16

Cyclic bending reliability of wafer-level chip-scale packages

Year:
2007
Language:
english
File:
PDF, 962 KB
english, 2007
20

A fast -means clustering algorithm using cluster center displacement

Year:
2009
Language:
english
File:
PDF, 289 KB
english, 2009
25

Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints

Year:
2009
Language:
english
File:
PDF, 3.21 MB
english, 2009