Volume 50; Issue 3

Microelectronics Reliability

Volume 50; Issue 3

1

The frequency-dependent electrical characteristics of interfaces in the Sn/p-Si metal semiconductor structures

Ş. Karataş, A. Türüt

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 431 KB

english, 2010

2

A high level synthesis design flow with a novel approach for efficient design space exploration in case of multi-parametric optimization objective

Anirban Sengupta, Reza Sedaghat, Zhipeng Zeng

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.17 MB

english, 2010

3

Reliability enhancement of digital combinational circuits based on evolutionary approach

S.J. Seyyed Mahdavi, K. Mohammadi

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 414 KB

english, 2010

4

Impact of interface state trap density on the performance characteristics of different III–V MOSFET architectures

B. Benbakhti, J.S. Ayubi-Moak, K. Kalna, D. Lin, G. Hellings, G. Brammertz, K. De Meyer, I. Thayne, A. Asenov

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 730 KB

english, 2010

5

Extraction of VBIC model parameters for InGaAsSb DHBTs

Yang-Hua Chang, Jian-Wen Chen

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 469 KB

english, 2010

6

Electro-thermal stress effect on InGaP/GaAs heterojunction bipolar low-noise amplifier performance

Xiang Liu, Jiann-shiun Yuan, Juin J. Liou

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 379 KB

english, 2010

7

Reliability growth modeling for in-service electronic systems considering latent failure modes

Tongdan Jin, Haitao Liao, Madhu Kilari

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 387 KB

english, 2010

8

Reliability Object Model Tree (ROM-Tree): A system design-for-reliability method

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 699 KB

english, 2010

9

Circuit level interconnect reliability study using 3D circuit model

Feifei He, Cher Ming Tan

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 3.08 MB

english, 2010

10

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 41 KB

english, 2010

11

Calendar

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 50 KB

english, 2010

12

Improved resolution method to study at 3D the conduction phenomena inside GaAs PIN photodiode

B. Bouabdallah, Y. Bourezig, B. Benichou

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 877 KB

english, 2010

13

The use of Mahalanobis–Taguchi System to improve flip-chip bumping height inspection efficiency

Taho Yang, Yuan-Ting Cheng

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 792 KB

english, 2010

14

Modeling of drain current, capacitance and transconductance in thin film undoped symmetric DG MOSFETs including quantum effects

Saeed Mohammadi, Ali Afzali-Kusha

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.07 MB

english, 2010

15

SrO capping effect for La2O3/Ce-silicate gate dielectrics

K. Kakushima, K. Okamoto, T. Koyanagi, M. Kouda, K. Tachi, T. Kawanago, J. Song, P. Ahmet, H. Nohira, K. Tsutsui, N. Sugii, T. Hattori, H. Iwai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 275 KB

english, 2010

16

Observation of halo implant from the drain side reaching the source side and vice versa in extremely short p-channel transistors

W.S. Lau, Peizhen Yang, Eng Hua Lim, Yee Ling Tang, Seow Wei Lai, V.L. Lo, S.Y. Siah, L. Chan

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 525 KB

english, 2010

17

Warpage mechanism analyses of strip panel type PBGA chip packaging

Yeong K. Kim, In Soo Park, Jooho Choi

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.34 MB

english, 2010

18

Electromigration-induced stress in a confined bamboo interconnect with randomly distributed grain sizes

X. Dong, P. Zhu, Z. Li, J. Sun, J.D. Boyd

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 430 KB

english, 2010

19

Analysis of dependence of short-channel effects in double-gate MOSFETs on channel thickness

Yusuke Kobayashi, Kuniyuki Kakushima, Parhat Ahmet, V. Ramgopal Rao, Kazuo Tsutsui, Hiroshi Iwai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.05 MB

english, 2010

20

A prognostics and health management roadmap for information and electronics-rich systems

Michael Pecht, Rubyca Jaai

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 475 KB

english, 2010