Volume 41; Issue 11

Microelectronics Reliability

Volume 41; Issue 11
3

Breakdown and latent damage of ultra-thin gate oxides under ESD stress conditions

Year:
2001
Language:
english
File:
PDF, 197 KB
english, 2001
7

Study of the self-alignment of no-flow underfill for micro-BGA assembly

Year:
2001
Language:
english
File:
PDF, 1.16 MB
english, 2001
9

A method of thermal testing of microsystems

Year:
2001
Language:
english
File:
PDF, 1.09 MB
english, 2001
11

Impact of interface nature on deep sub-micron Al-plug resistance

Year:
2001
Language:
english
File:
PDF, 872 KB
english, 2001
12

Tools for contactless testing and simulation of CMOS circuits

Year:
2001
Language:
english
File:
PDF, 537 KB
english, 2001
17

Foreword – On-Chip ESD

Year:
2001
Language:
english
File:
PDF, 24 KB
english, 2001