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51

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Suppression of Spurious Resonance by Using Multistep Transmission Lines

Luo, Wen-Tsung, Lin, Wen-Jeng, Lee, Kuan-Te, Chen, Lih-Shan, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 1.12 MB

english, 2006

52

Numerical simulation of high power LED heat-dissipating system

Wu, Shih-Jeh, Hsu, Hsiang-Chen, Fu, Shen-Li, Yeh, Jiam-Nan

Journal:

Electronic Materials Letters

Year:

2014

Language:

english

File:

PDF, 723 KB

english, 2014

53

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Reliability and Thermal Structure Design for CMOS Image Sensor

Hsiang-Chen Hsu,, Hui-Yu Lee,, Yu-Chia Hsu,, Shen-Li Fu,, Chung-Chi Yang,, Kuan-Chieh Huang,

Year:

2005

Language:

english

File:

PDF, 2.89 MB

english, 2005

54

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - An investigation on secondary EFO copper wire - from a nanoscale perspective view

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Wang, Chen-Yi, Liu, Cheng-Che, Fu, Shen-Li, Bair, Miin Shyan

Year:

2012

Language:

english

File:

PDF, 691 KB

english, 2012

55

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Fu, Shen-Li

Year:

2011

Language:

english

File:

PDF, 767 KB

english, 2011

56

[IEEE 2009 IEEE International Workshop on Antenna Technology "Small Antennas and Novel Metamaterials" (iWAT) - Santa Monica, CA, USA (2009.03.2-2009.03.4)] 2009 IEEE International Workshop on Antenna Technology - Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array

Hsien-Chiao Teng,, Yen-ting Yang,, Shen Cherng,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2009

Language:

english

File:

PDF, 310 KB

english, 2009

57

Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates

Wu, Chung-Ming, Su, Shui-Hsiang, Wang, Hong-Tai, Yokoyama, Meiso, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

2011

Language:

english

File:

PDF, 694 KB

english, 2011

58

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate

Hsu, Hsiang-Chen, Wan, Yu-Ming, Haung, Chi-Hau, Fu, Shen-Li

Year:

2011

Language:

english

File:

PDF, 694 KB

english, 2011

59

The Back Story: Car Culture

Shen-Li Fu,, Kao-You Chao,

Journal:

Year:

2006

Language:

english

File:

PDF, 98 KB

english, 2006

60

[IEEE 1992 42nd Electronic Components & Technology Conference - San Diego, CA, USA (18-20 May 1992)] 1992 Proceedings 42nd Electronic Components & Technology Conference - Ceramic varistor fabricated by surface diffusion

Shen-Li Fu,, Kao-You Chao,

Year:

1992

Language:

english

File:

PDF, 414 KB

english, 1992

61

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Research and development of electronic packaging technology in Taiwan

Shen-Li Fu,, Rong-Shen Lee,, Chen, T.

Year:

2003

Language:

english

File:

PDF, 432 KB

english, 2003

62

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Welcome message from Shen-Li Fu, conference co-chair

Year:

2009

Language:

english

File:

PDF, 619 KB

english, 2009

63

[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor

Hsu, Hsiang-Chen, Lee, Hui-Yu, Hsu, Yu-Chia, Hu, Chin-Yuan, Lin, Ming-Jer, Chin, Pei-Chieh, Fu, Shen-Li, Chung, Mark C. L., Tseng, Ching-Chung

Year:

2006

Language:

english

File:

PDF, 5.64 MB

english, 2006

64

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique

Hsu, Hsiang-Chen, Hsu, Yu-Chia, Lee, Hui-Yu, Yeh, Chang-Lin, Lai, Yi-Shao, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 2.02 MB

english, 2006

65

[IEEE 1995 Japan International Electronic Manufacturing Technology Symposium - Omiya, Japan (4-6 Dec. 1995)] Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - A packaging system for built-in microcircuits in multilayer substrates

Yu-Jung Huang,, Fei-Chun Fang,, Kuo-Hong Hsiau,, Shen-Li Fu,

Year:

1996

Language:

english

File:

PDF, 296 KB

english, 1996

66

[IEEE 2013 2nd International Symposium on Instrumentation & Measurement, Sensor Network and Automation (IMSNA) - Toronto, ON, Canada (2013.12.23-2013.12.24)] 2013 2nd International Symposium on Instrumentation and Measurement, Sensor Network and Automation (IMSNA) - Application of a flow type quartz crystal microbalance immunosensor for detection of cartilage oligomeric matrix protein and α1-antitrypsin

Shen, Chi-Yen, Chiu, Yu-Chen, Huang, Ke-Nung, Fu, Shen-Li, Hwang, Rey-Chue

Year:

2013

Language:

english

File:

PDF, 332 KB

english, 2013

67

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics

Lih-Shan Chen,, Ming-Liang Hsieh,, Hsiang-Chen Hsu,, Shen-Li Fu,

Year:

2008

Language:

english

File:

PDF, 1.50 MB

english, 2008

68

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)

Hsiang-Chen Hsu,, Shen-Wen Ju,, Jie-Rong Lu,, Shen-Li Fu,

Year:

2009

Language:

english

File:

PDF, 1.78 MB

english, 2009

69

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad

Hsu, Hsiang-Chen, Fu, Chih-Chiang, Chang, Hong-Shen, Fu, Shen-Li, Kung, Huang-Kuang

Year:

2010

Language:

english

File:

PDF, 218 KB

english, 2010

70

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation

Hsiang-Chen Hsu,, Jih-Hsin Chien,, Li-Ming Chu,, Shin-Pon Ju,, Yu-Ting Feng,, Shen-Li Fu,

Year:

2012

Language:

english

File:

PDF, 798 KB

english, 2012

71

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Study of high dielectric constant capacitors on flexible substrates

Chang, Hung-Ming, Wu, Meng-Lun, Chen, Lih-Shan, Huang, Yu-Jung, Fu, Shen-Li

Year:

2010

Language:

english

File:

PDF, 201 KB

english, 2010

72

[IEEE 2007 International Conference on Electronic Materials and Packaging (EMAP 2007) - Daejeon, Korea (2007.11.19-2007.11.22)] 2007 International Conference on Electronic Materials and Packaging - Study of contact degradation in final testing for BGA socket

Hsien-Chiao Teng,, Ming-Kun Chen,, Chia-Hao Yeh,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2007

Language:

english

File:

PDF, 9.08 MB

english, 2007

73

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA

Chen, Ming-Kun, Huang, Yu-Jung, Hou, Shu-Jung, Chen, Yu-Hung, Yang, Chien-Kai, Fu, Shen-Li

Year:

2006

Language:

english

File:

PDF, 3.00 MB

english, 2006

74

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Fabrication and characterization of passive devices on flexible substrates

Pei-Ju Lin,, Hung-Ming Chang,, Ching-Chien Yuan,, Yu-Jung Huang,, Lih-Shan Chen,, Hsiang-Chen Hsu,, Shen-Li Fu,

Year:

2008

Language:

english

File:

PDF, 4.46 MB

english, 2008

75

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An investigation on nanoscale bondability between Cu-Al intermetallic compound

Hsu, Hsiang-Chen, Chien, Jih-Hsin, Wang, Chen-Yi, Chu, Li-Ming, Ju, Shin-Pon, Fu, Shen-Li, Bai, Miin Shyan

Year:

2013

Language:

english

File:

PDF, 933 KB

english, 2013

76

Processing and shape effects on silver paste electrically conductive adhesives (ECAs)

Chiang, Huann-Wu, Chung, Cho-Liang, Chen, Liu-Chin, Li, Yi, Wong, C. P., Fu, Shen-Li

Journal:

Journal of Adhesion Science and Technology

Year:

2005

Language:

english

File:

PDF, 2.45 MB

english, 2005

77

[IEEE 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) - Osaka (2013.7.3-2013.7.7)] 2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) - Temperature feedback based heating strategy for ultrasound thermal surgery

Kuen-Cheng Ju,, Shen-Li Fu,

Year:

2013

Language:

english

File:

PDF, 535 KB

english, 2013

78

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal design for high power arrayed LED heat-dissipating system

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Li, Jyun-Yi, Su, Jing-Wen, Huang, Jian-Siang, Fu, Shen-Li

Year:

2013

Language:

english

File:

PDF, 1.24 MB

english, 2013

79

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball

Hsu, Hsiang-Chen, Lu, Jie-Rong, Yue-Min Wan,, Fu, Shen-Li

Year:

2010

Language:

english

File:

PDF, 968 KB

english, 2010

80

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis

Hsu, Hsiang-Chen, Wu, Shih-Jeh, Hsu, Feng-Jui, Weng, Meng-Chieh, Fu, Shen-Li

Year:

2013

Language:

english

File:

PDF, 665 KB

english, 2013

81

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package

Hsu, Hsiang-Chen, Hsu, Yu-Teng, Hsich, Wen-Lo, Weng, Meng-Chieh, ZhangJian, Shao-Tang, Hsu, Feng-Jui, Chen, Yi-Feng, Fu, Shen-Li

Year:

2008

Language:

english

File:

PDF, 4.32 MB

english, 2008

82

[IEEE 2010 34th International Electronics Manufacturing Technology Conference (IEMT) - Melaka, Malaysia (2010.11.30-2010.12.2)] 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) - Advanced finite element model on Copper wire ball bonding

Hsu, Hsiang-Chen, Hong-Shen Chang,, Shu-Chi Tsao,, Fu, Shen-Li

Year:

2010

File:

PDF, 987 KB

2010

83

The Core-Shell Grain Resistance in the Reduced La-Doped (Ba, Sr)TiO 3 Ceramics

Ho, In-Chyuan, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

1990

File:

PDF, 1.06 MB

1990

84

[IEEE 2008 Asia Pacific Microwave Conference - Macau (2008.12.16-2008.12.20)] 2008 Asia-Pacific Microwave Conference - Application of organic thin film parasitic to patch antenna

Hsien-Chiao Teng,, Shen Cherng,, Anchi Yeh,, Yu-Jung Huang,, Shen-Li Fu,

Year:

2008

Language:

english

File:

PDF, 120 KB

english, 2008

85

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Floor plan design for 3D multi-layer substrate

Ching-Mai Ko,, Huang, Yu-Jung, Fu, Shen-Li

Year:

2009

Language:

english

File:

PDF, 1.42 MB

english, 2009

86

Effects of doping pairs on the preparation and dielectricity of PLZT ceramics

Fu, Shen-Li, Cheng, Syh-Yuh, Wei, Chung-Chuang

Journal:

Year:

1986

Language:

english

File:

PDF, 438 KB

english, 1986

87

Fabrication of perovskite Pb(Fe 1/2 Nb 1/2 )O 3 and reaction mechanism

Fu, Shen-Li, Chen, Gung-Fu

Journal:

Year:

1988

Language:

english

File:

PDF, 411 KB

english, 1988

88

Low-Temperature Sintering of Microwave Dielectrics (Zn,Mg)TiO 3

Hsieh, Ming-Liang, Chen, Lih-Shan, Wang, Shu-Ming, Sun, Chian-Hao, Weng, Min-Hung, Houng, Mau-Phon, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

2005

Language:

english

File:

PDF, 162 KB

english, 2005

89

Cosintering of Ni–Zn–Cu Ferrite with Low-Temperature Cofired Ceramic Substrates

Chen, Lih-Shan, Hsi, Chi-Shiung, Fu, Shen-Li, Lin, Jiuun-Yih

Journal:

Japanese Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 1.45 MB

english, 2000

90

[IEEE 40th Conference on Electronic Components and Technology - Las Vegas, NV, USA (20-23 May 1990)] 40th Conference Proceedings on Electronic Components and Technology - YBa/sub 2/Cu/sub 3/O/sub 6-x/-based thick film resistor

Fu Shen-Li,, Hsieh, Y.H.

Year:

1990

Language:

english

File:

PDF, 361 KB

english, 1990

91

Thermo-Hygro-Mechanical Design and Reliability Analysis for CMOS Image Sensor

Hsu, Hsiang-Chen, Lee, Hui-Yu, Hsu, Yu-Cha, Fu, Shen-Li

Journal:

Journal of Thermal Stresses

Year:

2008

Language:

english

File:

PDF, 1.47 MB

english, 2008

92

Low Temperature Sintering of P 2 O 5 -Added Cordierite Glass with Lead Borosilicate Glass

Chen, Lih-Shan, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

1992

Language:

english

File:

PDF, 344 KB

english, 1992

93

Characterization of Embedded Spiral Inductors in Co-Fired Ceramic Substrates

Chen, Lih-Shan, Hsi, Chi-Shiung, Fu, Shen-Li, Lin, Jiuun-Yih

Journal:

Japanese Journal of Applied Physics

Year:

2001

Language:

english

File:

PDF, 866 KB

english, 2001

94

Low Temperature Sintering of P 2 O 5 -Added Cordierite Glass with Borosilicate Glass

Fu, Shen-Li, Chen, Lih-Shan

Journal:

Japanese Journal of Applied Physics

Year:

1993

File:

PDF, 559 KB

1993

95

Densification and Dielectric Properties of Cordierite-Lead Borosilicate Glasses

Chen, Lih-Shan, Fu, Shen-Li

Journal:

Japanese Journal of Applied Physics

Year:

1992

Language:

english

File:

PDF, 236 KB

english, 1992

96

Barium Titanate-Based Capacitors Buried into Ceramic Substrates

Chen, Lih-Shan, Fu, Shen-Li, Huang, Kwan-Dar

Journal:

Japanese Journal of Applied Physics

Year:

1998

Language:

english

File:

PDF, 173 KB

english, 1998

97

Dielectric Properties of Internal Capacitors in Co-fired Ceramic Substrates

Chen, Lih-Shan, Fu, Shen-Li, Lin, Wen-Kuan, Huang, Kwan-Dar

Journal:

Japanese Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 786 KB

english, 2000

98

Characterization of Internal Capacitors Based on Glass-Added Barium Titanate

Chen, Lih-Shan, Fu, Shen-Li, Lin, Wen-Kuan, Huang, Kwan-Dar

Journal:

Japanese Journal of Applied Physics

Year:

2001

Language:

english

File:

PDF, 266 KB

english, 2001

99

[IEEE 4th International Symposium on Electronic Materials and Packaging - Kaohsiung, Taiwan (4-6 Dec. 2002)] Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - A study on the conductive behavior of copper filled pastes for microelectronic packaging substrates

Yung-Ssen Lin,, Sheng-Shiang Chiu,, Chi-Shung Shi,, Shen-Li Fu,

Year:

2002

Language:

english

File:

PDF, 393 KB

english, 2002

100

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Internal patterning of the glass backlight module for LCD panel by laser

Wu, Shih-Jeh, Hsu, Hsiang-Chen, Pin-Chieh Wang,, Fu, Shen-Li

Year:

2015

Language:

english

File:

PDF, 1.26 MB

english, 2015