kola

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 2.33 MB

english, 2019

22

Defects pattern recognition for flip-chip solder joint quality inspection with laser ultrasound and Interferometer

Sheng Liu,, Ume, I.C., Achari, A.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2004

Language:

english

File:

PDF, 495 KB

english, 2004

23

Politics and Ethnicity in the Rise of Broadcasting in Nigeria, 1932-62

Ume-Nwagbo, E. N.

Journal:

Journalism & Mass Communication Quarterly

Year:

1979

Language:

english

File:

PDF, 504 KB

english, 1979

24

Determination of Measurement Limit for Open Solder Bumps on a Flip-Chip Package Using a Laser Ultrasonic Inspection System

Erdahl, D.S., Ume, I.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2006

Language:

english

File:

PDF, 784 KB

english, 2006

25

Warpage Analysis of Underfilled Wafers

Ding, Hai, Ume, I. Charles, Zhang, Cheng

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 398 KB

english, 2004

26

Relating energy consumption to real sector value added and growth in a developing economy

Kalu, Ebere Ume, Daniel, Pius Bala, Nwafor, Uchenna Florence, Okoyeuzu, Chinwe R., Okoro, Okoro E.U., Okechukwu, Elizabeth U.

Journal:

International Journal of Energy Sector Management

Year:

2018

Language:

english

File:

PDF, 199 KB

english, 2018

27

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Liu, Sheng, Ume, I. Charles

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 394 KB

english, 2002

28

A concise review of biochar application to agricultural soils to improve soil conditions and fight pollution

Shaaban, Muhammad, Van Zwieten, Lukas, Bashir, Saqib, Younas, Aneela, Núñez-Delgado, Avelino, Chhajro, Muhammad Afzal, Kubar, Kashif Ali, Ali, Umeed, Rana, Muhammad Shoaib, Mehmood, Mirza Abid, Hu, Ro

Journal:

Journal of Environmental Management

Year:

2018

Language:

english

File:

PDF, 575 KB

english, 2018

29

Self-Service Technology Service Quality: Building Loyalty and Intention Through Technology Trust in Pakistani Service Sector

Ul Hassan, Masood, Iqbal, Muhammad Shahid, Habibah, Ume

Journal:

Year:

2020

File:

PDF, 834 KB

2020

30

Process induced warpage in multitiled alumina substrates for large area MCM-D processing

Dang, A.X.H., Ume, I.C., Bhattacharya, S.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2000

Language:

english

File:

PDF, 1.20 MB

english, 2000

31

The impact of supervisory justice and perceived Supervisor support on organizational citizenship behavior and commitment to supervisor: the mediating role of trust

Akram, Ammara, Kamran, Muhammad, Iqbal, Muhammad Shahid, Habibah, Ume, Atif Ishaq, Muhammad, Wanasika, Isaac

Journal:

Cogent Business & Management

Year:

2018

Language:

english

File:

PDF, 1.96 MB

english, 2018

32

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

Stiteler, M. R., Ume, I. C.

Journal:

Journal of Electronic Packaging

Year:

1997

Language:

english

File:

PDF, 951 KB

english, 1997

33

Inclusive leadership and innovative work behavior: The role of psychological empowerment

Javed, Basharat, Abdullah, Iqra, Zaffar, Muhmmad Adeel, Haque, Adnan ul, Rubab, Ume

Journal:

Journal of Management & Organization

Year:

2018

Language:

english

File:

PDF, 399 KB

english, 2018

34

Warpage measurement comparison using shadow Moire and projection Moire methods

Hai Ding,, Powell, R.E., Hanna, C.R., Ume, I.C.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2002

Language:

english

File:

PDF, 824 KB

english, 2002

35

Three-dimensional ray tracing of laser ultrasound for weld penetration sensing

Mi, Bao, Ume, I. Charles

Journal:

The Journal of the Acoustical Society of America

Year:

2004

Language:

english

File:

PDF, 780 KB

english, 2004

36

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Yang, Jin, Zhang, Lizheng, Ume, I. Charles, Ghiu, Camil, White, George

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 1.06 MB

english, 2010

37

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

Polsky, Yarom, Ume, I. Charles

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 141 KB

english, 2001

38

Armed Conflict and Food Security in West Africa: Socioeconomic Perspective

Ujunwa, Augustine, Okoyeuzu, Chinwe, Kalu, Ebere Ume

Journal:

International Journal of Social Economics

Year:

2018

File:

PDF, 230 KB

2018

39

Economics students need not be greedy: Fairness and the ultimatum game

T.D. Stanley, Ume Tran

Journal:

The Journal of Socio-Economics

Year:

1998

Language:

english

File:

PDF, 406 KB

english, 1998

40

New insights on possible vaccine development against SARS-CoV-2

Chaudhry, Sundas Nasir, Hazafa, Abu, Mumtaz, Muhummad, Kalsoom, Ume, Abbas, Saima, Kainaat, Amna, Bilal, Shahid, Zafar, Nauman, Siddique, Aleena, Zafar, Ayesha

Journal:

Year:

2020

File:

PDF, 2.46 MB

2020

41

Understanding Multiscreening Phenomenon for Online Shopping through Perspective of Self-Regulation and Dual Process Theory: Case of Chinese Young Generation

Kalim Khan, Shahid, Ali, Naqash, Abbas Khan, Naseer, Ammara, Ume, Anjum, Naeem

Journal:

Electronic Commerce Research and Applications

Year:

2020

File:

PDF, 881 KB

2020

42

Online–Offline Laser Ultrasonic Quality Inspection Tool for Multilayer Ceramic Capacitors—Part I

Erdahl, D.S., Ume, I.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2004

Language:

english

File:

PDF, 809 KB

english, 2004

43

IDENTIFYING OPTIMAL SECTOR GROUPINGS WITH THE HYPOTHETICAL EXTRACTION METHOD

Umed Temurshoev

Journal:

Journal of Regional Science

Year:

2010

Language:

english

File:

PDF, 605 KB

english, 2010

44

Development of Warpage Measurement System to Simulate Convective Solder Reflow Process

Powell, R.E., Ume, I.C.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2008

Language:

english

File:

PDF, 648 KB

english, 2008

45

Warpage studies of HDI test vehicles during various thermal profilings

Petriccione, G.J., Ume, I.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

1999

Language:

english

File:

PDF, 2.26 MB

english, 1999

46

Information for assistants of repeated transcranial magnetic stimulation

Saxby Pridmore, Umeed Khan, Moacyr A. Rosa, Mark S. George

Journal:

International Journal of Mental Health Nursing

Year:

2003

Language:

english

File:

PDF, 219 KB

english, 2003

47

A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects

Fu, C., McDowell, D. L., Ume, I. C.

Journal:

Journal of Electronic Packaging

Year:

1998

Language:

english

File:

PDF, 877 KB

english, 1998

48

Ownership relations in the presence of cross-shareholding

Erik Dietzenbacher, Umed Temurshoev

Journal:

Journal of Economics

Year:

2008

Language:

english

File:

PDF, 351 KB

english, 2008

49

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Dang, Anh X. H., Ume, I. Charles, Bhattacharya, Swapan K.

Journal:

Journal of Electronic Packaging

Year:

2000

Language:

english

File:

PDF, 1.01 MB

english, 2000

50

On some nonself mappings

LJ. B. Ćirić, J. S. Ume, M. S. Khan, H. K. Pathak

Journal:

Mathematische Nachrichten

Year:

2003

Language:

english

File:

PDF, 109 KB

english, 2003

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