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1

The residual thermal stresses due to cool-down of post cure for the symmetric cross-ply TCM composite material

Rong-Sheng Chen, Chen-Yi Tu, Guey-Shin Chen

Journal:

Composite Structures

Year:

1993

Language:

english

File:

PDF, 851 KB

english, 1993

2

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses

Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 512 KB

english, 2007

3

Effect of curing process on mechanical properties of honeycomb-core sandwich plates

Rong-Sheng Chen

Journal:

Composites Engineering

Year:

1994

Language:

english

File:

PDF, 653 KB

english, 1994

4

Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint

Chao-Yang Mao, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.35 MB

english, 2008

5

Transient Submodeling Analysis for Board-Level Drop Tests of Electronic Packages

Tsai, Tsung-Yueh, Yeh, Chang-Lin, Lai, Yi-Shao, Chen, Rong-Sheng

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2007

Language:

english

File:

PDF, 2.43 MB

english, 2007

6

[IEEE 2019 International Conference on IC Design and Technology (ICICDT) - SUZHOU, China (2019.6.17-2019.6.19)] 2019 International Conference on IC Design and Technology (ICICDT) - Susceptibility Evaluation of 3D Integrated Static Random Access Memory with Through-Silicon Vias (TSVs)

Cao, Xue-Bing, Xiao, Li-Yi, Zhang, Rong-Sheng, Li, Jia-Qiang, Li, Hong-Chen, Wang, Jin-Xiang

Year:

2019

Language:

english

File:

PDF, 1.21 MB

english, 2019

7

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering

Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.07 MB

english, 2008

8

Finite element model verification for packaged printed circuit board by experimental modal analysis

Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.61 MB

english, 2008

9

Optimal dimension of PQFP by using Taguchi method

Rong-Sheng Chen, Heng-cheng Lin, Chieh Kung

Journal:

Composite Structures

Year:

2000

Language:

english

File:

PDF, 194 KB

english, 2000

10

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages

Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 766 KB

english, 2008

11

Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method

Cheng, Hsin-En, Chen, Rong-Sheng

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 6.41 MB

english, 2014

12

SPIE Proceedings [SPIE Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Yunnan, China (Sunday 7 August 2011)] Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Measurement and research on the appearance of tongue board based on modification to discuss centrifugal fan air performance

Jwo, Ching-Song, Fan, Kuang-Chao, Song, Man, Cheng, Tseng-Tang, Cho, Hung-Pin, Lu, Rong-Sheng, Chiang, Wei-Tang, Chen, Sih-Li, Chen, Chien-Wei, Jian, Ling-You

Year:

2011

Language:

english

File:

PDF, 4.69 MB

english, 2011

13

Xuebijing Protects Rats from Sepsis Challenged with Acinetobacter baumannii by Promoting Annexin A1 Expression and Inhibiting Proinflammatory Cytokines Secretion

He, Xian-Di, Wang, Yan, Wu, Qiong, Wang, Hua-Xue, Chen, Zhen-Dong, Zheng, Rong-Sheng, Wang, Zi-Shu, Wang, Jun-Bin, Yang, Yan

Journal:

Evidence-based Complementary and Alternative Medicine

Year:

2013

Language:

english

File:

PDF, 6.26 MB

english, 2013

14

SPIE Proceedings [SPIE Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Yunnan, China (Sunday 7 August 2011)] Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Accurate and efficient identification of cable natural frequencies for cable tension monitoring by vibration frequency method

Liu, Lin, Fan, Kuang-Chao, Song, Man, Chen, Weimin, Zhang, Peng, Lu, Rong-Sheng, Hu, Shunren, Luo, Wei

Year:

2011

Language:

english

File:

PDF, 499 KB

english, 2011

15

Direct bioactive ceramics coating via reactive Growing Integration Layer method on α-Ti-alloy

Huang, Chi-Huang, Chen, Rong-Sheng, Yoshimura, Masahiro

Journal:

Materials Science and Engineering: C

Year:

2017

Language:

english

File:

PDF, 1.40 MB

english, 2017

16

Robustness of coherence between two quantum dots mediated by Majorana fermions

Chen, Liang, Zhang, Ye-Qi, Han, Rong-Sheng

Journal:

Chinese Physics B

Year:

2018

Language:

english

File:

PDF, 968 KB

english, 2018

17

Learning pairing symmetries in disordered superconductors using spin-polarized local density of states

Chen, Liang, Wang, Chen-Xi, Han, Rong-Sheng, Zhang, Ye-Qi

Journal:

New Journal of Physics

Year:

2020

Language:

english

File:

PDF, 2.91 MB

english, 2020

18

Carbon fiber nanoelectrodes applied to microchip electrophoresis amperometric detection of neurotransmitter dopamine in rat pheochromocytoma (PC12) cells

Han Cheng, Wei-Hua Huang, Rong-Sheng Chen, Zong-Li Wang, Jie-Ke Cheng

Journal:

ELECTROPHORESIS

Year:

2007

Language:

english

File:

PDF, 358 KB

english, 2007

19

Structural and mechanical characteristics of (1 0 3) AlN thin films prepared by radio frequency magnetron sputtering

Ping-Feng Yang, Sheng-Rui Jian, Sean Wu, Yi-Shao Lai, Chung-Ting Wang, Rong-Sheng Chen

Journal:

Applied Surface Science

Year:

2009

Language:

english

File:

PDF, 899 KB

english, 2009

20

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Ping-Feng Yang, Yi-Shao Lai, Sheng-Rui Jian, Jiunn Chen, Rong-Sheng Chen

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 1.09 MB

english, 2008

21

Comparison of Four Carbon Fiber Electrodes in Microfluidic Chip Integrated With Electrochemical Detector

Cheng Han, Wu Jian-Hong, Chen Rong-Sheng, Huang Wei-Hua, Wang Zong-Li, Cheng Jie-Ke

Journal:

Chinese Journal of Analytical Chemistry

Year:

2008

Language:

english

File:

PDF, 241 KB

english, 2008

22

Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4Intermetallic Compounds

Ping-Feng Yang, Sheng-Rui Jian, Yi-Shao Lai, Rong-Sheng Chen

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 364 KB

english, 2009

23

Approach of the special finite element for honeycore composites

Chen Rong-Sheng, Wu Pao-Chuan

Journal:

Computers & Structures

Year:

1995

Language:

english

File:

PDF, 696 KB

english, 1995

24

Surface-enhanced Raman spectroscopy of free bilirubin and bilirubin complexes with transition metals iron(II), nickel(II) and cobalt(II)

Jian Chen, Ji-ming Hu, Zhi-san Xu, Rong-sheng Sheng

Journal:

Spectrochimica Acta Part A: Molecular Spectroscopy

Year:

1994

Language:

english

File:

PDF, 308 KB

english, 1994

25

Antibacterial properties and corrosion resistance of AISI 420 stainless steels implanted by silver and copper ions

Hong-wei Ni, Han-shuang Zhang, Rong-sheng Chen, Wei-ting Zhan, Kai-fu Huo, Zhen-yu Zuo

Journal:

International Journal of Minerals, Metallurgy and Materials

Year:

2012

Language:

english

File:

PDF, 363 KB

english, 2012

26

Multispectral Hadamard Transform Raman Microscopy

Liu, Kei-Lee K., Chen, Li-Heng, Sheng, Rong-Sheng, Morris, Michael D.

Journal:

Applied Spectroscopy

Year:

1991

Language:

english

File:

PDF, 638 KB

english, 1991

27

Surface-Enhanced Resonance Raman Spectra Study of α,β,γ,δ-Tetra-(4-Trimethyl Ammonium Phenyl) Porphyrin

Chen, Jian, Hu, Ji-Ming, Xu, Zhi-San, Sheng, Rong-Sheng

Journal:

Applied Spectroscopy

Year:

1993

Language:

english

File:

PDF, 357 KB

english, 1993

28

Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD

Ping-Feng Yang, Sheng-Rui Jian, Yi-Shao Lai, Chu-Shou Yang, Rong-Sheng Chen

Journal:

Journal of Alloys and Compounds

Year:

2008

Language:

english

File:

PDF, 1.12 MB

english, 2008

29

Domestication and geographic origin of Oryza sativa in China: insights from multilocus analysis of nucleotide variation of O. sativa and O. rufipogon

Xin Wei, Wei-Hua Qiao, You-Tao Chen, Rong-Sheng Wang, Li-Rong Cao, Wan-Xia Zhang, Nan-Nan Yuan, Zi-Chao Li, Han-Lai Zeng, Qing-Wen Yang

Journal:

Molecular Ecology

Year:

2012

Language:

english

File:

PDF, 339 KB

english, 2012

30

Constructing Molecular Identity for Soybean Varieties from Heilongjiang Province, China

Yun-Lai GAO, Rong-Sheng ZHU, Chun-Yan LIU, Wen-Fu LI, Hong-Wei JIANG, Can-Dong LI, Bing-Chen YAO, Guo-Hua HU, Qing-Shan CHEN

Journal:

Acta Agronomica Sinica (Elsevier)

Year:

2009

Language:

english

File:

PDF, 571 KB

english, 2009

31

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - The Improvement of Temperature Uniformity for Polymerase Chain Reaction Chip with a Micro-hotplate (Nickel)

Mao, Chao-yang, Chen, Rong-sheng, Chen, Yung-shieng

Year:

2006

Language:

english

File:

PDF, 6.63 MB

english, 2006

32

SPIE Proceedings [SPIE Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Yunnan, China (Sunday 7 August 2011)] Seventh International Symposium on Precision Engineering Measurements and Instrumentation - A novel linear displacement sensor

Yang, Ji-sen, Fan, Kuang-Chao, Song, Man, Zhang, Jing, Chen, Xi-hou, Lu, Rong-Sheng, Zhang, Tian-heng

Year:

2011

Language:

english

File:

PDF, 809 KB

english, 2011

33

Photoacoustic Spectroscopy Analysis of Traditional Chinese Medicine

Chen, Lu, Zhao, Bin-xing, Xiao, Hong-tao, Tong, Rong-sheng, Gao, Chun-ming

Journal:

International Journal of Thermophysics

Year:

2013

Language:

english

File:

PDF, 290 KB

english, 2013

34

Rapid and Sensitive Headspace Gas Chromatography-Mass Spectrometry Method for the Analysis of Ethanol in the Whole Blood

Xiao, Hong-tao, He, Lin, Tong, Rong-sheng, Yu, Ji-ying, Chen, Lu, Zou, Jing, Li, Jin-qi, Bian, Yuan, Zhang, Yuan

Journal:

Journal of Clinical Laboratory Analysis

Year:

2014

Language:

english

File:

PDF, 121 KB

english, 2014

35

Real-Time Monitoring of Auxin Vesicular Exocytotic Efflux from Single Plant Protoplasts by Amperometry at Microelectrodes Decorated with Nanowires

Liu, Jun-Tao, Hu, Liang-Sheng, Liu, Yan-Ling, Chen, Rong-Sheng, Cheng, Zhi, Chen, Shi-Jing, Amatore, Christian, Huang, Wei-Hua, Huo, Kai-Fu

Journal:

Angewandte Chemie International Edition

Year:

2014

Language:

english

File:

PDF, 1.59 MB

english, 2014

36

Photocatalytic activity of ferric oxide/titanium dioxide nanocomposite films on stainless steel fabricated by anodization and ion implantation

Zhan, Wei-ting, Ni, Hong-wei, Chen, Rong-sheng, Yue, Gao, Tai, Jun-kai, Wang, Zi-yang

Journal:

International Journal of Minerals, Metallurgy and Materials

Year:

2013

Language:

english

File:

PDF, 557 KB

english, 2013

37

Carbon Fiber Nanoelectrodes Modified by Single-Walled Carbon Nanotubes

Chen, Rong-Sheng, Huang, Wei-Hua, Tong, Hua, Wang, Zong-Li, Cheng, Jie-Ke

Journal:

Analytical Chemistry

Year:

2003

Language:

english

File:

PDF, 146 KB

english, 2003

38

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Package fatigue reliability of the stacked chip BGA evaluated by optimal equivalent solder

Chen, Rong-Sheng, Cheng, Hsin-En, Mao, Chao-Yang

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

39

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Packaging Parameter Analysis on Solder Joint Reliability for Twin Die Stacked Packages by Variance in Strain Energy Density of Each Solder Joint

Mao, Chao-yang, Chen, Rong-sheng

Year:

2006

Language:

english

File:

PDF, 9.42 MB

english, 2006

40

Vascular lumen simulation and highly-sensitive nitric oxide detection using three-dimensional gelatin chip coupled to TiC/C nanowire arrays microelectrode

Li, Lin-Mei, Wang, Xue-Ying, Hu, Liang-Sheng, Chen, Rong-Sheng, Huang, Ying, Chen, Shi-Jing, Huang, Wei-Hua, Huo, Kai-Fu, Chu, Paul K.

Journal:

Year:

2012

Language:

english

File:

PDF, 16.30 MB

english, 2012

41

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The application of the optimal design for twin die stacked package

Chen, Rong-Sheng, Huang, Chi-Huang, Xie, Yue-Zhe

Year:

2010

Language:

english

File:

PDF, 247 KB

english, 2010

42

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis

Lee, Ying-Chih, Wang, Bor-Tsuen, Lail, Yi-Shao, Yeh, Chang-Lin, Chen, Rong-Sheng

Year:

2008

Language:

english

File:

PDF, 4.98 MB

english, 2008

43

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls

Cheng, Hsin-En, Chen, Rong-Sheng, Mao, Chao-Yang

Journal:

Quality and Reliability Engineering International

Year:

2015

Language:

english

File:

PDF, 5.39 MB

english, 2015

44

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Packaging parameters analysis of stacked chip BGA with optimal equivalent solder for fatigue reliability optimization

Rong-Sheng Chen,, Hsin-En Cheng,, Chao-Yang Mao,

Year:

2010

Language:

english

File:

PDF, 2.30 MB

english, 2010

45

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Characterizations of ZnO thin films deposited onto langasite substrates by r.f. magnetron sputtering

Ping-Feng Yang,, Hua-Chiang Wen,, Sheng-Rui Jian,, Yi-Shao Lai,, Sean Wu,, Rong-Sheng Chen,

Year:

2007

Language:

english

File:

PDF, 1.41 MB

english, 2007

46

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Identification of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds using nanoindentation

Ping-Feng Yang,, Yi-Shao Lai,, Sheng-Rui Jian,, Jiunn Chen,, Rong-Sheng Chen,

Year:

2007

Language:

english

File:

PDF, 876 KB

english, 2007

47

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Optimal design of drop impact for TFBGA by concept of average stress within finite grid region

Rong-Sheng Chen,, Ray-Wen Wu,, Wen-Chi Liao,

Year:

2010

Language:

english

File:

PDF, 2.42 MB

english, 2010

48

The phase velocities of Rayleigh waves and the lateral variation of lithospheric structure in Tibetan Plateau

Guo-Ying Chen,Rong-Sheng Zeng,Francis T. Wu,Xiao-Lan Su

Journal:

Earthquake Science

Year:

1993

Language:

english

File:

PDF, 423 KB

english, 1993

49

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Nanotribological Characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Developed by Diffusion Couples

Yang, Ping-Feng, Jian, Sheng-Rui, Lai, Yi-Shao, Chen, Rong-Sheng

Year:

2008

Language:

english

File:

PDF, 3.25 MB

english, 2008

50

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Optimal design of dissipation for the array power LED by the genetic algorithm

Rong-Sheng Chen,, Chi-Huang Huang,, Zi-xuan Huang,

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012