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Volume 66
Main
Microelectronics Reliability
Volume 66
Microelectronics Reliability
Volume 66
1
Characteristics of ESD protection devices operated under elevated temperatures
Liang, Wei
,
Dong, Aihua
,
Li, Hang
,
Miao, Meng
,
Kuo, Chung-Chen
,
Klebanov, Maxim
,
Liou, Juin J.
Journal:
Microelectronics Reliability
Year:
2016
Language:
english
File:
PDF, 2.05 MB
Your tags:
english, 2016
2
Transient dual interface measurement of junction-to-case thermal resistance in AlGaN/GaN HEMT utilizing an improved infrared microscope
Zhai, Yuwei
,
Liang, Faguo
,
Guo, Chunsheng
,
Liu, Yan
Journal:
Microelectronics Reliability
Year:
2016
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2016
3
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array
Ng, Fei Chong
,
Abas, Aizat
,
Ishak, MHH
,
Abdullah, MZ
,
Aziz, Abdul
Journal:
Microelectronics Reliability
Year:
2016
Language:
english
File:
PDF, 6.74 MB
Your tags:
english, 2016
4
The coupled effects of salt-spray corrosion, electrical current and mechanical load on the electrical and fatigue properties of COG assembly
Li, Fan
,
Zhang, Wenguo
,
Gao, Lilan
,
Gao, Hong
Journal:
Microelectronics Reliability
Year:
2016
Language:
english
File:
PDF, 933 KB
Your tags:
english, 2016
5
Editorial Board
Journal:
Microelectronics Reliability
Year:
2016
Language:
english
File:
PDF, 38 KB
Your tags:
english, 2016
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