Volume 87; Issue 10

Microelectronic Engineering

Volume 87; Issue 10
10

Structure and property of magnetron sputtered ternary cobalt–nickel silicide films

Year:
2010
Language:
english
File:
PDF, 502 KB
english, 2010
13

Stress analysis of 3-dimensional IC package as function of structural design parameters

Year:
2010
Language:
english
File:
PDF, 1.00 MB
english, 2010
17

Electrodepositing amorphous Ni-W alloys for MEMS

Year:
2010
Language:
english
File:
PDF, 860 KB
english, 2010
20

Damage predictions in a chip resistor solder joint on flexible circuit board

Year:
2010
Language:
english
File:
PDF, 747 KB
english, 2010
21

Simulation of TaNx deposition by Reactive PVD

Year:
2010
Language:
english
File:
PDF, 585 KB
english, 2010
39

Inside Front Cover - Editorial Board

Year:
2010
Language:
english
File:
PDF, 28 KB
english, 2010
40

Contents continued

Year:
2010
Language:
english
File:
PDF, 26 KB
english, 2010
41

Publisher’s note

Year:
2010
File:
PDF, 77 KB
2010