Volume 34; Issue 8

Microelectronics Reliability

Volume 34; Issue 8

1

Nonparametric estimation of mean time to failure with unknown stochastic censoring

Hendrik Schäbe

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 268 KB

english, 1994

2

Finding nonfaulty subtrees in faulty binary tree architectures

Ravi Mittal, Bijendra N. Jain, Rakesh K. Patney

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 452 KB

english, 1994

3

A consecutive k-out-of-n reliability system in random environment

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 335 KB

english, 1994

4

On the interval reliability of systems modelled by finite semi-Markov processes

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 636 KB

english, 1994

5

Reliability and availability analysis of a k-out-of-N:G redundant system with repair in the presence of chance of multiple critical errors

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 177 KB

english, 1994

6

Reliability analysis of a cold standby system with multiple critical errors

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 160 KB

english, 1994

7

Two unit redundant system with adjustable failure rate, critical human error (CHE) and inspection

R.K. Agnihotri, Shubhag Chand, V.B. Mudgal

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 302 KB

english, 1994

8

Recursive estimation of time-dependent reliability

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 357 KB

english, 1994

9

An alternate and simpler method for finding the field-dependent defect density of SiO2 films using MOS capacitor devices

R.K. Bhan, P.C. Mathur

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 245 KB

english, 1994

10

Confidence limits for steady state availability of systems

P. Chandrasekhar, R. Natarajan, H. Sheryl Sujatha

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 162 KB

english, 1994

11

Optimum design of sampling plans in electronic industry

Torky I. Sultan

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 308 KB

english, 1994

12

A sequential test to control up and down times when their distributions are gamma

Sudha Jain, R.K. Jain

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 116 KB

english, 1994

13

Finite range survival model

S.A. Siddiqui, Manish Subharwal, Sanjay Gupta, Balkrishan

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 258 KB

english, 1994

14

A two-unit system with allowed down time and random check of standby

Rakesh Gupta, Alka Chaudhary

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 275 KB

english, 1994

15

Profit analysis of a system with two-units having guarantee periods and delayed operation of standby

Rakesh Gupta, Alka Chaudhary

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 247 KB

english, 1994

16

Cost-benefit analysis of a two-unit standby system with a proviso of repair-machine failure

Rakesh Gupta, Alka Chaudhary, Ritu Goel

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 229 KB

english, 1994

17

Fast enumeration of every path in a reliability graph using subgraphs

M.A. Aziz, M.A. Sobhan, M.A. Samad

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 149 KB

english, 1994

18

On a general imperfect debugging software reliability growth model

P.K. Kapur, Sanjay Agarwala, Said Younes, Amit K. Sinha

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 522 KB

english, 1994

19

b and its temperature dependence are the important criteria of the reliability of semiconductor lasers

Shi Jiawei, Jin Ensun, Ma Jing, Gao Dingsan

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 244 KB

english, 1994

20

The inventory replenishment problem with a linear trend in demand : Moncer Hariga. Computers and Industrial Engineering, 24(2), 143 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 82 KB

english, 1994

21

Are components still the major problem: a review of electronic system and device field failure returns : Michael Pecht and Vijay Ramappan. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15(6), 1160 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 82 KB

english, 1994

22

Two new replacement policies : Nader Ebrahimi. IEEE Transactions on Reliability, 42(1), 141 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 82 KB

english, 1994

23

Mechanical design failure models for buckling : Abhijit Dasgupta and Henry W. Haslach Jr, IEEE Transactions on Reliability, 42(1), 9 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 82 KB

english, 1994

24

Rework of multi-chip modules: device removal : J. Chang and C. Spooner. Circuit World, 19(2), 13 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

25

A new type of fiber optic connector designed for military optical backplanes : R. J. Pimpinella. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15(6), 992 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

26

Is boundary scan short on fault coverage? : Gordon D. Robinson. Test and Measurement World, 71 (February 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

27

Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards : J. Lau et al. Circuit World, 19(3), 18 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

28

Design of precision capacitors for analog applications : Stephen A. St. Onge et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1064 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

29

Fixed resistors serve to reduce equipment size : Iwao Tsuchihashi. JEE (Japan), 85 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

30

Ultra-miniature chip inductors for communications equipment down-sizing requirements : Mitsuo Sakakura. JEE (Japan), 62 (May 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

31

Power semiconductor devices for the 1990s : B. Jayant Baliga. Microelectronics Journal, 24, 31 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 211 KB

english, 1994

32

HIMOS: an attractive flash EEPROM cell for embedded memory applications : J. van Houdt, G. Groeseneken and H. E. Maes. Microelectronics Journal, 24(3), 190 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

33

Portable, cordless phone requirements give rise to chip monolithic microfilters : Kiyohiro Kobayashi. JEE (Japan), 72 (February 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

34

Boundary walking test: an accelerated scan method for greater system reliability : John C. Chan. IEEE Transactions on Reliability, 41(4), 496 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

35

Optimizing force and geometry parameters in design of reduced insertion force connectors : Irene Sawchyn and Edward S. Sproles, Jr IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1025 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

36

Curiosities in choosing system components: a Bayes analysis : Telba Z. Irony and Richard E. Barlow. IEEE Transactions on Reliability, 42(1), 128 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

37

A review of modern power semiconductor devices : J. L. Hudgins. Microelectronics Journal, 24, 41 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 217 KB

english, 1994

38

Reliability modeling of soldered interconnections : James F. Prosser and Nicholas T. Panousis. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1046 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

39

Constitutive relations for tin-based solder joints : Robert Darveaux and King Shuk Banerji. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1013 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

40

A statistical method for obtaining the factors in electronic-component reliability-prediction models : Zhongsen Yang and Hazem Raafat. IEEE Transactions on Reliability, 41(4), 554 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

41

Gaussian parametric failure-rate model with application to Quartz-Crystal device aging : A. A. Feinberg. IEEE Transactions on Reliability, 41(4), 565 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

42

Increased reliability of drypumps due to process related adaptation and prefailure warning : R. Bahnen and M. Kuhn. Vacuum, 44(5–7), 709 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 211 KB

english, 1994

43

Standards encourage use of ultra-mini connectors for IC cards : Sadatoshi Furusawa. JEE (Japan), 40 (February 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

44

Short-pulse propagation technique for characterizing resistive package interconnections : Alina Deutsch, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1034 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

45

Conduction mechanisms in contaminant layers on printed circuit boards : J. R. White. IBM Journal of Research and Development, 37(2), 243 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

46

Development proceeds on chip fixed inductors, their applications : Mikio Taoka. JEE (Japan), 81 (April 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

47

Advances in capacitor designs keep pace with trends in portable equipment : Takaichi Kitahata and Toshikazu Kato. JEE (Japan), 90 (April 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

48

Failure mechanism models for Ductile fracture : Abhijit Dasgupta and Jun Ming Hu. IEEE Transactions on Reliability, 41(4), 489 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 206 KB

english, 1994

49

An O (n · log(n)) algorithm to compute the all-terminal reliability of (K5, K2,2,2) free networks: T. Politof, A. Satyanarayana and L. Tung. IEEE Transactions on Reliability, 41(4), 512 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

50

Efficient algorithm for reliability of a circular consecutive-k-out-of-n F system: Jer-Shyan Wu and Rong-Jaye Chen. IEEE Transactions on Reliability, 42(1), 163 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

51

A Bayes procedure for estimation of current system reliability : R. Calabria, M. Guida and G. Pulcini. IEEE Transactions on Reliability, 41(4), 616 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

52

Percentiles of pivotal ratios for the MLE of the parameters of a Weibull regression model : Mohamed M. Bugaighis. IEEE Transactions on Reliability, 42(1), 97 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

53

Chi-square tests-of-fit for location-scale families using type-II censored data : Daniel Mihalko. IEEE Transactions on Reliability, 42(1), 76 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

54

Bounds for reliability of consecutive k-within-m-out-of-n:F systems: Stavros G. Papastravdrisis and Markos V. Koutras. IEEE Transactions on Reliability, 42(1), 156 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 106 KB

english, 1994

55

A failure-repair model with minimal and major maintenance : S. H. Sim and J. Endrenyi. IEEE Transactions on Reliability, 42(1), 134 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 208 KB

english, 1994

56

A model for the integrity assessment of ageing repairable systems : G. U. Crevecoeur. IEEE Transactions on Reliability, 42(1), 148 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 104 KB

english, 1994

57

Transient behaviour and parametric sensitivity in failure prone systems : F. Archetti and A. Schiomachen. Computers and Electrical Engineering, 19(2), 65 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 104 KB

english, 1994

58

Software-reliability growth with a Weibull test-effort: a model and application : Shigeru Yamada, Jun Hishitani and Shunji Osaki. IEEE Transactions on Reliability, 42(1), 100 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 104 KB

english, 1994

59

Estimating defects in commercial software during operational use : Garrison Q. Kenney. IEEE Transactions on Reliability, 42(1), 107 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 104 KB

english, 1994

60

Graphical techniques for analyzing failure data with the percentile residual-life function : Robert L. Launer. IEEE Transactions on Reliability, 42(1), 71 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 104 KB

english, 1994

61

Optimal properties of the Laplace trend test for soft-ware-reliability models : Olivier Gaudoin. IEEE Transactions on Reliability, 41(4), 525 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

62

A discrete Bayes explanation of a failure-rate paradox : Flavio W. Rodrigues and Sergio Wechsler. IEEE Transactions on Reliability, 42(1), 132 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

63

Adaptive fuzzy systems : Earl Cox. IEEE Spectrum, 27 (February 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

64

An O (k · n)-time algorithm for computing the reliability of a circular consecutive-k-out-of-n:F system: F. K. Hwang. IEEE Transactions on Reliability, 42(1), 161 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

65

Estimation methods for the mean of the exponential distribution based on grouped and censored data : Sun-Keun Seo and Bong-Jin Yum. IEEE Transactions on Reliability, 42(1), 87 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

66

Optimal design of parallel-series systems with competing failure modes : Hoang Pham. IEEE Transactions on Reliability, 41(4), 583 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 105 KB

english, 1994

67

Evaluating layout area tradeoffs for high level applications : Fadi J. Kurdahi et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 46 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 210 KB

english, 1994

68

Bayes parameter estimation for the bivariate Weibull model of Marshall-Olkin for censored data : JyeChyi Lu. IEEE Transactions on Reliability, 41(4), 608 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

69

A class of efficient tests for increasing-failure-rate-average distribution under random censoring : Ram C. Tiwari and Jyoti N. Zalkikar. IEEE Transactions on Reliability, 41(4), 602 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

70

A reliability and cost analysis of an automatic prototype generator test paradigm : Saeed Maghsoodloo et al. IEEE Transactions on Reliability, 41(4), 547 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

71

Optimal apportionment of reliability and redundancy in series systems under multiple objectives : Anoop K. Dhingra. IEEE Transactions on Reliability, 41(4), 576 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

72

Selecting the most reliable design under Type-II censored accelerated testing : Dong-Shang Chang, Deng-Yuan Huang and Sheng-Tsaing Tseng. IEEE Transactions on Reliability, 41(4), 588 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

73

Evaluating the performance of software-reliability models : Thomas Downs and Anthony Scott. IEEE Transactions on Reliability, 41(4), 533 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

74

Shrunken estimators of Weibull shape parameter from Type-II censored samples : M. Pandey and U. S. Singh. IEEE Transactions on Reliability, 42(1), 81 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

75

Goodness-of-fit tests for the power-law process based on the TTT-plot : Bengt Klefsjo and Uday Kumar. IEEE Transactions on Reliability, 41(4), 593 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

76

Predicting performability of a fault-tolerant microcomputer for process control : Cristian Constantinescu. IEEE Transactions on Reliability, 41(4), 558 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

77

Statistical analysis of the geometric de-eutrophication software-reliability model : Olivier Gaudoin and Jean-Louis Soler. IEEE Transactions on Reliability, 41(4), 518 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

78

On the optimal design of k-out-of-n:G subsystems: Hoang Pham. IEEE Transactions on Reliability, 41(4), 572 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 210 KB

english, 1994

79

A high-density and low-power charge-based Hamming network : Yuping He et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 56 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 102 KB

english, 1994

80

Bayes computation for life testing and reliability estimation : Dipak K. Dey and Tai-Ming Lee. IEEE Transactions on Reliability, 41(4), 621 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 102 KB

english, 1994

81

Computational and experimental environments for fuzzy logic and control : M. Jamshidi, D. Barak, S. Baugh and N. Vadiee. Computers and Electrical Engineering, 19(4), 289 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 102 KB

english, 1994

82

SIGMA: a VLSI systolic array implementation of a Galois Field [GF(2)m)] based multiplication and division algorithm: IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 22 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 102 KB

english, 1994

83

Functional flexibility keeps ASICs in demand : JEE (Japan), 66 (January 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 102 KB

english, 1994

84

Review. A survey of the present status of vacuum microelectronics : S. Iannazzo. Solid-State Electronics, 36(3), 301 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 201 KB

english, 1994

85

Computationally-efficient phased-mission reliability analysis for systems with variable configurations : Arun K. Somani, James A. Ritcey and Stephen H. L. Au. IEEE Transactions on Reliability, 41(4), 504 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

86

CBS-CAD: a CAD process management system : A. Kabbaj, E. Cerny and M. Dagenais. Microelectronics Journal, 24, 229 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

87

Gigabit age microelectronics and their manufacture : Pallab K. Chatterjee and Grydon B. Larrabee, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 7 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 101 KB

english, 1994

88

Systematic design of phase-shifting masks with extended depth of focus and/or shifted focus plane : Yong Liu, Anton Pfau and Avideh Zakhor. IEEE Transactions on Semiconductor Manufacturing, 6(1), 1 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

89

The effect of fan-reliability and cooling-performance on electronic-chassis reliability : John M. Hogan. IEEE Transactions on Reliability, 42(1), 172 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

90

An AI constraint network-based approach to bed-of-nails DFT for digital circuit design : J. Bowen, D. Bahler and A. Dholakia. Computers and Electrical Engineering, 19(2), 73 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

91

Automated malfunction diagnosis of semiconductor fabrication equipment: a plasma etch application : Gary S. May and Costas J. Spanos. IEEE Transactions on Semiconductor Manufacturing, 6(1), 28 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

92

A layout-driven yield predictor and fault generator for VLSI : Alexander R. Dalal et al. IEEE Transactions on Semiconductor Manufacturing, 6(1), 77 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 218 KB

english, 1994

93

Advanced “contact engineering” for submicron VLSI multilevel metallization : K. Konrad Young et al. IEEE Transactions on Semiconductor Manufacturing, 6(1), 22 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

94

Automated wafer level QBD measurement for production control : Ivor R. Evans and David Garratt. IEEE Transactions on Semiconductor Manufacturing, 6(1), 83 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

95

Spin coating over topography : Loni M. Peurrung and David B. Graves. IEEE Transactions on Semiconductor Manufacturing, 6(1), 72 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

96

A study of failures identified during board level environmental stress testing : T. Paul Parker and Cathy W. Webb. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1086 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

97

Reliability assessment of high lead count TAB package : Jamin Ling, Hongbee Teoh, David Sorrells and Jack Jones. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1105 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 219 KB

english, 1994

98

Discrete surface mount products for power applications : Dave Hollander. Microelectronics Journal, 24, 15 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 113 KB

english, 1994

99

Use of cooperating expert systems for real-time fault detection and correction in a manufacturing cell : Mark D. Pardue. Computers and Electronic Engineering, 19(2), 103 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 113 KB

english, 1994

100

Direct chip interconnect with adhesive conductor films : Nagesh R. Basavanhally et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 972 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 113 KB

english, 1994

101

An expert process planning system for electronics PCB assembly : Ezat T. Sanii and Jong-Shin Liau. Computers and Electronic Engineering, 19(2), 113 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 219 KB

english, 1994

102

Gold-to-aluminum bonding for TAB applications : Sung K. Kang. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 998 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

103

Silver-induced volatile species generation from conductive die attach adhesives : Terry E. Phillips et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 956 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 108 KB

english, 1994

104

Toward high-level synthesis for ASIC design : Andrewas Wild, Rainer Makowitz, Franz Steininger and Volker Kiefer. Microelectronics Journal, 24, 225 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

105

Feature-scale simulation of resist-patterned electrode-position : J. O. Dukovic. IBM Journal of Research Development, 37(2), 125 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 109 KB

english, 1994

106

Precision flip-chip solder bump interconnects for optical packaging : William R. Imler, et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 977 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 217 KB

english, 1994

107

Wire bonding—toward 6-σ yield and fine pitch : George G. Harman. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1005 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

108

Thin QFP—the next generation high pincount surface mount challenge : Robbyn Culver, Richard Groover, Ahmad Hamzehoost and Chin C. Huang. Microelectronics Journal, 24(3), 181 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

109

HIC application technologies enhance high density mounting in printed circuit boards : Shigeo Sakurada. JEE (Japan), 50 (March 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

110

Water soluble paste survey for fine pitch SMT attach : Burton Carpenter et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 938 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 111 KB

english, 1994

111

Coprocessor design for multilayer surface-mounted PCB routing : Ramachandran Venkateswaran et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 31 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 219 KB

english, 1994

112

A Monte Carlo approach for power estimation : Richard Burch et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 1(1), 63 (March 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

113

Performance testing of cellular modems : Mike Mukund and Fred Mohajer. Test and Measurement World, 63 (January 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

114

Automatic assembly equipment gains capabilities, improves performance : JEE (Japan), 25 (May 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

115

DIGamber: a digital design and diagnostic tool in expert system environment : P. Pourbeik and L. C. Jain. Microelectronics Journal, 24, 253 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 110 KB

english, 1994

116

Low moisture polymer adhesive for hermetic packages : My N. Nguyen and Michael B. Grosse. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 964 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 201 KB

english, 1994

117

The Panther range of test synthesis products : Andrew Boswell. Microelectronics Journal, 24, 205 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

118

A multichip packaged GaAs 16 × 16 parallel multiplier: Takeshi Sekiguchi et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 444 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

119

A neural implementation of complex activation functions for digital VLSI neural networks : Y. Deville. Microelectronics Journal, 24, 259 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

120

A high-speed two's complement multiplier using differential split-level CMOS : S. M. Aziz and W. A. J. Waller. Microelectronics Journal, 24, 217 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

121

Mixing 3-V and 5-V ICs : John Williams. IEEE Spectrum, 40 (March 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

122

Annealing behaviour of hole traps in irradiated gate oxides : Tomasz Brozek, Janusz Korycki and Miroslaw Siemczyk. Electron Technology, 25(1–4), 27 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 92 KB

english, 1994

123

The transition from a two-dimensional to a zero-dimensional electron system on silicon : I. Jenina, H. Lorenz, J. P. Kotthaus, S. Bakker and T. M. Klapwijk. Solid State Communications, 85(7), 601 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 112 KB

english, 1994

124

An experimental procedure for measuring silicon lattice heating due to hot carriers in MOSFETs : James W. Roberts and Savvas G. Chamberlain. Solid-State Electronics, 36(3), 351 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 112 KB

english, 1994

125

Grown-in-deep-level defects in vapour phase epitaxial GaAs1 − xPx: Pawel Kaminski. Electron Technology, 25(1–4), 3 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 112 KB

english, 1994

126

Dielectric degradation of Pt/SiO2/Si structures during thermal annealing : Bing-Yue Tsui and Mao-Chieh Chen. Solid-State Electronics, 36(4), 583 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 112 KB

english, 1994

127

In situ measurement of wafer temperatures in a low pressure chemical vapor deposition furnace : Thomas A. Badgwell et al. IEEE Transactions on Semiconductor Manufacturing, 6(1), 65 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 206 KB

english, 1994

128

Analysis of drain breakdown voltage in enhancement-mode SOI MOSFETs : P. Smeys and J. P. Colinge. Solid-State Electronics, 36(4), 569 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

129

Ellipsometric measurements of surface roughness of silicon wafers : Anna Maria Kaminska. Electron Technology, 25(1–4), 43 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

130

Majority carrier mobility in ultra heavily doped n-type Si in the presence of defects and dislocations: M. B. Zivanov and M. Jevtic. Solid-State Electronics, 36(6), 891 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

131

Positron annihilation spectroscopy of vacancy-related defects in semiconductors : C. Corbel, K. Saarinen and P. Hautojarvi. Progress in Crystal Growth and Characterization, 25, 241 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

132

The effect on the non-uniform doping profile on I–V characteristics of a MOSFET : Lidia Lukasiak and Malgorzata Jurczak. Electron Technology, 25(1–4), 59 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

133

Basic hybrid IC technology must adapt to dense mounting : Yoshihiko Ono. JEE (Japan), 54 (March 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 95 KB

english, 1994

134

Co-implantation of Mg and Si in GaAs MESFETs : J. Kuzmik, T. Lalinsky and P. Seidl. Solid-State Electronics, 36(3), 427 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 179 KB

english, 1994

135

Independent control of ion density and ion bombardment energy in a dual RF excitation plasma : Haruhiro Harry Goto et al. IEEE Transactions on Semiconductor Manufacturing, 6(1), 58 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 87 KB

english, 1994

136

Optimization of process parameters for laser soldering of surface mounted devices : Johann Nicolics, Laszlo Musiejovsky and E. Semerad. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 1155 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 87 KB

english, 1994

137

Packaging of high-density fiber/laser modules using passive alignment techniques : Mitchell S. Cohen et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 944 (1992)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 87 KB

english, 1994

138

Demand grows for industrial-use semiconductor lasers : Yoshifumi Kawamura. JEE (Japan), 96 (January 1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 87 KB

english, 1994

139

Modelling, optimization and control of spatial uniformity in manufacturing processes : Ruey-Shan Guo and Emanuel Sachs. IEEE Transactions on Semiconductor Manufacturing, 6(1), 41 (1993)

Journal:

Microelectronics Reliability

Year:

1994

Language:

english

File:

PDF, 209 KB

english, 1994

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