Volume 8; Issue 5

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ECS Journal of Solid State Science and Technology
Volume 8; Issue 5

ECS Journal of Solid State Science and Technology

Volume 8; Issue 5

1

Ammonium Persulfate and Potassium Oleate Containing Silica Dispersions for Chemical Mechanical Polishing for Cobalt Interconnect Applications

Ranaweera, C. K., Baradanahalli, N. K., Popuri, R., Seo, J., Babu, S. V.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.28 MB

english, 2019

2

Formation of Cobalt-BTA Complexes and Their Removal from Various Surfaces Relevant to Cobalt Interconnect Applications

Seo, Jihoon, Vegi, S. S. R. K. Hanup, Ranaweera, C. K., Baradanahalli, N. K., Han, Ja-Hyung, Koli, Dinesh, Babu, S. V.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.94 MB

english, 2019

3

Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications

Zubi, T. B., Wiencek, R. A., Mlynarski, A. L., Truffa, J. M., Wortman-Otto, K. M., Saucedo, C., Salinas, M. G., Graverson, C. F., Keleher, J. J.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.00 MB

english, 2019

4

Investigation on Material Removal Uniformity in Electrochemical Mechanical Polishing by Polishing Pad with Holes

Liu, Zuotao, Jin, Zhuji, Wu, Di, Guo, Jiang

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.47 MB

english, 2019

5

Surface Activation by Electrolytically Ionized Slurry during Cu CMP

Lee, Dasol, Lee, Hyunseop, Jeong, Seonho, Yuh, Minjong, Jeong, Haedo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.04 MB

2019

6

Characterization of 1, 2, 4-Triazole as Corrosion Inhibitor for Chemical Mechanical Polishing of Cobalt in H 2 O 2 Based Acid Slurry

He, Peng, Wu, Bingbing, Shao, Shuai, Teng, Tong, Wang, Peng, Qu, Xin-Ping

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.71 MB

2019

7

Surface Activation by Electrolytically Ionized Slurry during Cu CMP

Lee, Dasol, Lee, Hyunseop, Jeong, Seonho, Yuh, Minjong, Jeong, Haedo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.04 MB

english, 2019

8

Characterization of 1, 2, 4-Triazole as Corrosion Inhibitor for Chemical Mechanical Polishing of Cobalt in H 2 O 2 Based Acid Slurry

He, Peng, Wu, Bingbing, Shao, Shuai, Teng, Tong, Wang, Peng, Qu, Xin-Ping

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.71 MB

english, 2019

9

Impact of Pad Material Properties on CMP Performance for Sub-10nm Technologies

Khanna, Aniruddh J., Kakireddy, Raghava, Jawali, Puneet, Chockalingam, Ashwin, Redfield, Daniel, Bajaj, Rajeev, Fung, Jason, Cornejo, Mario, Yamamura, Mayu, Yuan, Zhibo, Orilall, Chris, Fu, Boyi, Gana

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 930 KB

english, 2019

10

Effect of Potassium Periodate Oxidizer on Germanium Chemical Mechanical Planarization Using Fumed Silica as Abrasive

Gupta, Apeksha, Manivannan, R., Victoria, S. Noyel

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 537 KB

english, 2019

11

Enhanced Open Innovation: CMP Innovation to Open New Paradigm

Tsujimura, Manabu

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.98 MB

english, 2019

12

A Fundamental Approach to Electrochemical Analyses on Chemically Modified Thin Films for Barrier CMP Optimization

Yagan, Rawana, Basim, G. Bahar

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.38 MB

english, 2019

13

Effect of Surfactant Based Abrasive Free Slurry on CMP Polishing Rate and Planarization of Semi-Polar (11‒22) GaN Surface

Parthiban, P., Das, D.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.12 MB

2019

14

Effect of Ceria Abrasive Synthesized by Supercritical Hydrothermal Method for Chemical Mechanical Planarization

Choi, Jinhak, Shin, Cheolmin, Yang, Jichul, Chae, Seung-Ki, Kim, Taesung

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 914 KB

2019

15

Pad-Wafer-Slurry Interface Information from Force Data

Borucki, L., Sampurno, Y., Philipossian, A.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.91 MB

english, 2019

16

Pad-Wafer-Slurry Interface Information from Force Data

Borucki, L., Sampurno, Y., Philipossian, A.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.91 MB

2019

17

Evaluation of Size Distribution Measurement Methods for Sub-100 nm Colloidal Silica Nanoparticles and Its Application to CMP Slurry

Shin, Cheolmin, Choi, Jinhak, Kwak, Donggeon, Kim, Juhwan, Yang, Jichul, Chae, Seung-ki, Kim, Taesung

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.22 MB

english, 2019

18

Preface—JSS Focus Issue on CMP for Sub-10 nm Technologies

Philipossian, Ara, Park, Jin-Goo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 63 KB

english, 2019

19

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.97 MB

english, 2019

20

Effect of Diethylenetriamine Pentaacetate Pentapotassium on Chemical Mechanical Polishing of Cobalt in H 2 O 2 Based Slurry

Liu, Fengxia, Wang, Shengli, Wang, Chenwei, Tian, Qiyuan, Liang, Tingwei, Qi, Jiacheng

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 788 KB

english, 2019

21

Insights into Tungsten Chemical Mechanical Planarization: Part II. Effect of Pad Surface Micro-Texture on Frictional, Thermal and Kinetic Aspects of the Process

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

22

Effect of Controlling Abrasive Size in Slurry for Tungsten Contact CMP Process

Egan, Bryan, Kim, Hong Jin

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 822 KB

english, 2019

23

Slurry Supply Mechanism Utilizing Capillary Effect in Chemical Mechanical Planarization

Fujita, Takashi, Watanabe, Junji

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 981 KB

english, 2019

24

A Quantitative Analysis of Multi-Scale Response of CMP Pad and Implication to Process Assessments

Bastawros, Ashraf-F., Chandra, Abhijit, Gouda, Sunil D.

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.27 MB

english, 2019

25

Application of Neural Network-Based Oxide Deposition Models to CMP Modeling

Ghulghazaryan, Ruben, Piliposyan, Davit, Wilson, Jeff

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.77 MB

english, 2019

26

Mechanistic Understanding of Low κ Organosilicate Glass Film Planarization

Mallikarjunan, Anupama, Achtyl, Jennifer, Yang, Rung-Je, Huang, Chen-Yuan, Chao, Shih-Hsuan, Gan, Lu, Tamboli, Dnyanesh, Ridgeway, Robert, Schlueter, James, Tsai, Ming-Shih, Li, Chris, O'Neill, Mark

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 513 KB

english, 2019

27

Insights into Tungsten Chemical Mechanical Planarization: Part I. Surface Micro-Texture Evolution during Pad Break-In

Mariscal, Juan Cristobal, McAllister, Jeffrey, Sampurno, Yasa, Suarez, Jon Sierra, Borucki, Leonard, Philipossian, Ara

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

File:

PDF, 1.97 MB

2019

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