Volume 42; Issue 1

Microelectronics Reliability

Volume 42; Issue 1

1

Reduction of self-heating effect on SOIM devices

J Roig, D Flores, M Vellvehi, J Rebollo, J Millan

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 259 KB

english, 2002

2

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Jie-Hua Zhao, Wen-Jie Qi, Paul S Ho

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 270 KB

english, 2002

3

Application of forward gated-diode R–G current method in extracting F–N stress-induced interface traps in SOI NMOSFETs

Jin He, Xing Zhang, Ru Huang, Yang-yuan Wang

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 166 KB

english, 2002

4

Influence of test techniques on soft breakdown detection in ultra-thin oxides

Douglas Brisbin, Prasad Chaparala

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 290 KB

english, 2002

5

Precise spice macromodel applied to high-voltage power MOSFET

F.S Lomeli, A Cerdeira

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 177 KB

english, 2002

6

Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors

Rodolfo Quintero, Antonio Cerdeira, Adelmo Ortı́z-Conde

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 441 KB

english, 2002

7

A reliability of different metal contacts with amorphous carbon

S Paul, F.J Clough

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 112 KB

english, 2002

8

Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs

Tetsuya Suemitsu, Yoshino K Fukai, Hiroki Sugiyama, Kazuo Watanabe, Haruki Yokoyama

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 172 KB

english, 2002

9

A simple method for evaluating the transient thermal response of semiconductor devices

N.Y.A Shammas, M.P Rodriguez, F Masana

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 236 KB

english, 2002

10

Novel design of driver and ESD transistors with significantly reduced silicon area

Koen G Verhaege, Markus Mergens, Christian Russ, John Armer, Phillip Jozwiak

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 772 KB

english, 2002

11

High-electric-field effects and degradation of AlGaAs/GaAs power HFETs: a numerical study

Giovanna Sozzi, Roberto Menozzi

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 355 KB

english, 2002

12

Editorial

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 23 KB

english, 2002

13

Calendar

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 36 KB

english, 2002

14

Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system

Tsorng-Dih Yuan, Bor Zen Hong, Howard-H. Chen, Li-Kong Wang

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 420 KB

english, 2002

15

The effects of curing parameters on the properties development of an epoxy encapsulant material

Christine Naito, Michael Todd

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 134 KB

english, 2002

16

Characterization of solder interfaces using laser flash metrology

Chia-Pin Chiu, James G Maveety, Quan A Tran

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 485 KB

english, 2002

17

Improving thermal performance of miniature heat pipe for notebook PC cooling

Seok Hwan Moon, Gunn Hwang, Ho Gyeong Yun, Tae Goo Choy, Young II Kang

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 229 KB

english, 2002

18

Reliability and routability consideration for MCM placement

Yu-Jung Huang, Mei-Hui Guo, Shen-Li Fu

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 209 KB

english, 2002

19

Effect of the drop impact on BGA/CSP package reliability

Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 263 KB

english, 2002

20

Static and low frequency noise characterization of surface- and buried-mode 0.1 μm P and N MOSFETs

M Fadlallah, G Ghibaudo, J Jomaah, M Zoaeter, G Guegan

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 393 KB

english, 2002

21

A 0.11 μm CMOS technology featuring copper and very low k interconnects with high performance and reliability

Yoshihiro Takao, Hiroshi Kudo, Junichi Mitani, Yoshiyuki Kotani, Satoshi Yamaguchi, Keizaburo Yoshie, Kazuo Sukegawa, Nobuhisa Naori, Satoru Asai, Michiari Kawano, Takashi Nagano, Ikuhiro Yamamura, Ma

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 929 KB

english, 2002

22

Reliability improvement of fluorescent lamp using grey forecasting model

C.-H. Chiao, W.Y. Wang

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 213 KB

english, 2002

23

The correlation between the low-frequency electrical noise of high-power quantum well lasers and devices surface non-radiative current

Hu Guijun, Shi Jiawei, Zhang Shumei, Zhang Fenggang

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 102 KB

english, 2002