Volume 55; Issue 6

Microelectronics Reliability

Volume 55; Issue 6

1

Possible failure modes in Press-Pack IGBTs

Tinschert, Lukas, Årdal, Atle Rygg, Poller, Tilo, Bohlländer, Marco, Hernes, Magnar, Lutz, Josef

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.83 MB

english, 2015

2

What is Electrical Overstress? - Analysis and Conclusions

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 961 KB

english, 2015

3

Analysis of dielectric breakdown in CoFeB/MgO/CoFeB magnetic tunnel junction

Khan, Ayaz Arif

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.90 MB

english, 2015

4

The device characteristics of Ir- and Ti-based Schottky gates AlSb/InAs high electron mobility transistors

Chiu, Hsien-Chin, Lin, Wen-Yu, Hsueh, W.J., Chiu, Pei-Chin, Hsin, Yue-Ming, Chyi, Jen-Inn

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 544 KB

english, 2015

5

The effect of external stress on the electrical characteristics of AlGaN/GaN HEMTs

Liu, Kun, Zhu, Hui, Feng, Shiwei, Shi, Lei, Zhang, Yamin, Guo, Chunsheng

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 494 KB

english, 2015

6

Enhanced power cycling performance of IGBT modules with a reinforced emitter contact

Özkol, Emre, Brem, Franziska, Liu, Chunlei, Hartmann, Samuel, Kopta, Arnost

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.12 MB

english, 2015

7

Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test

Gallois-Garreignot, Sébastien, Benzima, Naceur, Benmussa, Etienne, Moutin, Caroline, Bouchard, Pierre-Olivier, Fiori, Vincent, Tavernier, Clément

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.47 MB

english, 2015

8

Sintered silver finite element modelling and reliability based design optimisation in power electronic module

Rajaguru, Pushparajah, Lu, Hua, Bailey, Chris

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.50 MB

english, 2015

9

Assessing the value of a lead-free solder control plan using cost-based FMEA

Lillie, Edwin, Sandborn, Peter, Humphrey, David

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.22 MB

english, 2015

10

Low cost and highly reliable radiation hardened latch design in 65nm CMOS technology

Qi, Chunhua, Xiao, Liyi, Guo, Jing, Wang, Tianqi

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.14 MB

english, 2015

11

Design, development and reliability testing of a low power bridge-type micromachined hotplate

Prasad, Mahanth

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.55 MB

english, 2015

12

Microstructural evolution of ultrasonic-bonded aluminum wires

Broll, Marian Sebastian, Geissler, Ute, Höfer, Jan, Schmitz, Stefan, Wittler, Olaf, Lang, Klaus Dieter

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 475 KB

english, 2015

13

Impact of substrate resistance and layout on passivation etch-induced wafer arcing and reliability

Li, Po, Wang, Yung-Cheng, Peng, Jing-Wei, Zhang, David Wei

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 641 KB

english, 2015

14

Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions

Mirgkizoudi, M., Liu, C., Conway, P.P., Riches, S.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 174 KB

english, 2015

15

Porous low k film with multilayer structure used for promoting adhesion to SiCN cap barrier layer

Zhou, M., Zhang, B.C.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.86 MB

english, 2015

16

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 38 KB

english, 2015

17

Total ionizing dose sensitivity of function blocks in FRAM

Gu, Ke, Liou, J.J., Li, Wei, Liu, Yang, Li, Ping

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.67 MB

english, 2015

18

T pattern fuse construction in segment metallized film capacitors based on self-healing characteristics

Li, Haoyuan, Li, Hua, Li, Zhiwei, Lin, Fuchang, Liu, De, Wang, Wenjuan, Wang, Bowen, Xu, Zhijian

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 661 KB

english, 2015

19

Screening small-delay defects using inter-path correlation to reduce reliability risk

García-Gervacio, José L., Nocua, Alejandro, Champac, Victor

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.51 MB

english, 2015

20

Swarm intelligence driven design space exploration of optimal k-cycle transient fault secured datapath during high level synthesis based on user power–delay budget

Sengupta, Anirban, Sedaghat, Reza

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.15 MB

english, 2015