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1

SABSA: SWITCHING-ACTIVITY-BASED STATE ASSIGNMENT

WASHABAUGH, SCOTT, FRANZON, PAUL D., NAGLE, H. TROY

Journal:

International Journal of High Speed Electronics and Systems

Year:

1994

Language:

english

File:

PDF, 420 KB

english, 1994

2

Handbook of 3D Integration (Design, Test, and Thermal Management) || Physical Design Flow for 3D/CoWoS® Stacked ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.70 MB

english, 2019

3

Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer

Gadfort, Peter, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.52 MB

english, 2014

4

[IEEE 2016 IEEE International Conference on RFID (RFID) - Orlando, FL, USA (2016.5.3-2016.5.5)] 2016 IEEE International Conference on RFID (RFID) - Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic

Zhao, Wenxu, Bhanushali, Kirti, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 975 KB

english, 2016

5

Handbook of 3D Integration (Design, Test, and Thermal Management) || IEEE Std P1838: 3D Test Access Standard Under Development

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.34 MB

english, 2019

6

Handbook of 3D Integration (Design, Test, and Thermal Management) || 3D Design-for-Test Architecture

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 2.02 MB

english, 2019

7

Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation

Li, Bowen, Jiao, Brandon, Chou, Chih-Hsun, Mayder, Romi, Franzon, Paul

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 3.01 MB

2020

8

Load characterization of high displacement piezoelectric actuators with various end conditions

James Mulling, Tim Usher, Brian Dessent, Jeremy Palmer, Paul Franzon, Eddie Grant, Angus Kingon

Journal:

Sensors and Actuators A: Physical

Year:

2001

Language:

english

File:

PDF, 135 KB

english, 2001

9

A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory

Bapat, Ojas A., Franzon, Paul D., Fastow, Richard M.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2014

Language:

english

File:

PDF, 2.87 MB

english, 2014

10

[IEEE 2013 IEEE International Symposium on Circuits and Systems (ISCAS) - Beijing (2013.5.19-2013.5.23)] 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013) - Exploring early design tradeoffs in 3DIC

Franzon, Paul D., Priyadarshi, Shivam, Lipa, Steve, Davis, W. Rhett, Thorolfsson, Thor

Year:

2013

Language:

english

File:

PDF, 678 KB

english, 2013

11

Thermal Pathfinding for 3-D ICs

Priyadarshi, Shivam, Davis, W. Rhett, Steer, Michael B., Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.79 MB

english, 2014

12

[IEEE 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Waltham, MA, USA (2012.10.9-2012.10.10)] 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies

Ledford, Joshua, Gadfort, Peter, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 234 KB

english, 2012

13

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies

Davis, W. Rhett, Oh, Eun Chu, Sule, Ambarish M., Franzon, Paul D.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2009

Language:

english

File:

PDF, 1.32 MB

english, 2009

14

[IEEE 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Waltham, MA, USA (2012.10.9-2012.10.10)] 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Near threshold RF-only analog to digital converter

Gadfort, Peter, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 215 KB

english, 2012

15

Surrogate-Model-Based Analysis of Analog Circuits—Part II: Reliability Analysis

Yelten, Mustafa Berke, Franzon, Paul D., Steer, Michael B.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 594 KB

english, 2011

16

Improving Behavioral IO Buffer Modeling Based on IBIS

Varma, Ambrish K., Steer, Michael, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.45 MB

english, 2008

17

Analog Negative-Bias-Temperature-Instability Monitoring Circuit

Yelten, Mustafa Berke, Franzon, Paul D., Steer, Michael B.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 208 KB

english, 2012

18

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, Karthik, Wilson, John, Erickson, Evan, Feng, Zhiping, Xu, Jian, Mick, Stephen, Franzon, Paul

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

19

[IEEE 2012 IEEE Custom Integrated Circuits Conference - CICC 2012 - San Jose, CA, USA (2012.09.9-2012.09.12)] Proceedings of the IEEE 2012 Custom Integrated Circuits Conference - A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration

Thorolfsson, Thorlindur, Lipa, Steve, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 2.86 MB

english, 2012

20

Fully Integrated AC Coupled Interconnect Using Buried Bumps

Wilson, John, Mick, Stephen, Xu, Jian, Luo, Lei, Bonafede, Salvatore, Huffman, Alan, LaBennett, Richard, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2007

Language:

english

File:

PDF, 1.48 MB

english, 2007

21

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

Xi Chen,, Ting Zhu,, Davis, William Rhett, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.89 MB

english, 2014

22

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Erickson, Evan, Wilson, John, Chandrasekar, Karthik, Franzon, Paul D.

Year:

2009

Language:

english

File:

PDF, 663 KB

english, 2009

23

A Multitier Study on Various Stacking Topologies of TSV-Based PDN Systems Using On-Chip Decoupling Capacitor Models

Charles, Gary, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 2.47 MB

english, 2015

24

Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

Canavero, Flavio, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 303 KB

english, 2008

25

[IEEE 2007 IEEE International Symposium on Circuits and Systems - New Orleans, LA, USA (2007.05.27-2007.05.30)] 2007 IEEE International Symposium on Circuits and Systems - Hardware Architecture of a Parallel Pattern Matching Engine

Yadav, Meeta, Venkatachaliah, Ashwini, Franzon, Paul D.

Year:

2007

Language:

english

File:

PDF, 791 KB

english, 2007

26

[IEEE 2007 IEEE International Symposium on Circuits and Systems - New Orleans, LA, USA (2007.05.27-2007.05.30)] 2007 IEEE International Symposium on Circuits and Systems - Flexible Low Power Probability Density Estimation Unit For Speech Recognition

Pazhayaveetil, Ullas, Chandra, Dhruba, Franzon, Paul

Year:

2007

Language:

english

File:

PDF, 282 KB

english, 2007

27

[IEEE 2015 IEEE Custom Integrated Circuits Conference - CICC 2015 - San Jose, CA, USA (2015.9.28-2015.9.30)] 2015 IEEE Custom Integrated Circuits Conference (CICC) - Computing in 3D

Franzon, Paul, Rotenberg, Eric, Tuck, James, Davis, W. Rhett, Zhou, Huiyang, Schabel, Joshua, Zhang, Zhenquian, Dwiel, J. Brandon, Forbes, Elliott, Huh, Joonmoo, Lipa, Steve

Year:

2015

File:

PDF, 754 KB

2015

28

SPIE Proceedings [SPIE International Symposium on Microelectronics and MEMS - Adelaide, Australia (Monday 17 December 2001)] Design, Characterization, and Packaging for MEMS and Microelectronics II - Coupling and quality factors in RFID

Cole, Peter H., Franzon, Paul D., Malshe, Ajay P., Tay, Francis E.

Year:

2001

Language:

english

File:

PDF, 201 KB

english, 2001

29

Multimode High-Density Link Design Methodology and Implementation

Yan, Zhuo, Aygun, Kemal, Braunisch, Henning, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.77 MB

english, 2016

30

[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Novel packaging and thermal measurement for 3D heterogeneous stacks

Harris, T. Robert, Davis, W. Rhett, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 5.88 MB

english, 2016

31

[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Machine learning in physical design

Li, Bowen, Franzon, Paul D.

Year:

2016

Language:

english

File:

PDF, 179 KB

english, 2016

32

[IEEE 2016 29th IEEE International System-on-Chip Conference (SOCC) - Seattle, WA, USA (2016.9.6-2016.9.9)] 2016 29th IEEE International System-on-Chip Conference (SOCC) - Hardware implementation of Hierarchical Temporal Memory algorithm

Li, Weifu, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 495 KB

english, 2016

33

Handbook of 3D Integration (Design, Test, and Thermal Management) || Test and Debug Strategy for TSMC CoWoS ® Stacking Process-Based Heterogeneous 3D-IC: A Silicon Study

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.83 MB

english, 2019

34

Handbook of 3D Integration (Design, Test, and Thermal Management) || Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 936 KB

english, 2019

35

Handbook of 3D Integration (Design, Test, and Thermal Management) || 3D Stacked DRAM Memories

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 3.36 MB

english, 2019

36

Handbook of 3D Integration (Design, Test, and Thermal Management) || Electronic Design Automation for 3D

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 273 KB

english, 2019

37

Asymmetric Transformer Design With Multiband Frequency Response for Simultaneous Power and Data Transfer

Zannat, Nazia, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 4.38 MB

2020

38

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

Harris, T. Robert, Davis, W. Rhett, Lipa, Steven, Pitts, W. Shepherd, Franzon, Paul D.

Year:

2019

File:

PDF, 802 KB

2019

39

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - CTLE Adaptation Using Deep Learning in High- speed SerDes Link

Li, Bowen, Jiao, Brandon, Chou, Chih-Hsun, Mayder, Romi, Franzon, Paul

Year:

2020

File:

PDF, 585 KB

2020

40

Reversible Modulation of Conductance in Silicon Devices via UV/Visible-Light Irradiation

Tao He, Meng Lu, Jun Yao, Jianli He, Bo Chen, Neil Halen Di Spigna, David P. Nackashi, Paul D. Franzon, James M. Tour

Journal:

Advanced Materials

Year:

2008

Language:

english

File:

PDF, 515 KB

english, 2008

41

Uniformity analysis of wafer scale sub-25 nm wide nanowire array nanoimprint mold fabricated by PEDAL process

Sachin R. Sonkusale, Neil H. Di Spigna, Paul D. Franzon

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 1.58 MB

english, 2007

42

Fabrication of wafer scale, aligned sub-25 nm nanowire and nanowire templates using planar edge defined alternate layer process

Sachin R. Sonkusale, Christian J. Amsinck, David P. Nackashi, Neil H. Di Spigna, Doug Barlage, Mark Johnson, Paul D. Franzon

Journal:

Physica E: Low-dimensional Systems and Nanostructures

Year:

2005

Language:

english

File:

PDF, 448 KB

english, 2005

43

An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale

Amy Szuchmacher Blum, Carissa M. Soto, Charmaine D. Wilson, Tina L. Brower, Steven K. Pollack, Terence L. Schull, Anju Chatterji, Tianwei Lin, John E. Johnson, Christian Amsinck, Paul Franzon, Rangana

Journal:

Year:

2005

Language:

english

File:

PDF, 528 KB

english, 2005

44

Cover Picture: An Engineered Virus as a Scaffold for Three-Dimensional Self-Assembly on the Nanoscale (Small 7/2005)

Amy Szuchmacher Blum, Carissa M. Soto, Charmaine D. Wilson, Tina L. Brower, Steven K. Pollack, Terence L. Schull, Anju Chatterji, Tianwei Lin, John E. Johnson, Christian Amsinck, Paul Franzon, Rangana

Journal:

Year:

2005

File:

PDF, 60 KB

2005

45

Comparing Through-Silicon-Via (TSV) Void/Pinhole Defect Self-Test Methods

Yi Lou, Zhuo Yan, Fan Zhang, Paul D. Franzon

Journal:

Journal of Electronic Testing

Year:

2012

Language:

english

File:

PDF, 753 KB

english, 2012

46

Physically based molecular device model in a transient circuit simulator

Nikhil M. Kriplani, David P. Nackashi, Christian J. Amsinck, Neil H. Di Spigna, Michael B. Steer, Paul D. Franzon, Ramon L. Rick, Gemma C. Solomon, Jeffrey R. Reimers

Journal:

Chemical Physics

Year:

2006

Language:

english

File:

PDF, 218 KB

english, 2006

47

Clocking Optimization and Distribution in Digital Systems with Scheduled Skews

Hong-Yean Hsieh, Wentai Liu, Paul Franzon, Ralph Cavin III

Journal:

Journal of Signal Processing Systems

Year:

1997

Language:

english

File:

PDF, 394 KB

english, 1997

48

Comparison of modeling techniques in circuit variability analysis

Mustafa Berke Yelten, Paul D. Franzon, Michael B. Steer

Journal:

International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

49

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning

Priyadarshi, Shivam, Saunders, Christopher S., Kriplani, Nikhil M., Demircioglu, Harun, Davis, W. Rhett, Franzon, Paul D., Steer, Michael B.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2012

Language:

english

File:

PDF, 7.97 MB

english, 2012

50

[IEEE 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Tempe, AZ, USA (2012.10.21-2012.10.24)] 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems - S-parameter based multimode signaling

Yan, Zhuo, Won, Chanyoun, Franzon, Paul D., Aygun, Kemal, Braunisch, Henning

Year:

2012

Language:

english

File:

PDF, 517 KB

english, 2012