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51

Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

P. T. Vianco, K. L. Erickson, P. L. Hopkins

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 924 KB

english, 1994

52

Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper

P. T. Vianco, A. C. Kilgo, R. Grant

Journal:

Journal of Electronic Materials

Year:

1995

Language:

english

File:

PDF, 2.70 MB

english, 1995

53

The active metal brazing of TZM-Mo and SiN ceramics

J. J. Stephens, P. T. Vianco, F. M. Hosking

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1996

Language:

english

File:

PDF, 1.71 MB

english, 1996

54

Issues in the replacement of lead-bearing solders

Paul T. Vianco, Darrel R. Frear

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1993

Language:

english

File:

PDF, 1.80 MB

english, 1993

55

Analysis of the endothermic peak in an annealed metallic glass

P.T. Vianco, J.C.M. Li

Journal:

Journal of Non-Crystalline Solids

Year:

1989

Language:

english

File:

PDF, 543 KB

english, 1989

56

P-129: Leuprolide acetate 0.2 cc with human chorionic gonadotropin to trigger ovulation as an effective method to decrease ovarian hyperstimulation syndrome pain without affecting the implantation rate in donor oocyte cycles

T.R. Nichtberger, M. Fisher, C.A. Brown, S.F. Frederick, T. Viancos, T.L. Ward

Journal:

Fertility and Sterility

Year:

2006

Language:

english

File:

PDF, 49 KB

english, 2006

57

Endometrial Thickness and Endometrial Patterns as Predictors of First Trimester Spontaneous Abortion (SpAb) in Pregnancies Achieved Through Intra-Uterine Insemination (IUI)

T.L Viancos, T.D Nichtberger, M.E Fusillo, S.K Frederick, V.L Schnell

Journal:

Fertility and Sterility

Year:

2000

Language:

english

File:

PDF, 29 KB

english, 2000

58

Nucleation and growth of tin whiskers

Cheng, Jing, Vianco, Paul T., Zhang, Bei, Li, James C. M.

Journal:

Applied Physics Letters

Year:

2011

Language:

english

File:

PDF, 944 KB

english, 2011

59

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - A new mechanism for Hillock formation over electrodeposited thin tin film

Jing Cheng,, Samuel Chen,, Vianco, Paul, Li, James C.M.

Year:

2008

Language:

english

File:

PDF, 3.41 MB

english, 2008

60

[IEEE Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Tokyo, Japan (1999.02.3-1999.02.3)] Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing - Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

Artaki, I., Noctor, D., Mather, J., Schroeder, S., Napp, D., Desantis, C., Desaulnier, W., Tsung-Yu Pan,, Felton, L., Palmer, M., Rosser, J., Felty, J., Vianco, P., Greaves, J., Whitten, G., Yun Zhu,

Year:

1999

Language:

english

File:

PDF, 26 KB

english, 1999

61

[IEEE 1996 46th Electronic Components and Technology Conference - Orlando, FL, USA (28-31 May 1996)] 1996 Proceedings 46th Electronic Components and Technology Conference - Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

Vianco, P., Rejent, J., Artaki, I., Ray, U., Finley, D., Jackson, A.

Year:

1996

Language:

english

File:

PDF, 1.79 MB

english, 1996

62

[IEEE 1992 IEEE Frequency Control Symposium - Hershey, PA, USA (27-29 May 1992)] Proceedings of the 1992 IEEE Frequency Control Symposium - Robust solder joint attachment of coaxial cable leads to piezoelectric ceramic electrodes

Year:

1992

Language:

english

File:

PDF, 791 KB

english, 1992

63

[IEEE 45th Annual Symposium on Frequency Control 1991 - Los Angeles, CA, USA (29-31 May 1991)] Proceedings of the 45th Annual Symposium on Frequency Control 1991 - Solder bond applications in a piezoelectric sensor assembly

Vianco, P.T., Rejent, J.A.

Year:

1991

Language:

english

File:

PDF, 1.43 MB

english, 1991

64

Equilibrium Cu-Ag nanoalloy structure formation revealed by in situ scanning transmission electron microscopy heating experiments

Lu, Ping, Chandross, Michael, Boyle, Timothy J., Clark, Blythe G., Vianco, Paul

Journal:

Year:

2014

Language:

english

File:

PDF, 1.05 MB

english, 2014

65

[IEEE 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces - San Jose, CA, USA (2007.10.3-2007.10.5)] 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces - Pull strength evaluation of Sn-Pb solder joints made to Au-Pt-Pd conductor on low-temperature co-fired ceramic

Vianco, P., Uribe, F., Zender, G.

Year:

2007

Language:

english

File:

PDF, 1.75 MB

english, 2007

66

[IEEE 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Tampa, FL, USA (2013.06.16-2013.06.21)] 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Accelerated life testing of PV arc-fault detectors

Johnson, Jay, Neilsen, Michael, Vianco, Paul, Sorensen, N. Rob, Montoya, Michael, Fresquez, Armando

Year:

2013

Language:

english

File:

PDF, 2.33 MB

english, 2013

67

Invited Article: A materials investigation of a phase-change micro-valve for greenhouse gas collection and other potential applications

R. P. Manginell, M. W. Moorman, J. A. Rejent, P. T. Vianco, M. J. Grazier, B. D. Wroblewski, C. D. Mowry, K. E. Achyuthan

Year:

2012

Language:

english

File:

PDF, 948 KB

english, 2012

68

[IEEE 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Tampa, FL, USA (2013.06.16-2013.06.21)] 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Use of the TurboSiP© software to predict the long-term reliability of solder joints on photovoltaic systems

Vianco, P., Holliday, M., Neilsen, M., Sorensen, R., Yang, B. B., Kilgo, A., Rejent, J., Grazier, M., Johnson, J., Granata, J.

Year:

2013

Language:

english

File:

PDF, 727 KB

english, 2013

69

Hollow tin/chromium whiskers

Cheng, Jing, Vianco, Paul T., Li, James C.M.

Journal:

Applied Physics Letters

Year:

2010

Language:

english

File:

PDF, 957 KB

english, 2010

70

[IEEE 44th Annual Symposium on Frequency Control - Baltimore, MD, USA (23-25 May 1990)] 44th Annual Symposium on Frequency Control - Resistivity, adhesive strength, and residual stress measurements of thin film metallizations on single crystal quartz

Vianco, P.T., Conley, W.R., Panitz, J.K.G.

Year:

1990

Language:

english

File:

PDF, 926 KB

english, 1990

71

Internal Jugular Venous Oxygen Tension as an Index of Cerebral Blood Flow During Carotid Endarterectomy

VIANCOS, J. G., SECHZER, P. H., KEATS, A. S., DEBAKEY, M. E.

Journal:

Year:

1966

Language:

english

File:

PDF, 1.37 MB

english, 1966

72

Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence

Vianco, Paul, Rejent, Jerome, Zender, Gary, Kilgo, Alice

Journal:

Journal of Materials Research

Year:

2005

Language:

english

File:

PDF, 3.17 MB

english, 2005

73

An overview of surface finishes and their role in printed circuit board solderability and solder joint performance

Vianco, Paul T.

Journal:

Year:

1999

Language:

english

File:

PDF, 315 KB

english, 1999

74

Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin Films

Vianco, P. T., Neilsen, M. K., Rejent, J. A., Grant, R. P.

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 6.53 MB

english, 2015

75

Microscopy of Solder Joint Failures Due to Gold Intermetallic Embrittlement

Susan, D, Vianco, P, Grant, R, Hlava, P, Kilgo, A, Zender, G

Journal:

Microscopy and Microanalysis

Year:

2005

Language:

english

File:

PDF, 503 KB

english, 2005

76

Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders

Vianco, Paul, Rejent, Jerome, Kilgo, Alice, Martin, Joseph

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 3.08 MB

english, 2006

77

Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

Vianco, Paul, Rejent, Jerome, Grazier, Mark, Kilgo, Alice

Journal:

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012

78

Effect of tensile stress on the annealed structure of a metallic glass

Vianco, P. T., Li, J. C. M.

Journal:

Journal of Materials Research

Year:

1987

Language:

english

File:

PDF, 828 KB

english, 1987

79

Reproductive Biology of Striated Heron ( Butorides striata ) in Argentina

Olguín, Pamela, Beltzer, Adolfo, Giraudo, Alejandro, Regner, Silvia, Juani, Marcelo, Vianco, Mercedes, Mariano, Emiliano, Lorenzón, Rodrigo, Leon, Evelina

Journal:

Year:

2015

Language:

english

File:

PDF, 180 KB

english, 2015

80

The Interface Metallurgy of Soldered Interconnections for Electronics Packaging Applications

Susan, Donald, Vianco, Paul, Kilgo, Alice

Journal:

Microscopy and Microanalysis

Year:

2004

Language:

english

File:

PDF, 461 KB

english, 2004

81

Thermal Fatigue and Failure Analysis of Cu-Plated Through Hole Solder Joints

Susan, DF, Kilgo, AC, Vianco, PT, Neilsen, MK

Journal:

Microscopy and Microanalysis

Year:

2009

Language:

english

File:

PDF, 476 KB

english, 2009

82

Scavenging of Ti by Fe-Ni-Co in Ag-Cu-Ti Active Metal Braze Joints

Hlava, P F, Vianco, P T, Stephens, J J

Journal:

Microscopy and Microanalysis

Year:

2005

Language:

english

File:

PDF, 374 KB

english, 2005

83

Failure Analysis of Crimp Connectors

Vianco, P, Kilgo, A, Grant, R

Journal:

Microscopy and Microanalysis

Year:

2011

Language:

english

File:

PDF, 17.09 MB

english, 2011

84

SIMPLIFIED METHOD FOR MONITORING ADEQUACY OF BRAIN OXYGENATION DURING CAROTID-ARTERY SURGERY

CLAUSS, R. H., HASS, W. K., RANSOHOFF, J., VIANCOS, J. G., KEATS, ARTHUR S.

Journal:

Survey of Anesthesiology

Year:

1966

File:

PDF, 297 KB

1966

85

Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling

Susan, Donald F., Kilgo, Alice C., Neilsen, Michael K., Vianco, Paul T.

Journal:

International Journal of Materials and Structural Integrity

Year:

2008

Language:

english

File:

PDF, 1.71 MB

english, 2008

86

Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys

Vianco, Paul, Rejent, Jerome, Grant, Richard

Journal:

MATERIALS TRANSACTIONS

Year:

2004

Language:

english

File:

PDF, 874 KB

english, 2004

87

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

Neilsen, Michael, Vianco, Paul

Year:

2013

Language:

english

File:

PDF, 1.57 MB

english, 2013

88

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 8: Mechanics of Solids, Structures and Fluids; Vibration, Acoustics and Wave Propagation - Unified Creep Plasticity Damage (UCPD) Model for Solder

Neilsen, Michael, Vianco, Paul

Year:

2011

Language:

english

File:

PDF, 769 KB

english, 2011

89

Reference Module in Materials Science and Materials Engineering || Electronic Packaging: Solder Mounting Technologies

Year:

2016

Language:

english

File:

PDF, 933 KB

english, 2016

90

Encyclopedia of Materials: Science and Technology || Electronic Packaging: Solder Mounting Technologies

Year:

2001

Language:

english

File:

PDF, 790 KB

english, 2001

91

Fabricación de vidrios metálicos base cobre: evolución de las fases durante el procesode aleación mecánica

Rojas, Paula, Martínez, Carola, Viancos, Francisco, Aguilar, Claudio, Guzmán, Danny, Zelaya, Eugenia

Journal:

Matéria (Rio de Janeiro)

Year:

2015

File:

PDF, 985 KB

2015

92

Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Vianco, Paul T., McKenzie, Bonnie B., Rejent, Jerome A., Grazier, J. Mark, Jaramillo, Celedonio E., Kilgo, Alice C.

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 2.80 MB

english, 2019

93

Mitigation of Long Whisker Growth Based upon the Dynamic Recrystallization Mechanism

Vianco, P. T., Cummings, D. P., Kotula, P. G., McKenzie, B. M., Lowery, L. M., Williams, S., Banga, D.

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 9.99 MB

english, 2019